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7618165 |
LED lamp unit
There is provided an LED lamp unit comprising an LED lamp, a protective component for an LED lighting circuit, a circuit section and a case part, characterized in that the circuit section has a...
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7538441 |
Chip with power and signal pads connected to power and signal lines on substrate
A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding...
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7532484 |
Electronic component assembly
An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make...
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7449370 |
Production process for manufacturing such semiconductor package
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
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7425756 |
Semiconductor device and electronic device
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
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7391101 |
Semiconductor pressure sensor
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The...
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7332757 |
MOSFET package
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
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7307339 |
Semiconductor device having curved leads offset from the center of bonding pads
A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip...
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7167377 |
Circuit-constituting unit and method of producing the same
A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor...
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7150387 |
Process and apparatus for flow soldering
An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt...
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7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a...
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7113408 |
Contact grid array formed on a printed circuit board
A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion...
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7084490 |
Leads under chip IC package
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of...
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7068520 |
Circuit board made of resin with pin
In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a...
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7064420 |
Integrated circuit leadframe with ground plane
A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at...
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7045720 |
Component lead system
A system may include an electronic component body, and one or more leads coupled to and extending from the electronic component body. A first lead of the one or more leads may comprise a first leg...
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6940013 |
Surface mounting a power converter
A power converter includes electrical contacts arranged on a first surface and a connection device. The converter has a top surface above the first surface and a bottom surface below the first...
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6939740 |
Method of fabricating an encapsulated semiconductor device with partly exposed leads
A resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package...
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6912781 |
Method of manufacturing electronic packaging device with insertable leads
A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is...
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6911736 |
Electrostatic discharge protection
A package substrate that is adapted to receive at least one subject integrated circuit having a subject contact pattern, where the subject integrated circuit is selected from a design set of...
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6909168 |
Resin encapsulation semiconductor device utilizing grooved leads and die pad
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads...
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6897378 |
Technique for surface mounting electrical components to a circuit board
A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion...
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6870261 |
Discrete circuit component having an up-right circuit die with lateral electrical connections
A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit...
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6862189 |
Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device
An electronic component including an element main body section for performing an electrical function and a terminal section for electrically connecting the element main body section to a conductive...
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6800932 |
Package for semiconductor die containing symmetrical lead and heat sink
A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom...
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6791842 |
Image sensor structure
An image sensor includes a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and...
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6788547 |
Method of making electrical contact device
The invention provides an electrical contact device, a pre-assembly for producing the electrical contact device, and a method of forming the electrical contact device. The electrical contact device...
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6778406 |
Resilient contact structures for interconnecting electronic devices
Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the...
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6764325 |
Zero insertion force heat-activated retention pin
The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate...
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6717822 |
Lead-frame method and circuit module assembly including edge stiffener
An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may...
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6717066 |
Electronic packages having multiple-zone interconnects and methods of manufacture
To accommodate thermal stresses arising from different coefficients of thermal expansion (CTE) of a packaged or unpackaged die and a substrate, the package incorporates two or more different...
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6713849 |
Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin
In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and...
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6713836 |
Packaging structure integrating passive devices
In a leadframe packaging structure, a leadframe includes a plurality of first leads, a plurality of second leads, and a die pad. The first leads define a chip-bonding region in which is arranged...
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6705006 |
Method for replacing an electrical net on a printed circuit board
Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate...
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6704210 |
Bioprothesis film strip for surgical stapler and method of attaching the same
A bioprosthesis sealing film strip is attached to a surgical stapler by passing a jaw of the stapler through openings formed in the ends of the strip. Following stapling the strip is released by...
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6690583 |
Carrier for electronic components
A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low...
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6675471 |
Method of producing high-frequency modules
A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub...
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6665930 |
Printed circuit board with SMD components
A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection...
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6657135 |
Connection structure and electronic circuit board
A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component...
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6617522 |
Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of...
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6617510 |
Stress relief bend useful in an integrated circuit redistribution patch
A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to...
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6612024 |
Method of mounting a device to a mounting substrate
A semiconductor device with bump electrodes having acutely shaped tips and method of mounting same. The bump electrodes are brought into contact with respective portions of a conductive pattern of...
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6570774 |
Capacitor module for use in inverter, inverter, and capacitor module
The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path...
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6518517 |
Circuit board having a through hole having an insulating material inside and a conductive element
Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate...
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6507496 |
Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component
A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different...
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6492737 |
Electronic device and a method of manufacturing the same
An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed...
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6483178 |
Semiconductor device package structure
A semiconductor device package structure is proposed, which allows the encapsulation body to be highly secured in position to the leads, making the encapsulation body hardly delaminated from the...
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6452808 |
Electronics module having power components, and a method of manufacture
A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the...
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6452802 |
Symmetrical package for semiconductor die
A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom...
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6449838 |
Method of mounting a semiconductor device to a substrate
This invention mounts a semiconductor device having a plurality of electrodes to a substrate. A bump electrode having a pointed tail is formed on the electrode. The concave mounting pad is formed...
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