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Match Document Document Title
7619316 Semiconductor package and method for manufacturing the same  
A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal...
7615705 Enhanced-reliability printed circuit board for tight-pitch components  
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
7606047 Module with embedded electronic components  
In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are...
7599190 High-frequency module, and method of producing same  
A high-frequency module having a communication function is provided which includes a base substrate block ( 2 ) formed from organic substrates ( 11, 12 ), the organic substrate ( 11 ) having wiring...
7599168 Active balancing modular circuits  
Provided are active balancing modules that control voltage imbalances between capacitors stacked in a series arrangement and methods for their manufacture. These modules are simple and inexpensive...
7599167 Active balancing circuit modules, systems and capacitor devices  
Circuit modules, systems and devices for controlling voltages across capacitors.
7594105 Multilayer print circuit board  
This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print...
7586756 Split thin film capacitor for multiple voltages  
An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful...
7586755 Electronic circuit component  
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small...
7586754 Printed wiring board and process for manufacturing the same  
The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by...
7583512 Printed circuit board including embedded passive component  
Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one...
7580269 Apparatus for supplying power to a semiconductor device using a capacitor DC shunt  
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion...
7539022 Chip embedded packaging structure  
A chip embedded packaging structure includes a first metal board, a second metal board having at least a through cavity, in which the second metal board is disposed on the upper surface of the...
7529102 Wiring substrate, electronic device, electro-optical device, and electronic apparatus  
The invention achieves stable performance, such as low parasitic capacitance generated at conductive components. Components having a low dielectric constant of 4 or less are disposed on a base...
7525814 Wiring board and method for manufacturing the same  
A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed...
7508680 Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate  
An adjustable-inductance (AI) filter, a tape distribution substrate including the filter, and a display panel assembly including the tape distribution substrate are provided. The...
7489517 Die down semiconductor package  
A semiconductor package is disclosed for an integrated circuit die ( 52 ). The integrated circuit die is electrically connected to the package substrate by either die solder balls ( 53 a ), or...
7466560 Multilayered printed circuit board  
A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to...
7457100 Capacitor device and wiring pattern  
A capacitor device is provided which includes a plurality of electric double-layer capacitors connected in series, and a balance resistor portion where five resistors having an equivalent...
7441329 Fabrication process circuit board with embedded passive component  
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
7440289 Memory module  
A memory module includes a memory chip MC 1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC 3 disposed at a position not opposite to the memory buffer...
7436681 Wiring board with built-in capacitor  
The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors...
7430128 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof  
This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the...
7342804 Ball grid array resistor capacitor network  
An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized...
7342803 Printed circuit board and method of manufacturing printed circuit board  
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to...
7342768 Active balancing modular circuits  
Provided are active balancing modules that control voltage imbalances between capacitors stacked in a series arrangement and methods for their manufacture. These modules are simple and inexpensive...
7339798 Electronic assemblies and systems comprising interposer with embedded capacitors  
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the...
7317622 Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt  
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion...
7315455 Surface-mounted electronic component module and method for manufacturing the same  
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available....
7294933 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment  
A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the...
7286367 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board  
A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined...
7286366 Multilayer circuit board with embedded components and method of manufacture  
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
7262951 De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits  
A de-coupling capacitor module using dummy conductive elements in an integrated circuit is disclosed. The de-coupling module comprises at least one circuit module having one or more active nodes,...
7239524 Resistive element apparatus and method  
A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point...
7209362 Multilayer ceramic substrate with a cavity  
A multilayer ceramic substrate with a cavity includes a multilayer composite member including a plurality of ceramic layers disposed one on another. A cavity is formed in the multilayer composite...
7200010 Impedance qualization module  
A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are...
7190592 Integrated library core for embedded passive components and method for forming electronic device thereon  
An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of...
7168150 Method of making a resonant frequency tag  
A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a...
7149091 Electronic circuit device  
An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with...
7076858 Method for controlling resonant tag frequency  
A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end...
7024764 Method of making an electronic package  
A method of making an electronic package. The method includes forming a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact...
6995984 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly  
The invention relates to an electronic assembly, in particular for low power consumption electric switching devices such as low power contactors, time relays or the like. In order to provide...
6975517 Embedded preemphasis and deemphasis circuits  
Exemplary techniques for providing an embedded preemphasis circuit and/or a deemphasis circuit in a printed circuit board (PCB) or other circuit device are disclosed. In particular, a technique for...
6925701 Method of making a series of resonant frequency tags  
A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a...
6920051 Hybrid capacitor, circuit, and system  
A hybrid capacitor associated with an integrated circuit package provides multiple levels of excess, off-chip capacitance to die loads. The hybrid capacitor includes a low inductance, parallel...
6882544 Printed circuit board, method for producing same and semiconductor device  
A thin type printed circuit board with an enclosed capacitor of a large capacitance. The printed circuit board includes metal sheet 11 having roughed surface presenting micro-irregularities, a...
6876554 Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board  
Chip capacitors 20 are provided in a printed circuit board 10 . In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is...
6835994 Power semiconductor module  
A power semiconductor module contains a power component and a sensor component. The power component is disposed on a first substrate. The sensor component is electrically and/or mechanically...
6801439 Multiple network electronic component  
A multiple network electronic component includes an insulator having a first element-forming surface and a second element-forming surface spaced thicknesswise from the first element-forming...
6801438 Electrical circuit and method of formation  
A process for forming a circuit pattern on a substrate includes steps of forming a number of electrical circuits on a substrate, which circuits include an electrically conductive bus that...
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