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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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7612648 |
Disc varistor and method of manufacturing the same
Disclosed herein are a disc varistor having a capability to absorb a double amount of surge and a method of manufacturing the varistor. The varistor includes a disc-shaped first ceramic body having...
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7609527 |
Electronic module
An electronic module in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the surface of the insulating-material layer. The conductive...
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7606048 |
Integrated circuit stacking system
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of...
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7602615 |
In-grid decoupling for ball grid array (BGA) devices
A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein...
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7602613 |
Thin module system and method
A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts....
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7586754 |
Printed wiring board and process for manufacturing the same
The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by...
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7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
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7573722 |
Electronic carrier board applicable to surface mounted technology (SMT)
An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7548431 |
Optically connectable circuit board with optical component(s) mounted thereon
An optically connectable circuit board and optical components mounted thereon. At least one component includes optical transceivers and provides an optical connection to the board. Electronic...
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7542303 |
Printed circuit board
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7535729 |
Optoelectronic system and method for its manufacture
An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond...
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7532483 |
Mounting integrated circuit dies for high frequency signal isolation
A method of connecting signal lines between an integrated circuit (IC) die and a carrier or external circuit, and corresponding apparatus. Techniques for adjusting magnetic coupling between...
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7528325 |
Key sheet module
A key sheet module comprising a single-sided printed wiring board including a front surface on which a plurality of wiring patterns are provided and a plurality of holes provided at predetermined...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7523551 |
Manufacturing method of a multi-layer circuit board embedded with a passive component
A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points;...
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7522425 |
High capacity thin module system and method
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7499288 |
Surface mounting semiconductor device
In accordance with one example of the disclosed subject matter, a semiconductor device can include the following features. A first lead frame can be provided that has one end configured to form a...
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7495928 |
Semiconductor device and printed circuit board
For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an...
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7495927 |
Mount structure, electro-optical device, and electronic apparatus
A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections...
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7489518 |
Multileveled printed circuit board unit including substrate interposed between stacked bumps
Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate...
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7489517 |
Die down semiconductor package
A semiconductor package is disclosed for an integrated circuit die ( 52 ). The integrated circuit die is electrically connected to the package substrate by either die solder balls ( 53 a ), or...
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7488898 |
Land structure, printed wiring board, and electronic device
A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side....
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7488896 |
Wiring board with semiconductor component
An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a...
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7480151 |
Wiring board and method of manufacturing the same
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
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7474536 |
Audio sound quality enhancement apparatus and method
An audio enhancement apparatus includes a thermally insulating container and a substrate mounted at least partially within the thermally insulating container. A heat source is provided within the...
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7465885 |
Circuit carrier and package structure thereof
A circuit carrier is provided. The circuit carrier includes a substrate, a patterned circuit layer, and a solder mask layer. The patterned circuit layer is deposed on a surface of the substrate and...
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7465883 |
Plate-reinforced wiring circuit board
The object of the present invention is to provide a plate-reinforced wiring circuit board in which the tearing occurring upon flexing can be sufficiently prevented. The present invention relates to...
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7459773 |
Stackable ball grid array
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball...
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7450395 |
Circuit module and circuit device including circuit module
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between....
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7446403 |
Carrier structure stacking system and method
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
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7436682 |
Wiring board, electronic component mounting structure, and electronic component mounting method
A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are...
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7436063 |
Packaging substrate and semiconductor device
A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the...
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7435910 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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7433201 |
Oriented connections for leadless and leaded packages
The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating...
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7433197 |
Electronic module and method for sealing an electronic module
A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (“PCB”) with electronic components, an integral...
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7414317 |
BGA package with concave shaped bonding pads
In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish...
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7408241 |
Semiconductor device with a recessed bond pad
A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7394665 |
LSI package provided with interface module and method of mounting the same
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal...
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7379307 |
Wiring board and method for manufacturing the same, and semiconductor device
A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads...
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7375974 |
Electronic device
A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members...
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7375432 |
Via attached to a bond pad utilizing a tapered interconnect
An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed...
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7371975 |
Electronic packages and components thereof formed by substrate-imprinting
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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