Matches 201 - 250 out of 311 < 1 2 3 4 5 6 7 >
Match Document Document Title
4786523 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals  
In a wired substrate, a conductive pattern is formed of an alloy of gold, a base metal, and a noble metal and is contiguous to an insulating layer of a mixture of oxides of the base and the noble...
4782381 Chip carrier  
A chip carrier for carrying integrated circuit chips is provided. Instead of placing individual circuit components either in the chips or next to them, the components are placed in or near the...
4780795 Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture  
A dual cavity semiconductor package containing a high voltage (greater than 1500 volts) isolation amplifier includes a ceramic substrate with tungsten metalization thereon defining die bonding and...
4777718 Method of forming and connecting a resistive layer on a pc board  
A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. A substrate having a bi-metallic cladding on one side of the substrate and a...
4778552 Alarm tag and method of making and deactivating it  
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral...
4746392 Method for producing an identification card with an integrated circuit  
A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using...
4717438 Method of making tags  
This invention relates to a tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors...
4714952 Capacitor built-in integrated circuit packaged unit and process of fabrication thereof  
A capacitor built-in integrated circuit packaged unit comprising an electrically conductive support member, first and second lead elements associated with the conductive support member, a stack of...
4703392 Microstrip line and method for fabrication  
A method for fabricating a microstrip resonator line permitting precise control of line width, edge definition and thickness. On a substrate, there is printed a first conductive layer having a...
4697159 Tuning capacitors with selectable capacitance configurations for coupling between microwave circuits  
A tuning capacitor arrangement for a microwave circuit including, on a substrate, first and second conductors to be capacitively joined. The tuning capacitor arrangement includes first and second...
4685030 Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits  
A surface mounted circuit is disclosed. The circuit includes an insulating substrate, a chemical vapor deposited interconnect layer of conductive metal, as Cr, Fe, Co, Ni, W, Mo, Mn or mixtures...
4675790 Three terminal electrolytic capacitor for surface mounting  
Encapsulated three terminal polar electrolytic capacitor device suitable for surface mounting on circuit board or other flat substrate and not vulnerable to reverse circuit connection.
4675786 Flexible circuit board and method of making the same  
A flexible circuit board and method of making the same is presented wherein the circuit board includes conductive through-holes for installation of components and includes a sloping electrolytic...
4672421 Semiconductor packaging and method  
A mounting means for a semiconductor integrated circuit, the mounting means comprising a semiconductor material having a mounting surface as one major surface thereof, a semiconductor integrated...
4670351 Flexible printed circuits, prepared by augmentation replacement process  
The present invention provides flexible printed circuits prepared by (i) applying a design on a silicone-impregnated fabric substrate with a printing ink comprising a mixture of (a) a curable...
4665468 Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same  
A multi-layer comprising a multi-layer glass ceramic substrate and a multi-layer wire line matrix. The multi-layer wired line matrix includes an insulating layer made from a photosensitive...
4652848 Fusible link  
A fusible link for an electrical circuit consists of a length of fusible material which closely fits an aperture through a ceramic printed circuit board. Ends of the fusible element electrically...
4641114 Thick film delay line comprising a plurality of stacked delay assemblies formed by a printing process  
The thick film delay line of the present invention comprises a substrate having a plurality of conductive pads mounted along the edge thereof. A plurality of delay circuit assemblies are stacked on...
4639830 Packaged electronic device  
An electronic device having a thick film interconnection substrate of a multilayer configuration having a major surface on which conductor patterns for mounting thereon IC chips or the like...
4630171 Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members  
The invention relates to a support (100) for a high-speed component (30) in particular a hyperfrequency component. The support is in the form of a stack of high dielectric constant ceramic sheets...
4614837 Method for placing electrically conductive paths on a substrate  
A process for placing conductive paths on to the surface of a heat softenable substrate by applying a layer of metal powder to the substrate, compacting the powder in a pre-determined pattern by...
4552300 Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards  
A method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring...
4539622 Hybrid integrated circuit device  
A hybrid integrated circuit device comprising in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer...
4532620 Coil assembly having stacked spiral pattern layers and method of making  
A coil assembly comprises a plurality of conductive spiral pattern layers which are piled up via (an) insulating layer(s) on a wafer. The electrical connection between the spiral patterns is...
4437140 Printed circuit device  
A printed circuit device comprises a ceramic base plate and a circuit pattern layer which is constituted of electric conductor layers and insulating layers in alternate laminar stacked arrangement...
4400762 Edge termination for an electrical circuit device  
An electrical circuit device having a ceramic substrate including a thick or thin film circuit on at least one surface thereof and an intersecting edge surface which may support termination leads...
4372475 Electronic assembly process and apparatus  
A system of composition, apparatuses and process provides for a rapid and reliable development and location of a web fabric structure to position and hold each member of a closely spaced assembly...
4369557 Process for fabricating resonant tag circuit constructions  
An insulative substrate web having a conductive surface on a first face is printed and etched to provide a repetitive conductive circuit pattern. In one form of the invention, the pattern defines a...
4345300 Recessed circuit module  
A circuit module (10) having a row of connector pins (21) and being approximately 4mm. thick or less, and including an electrical circuit (22) connected to the connector pins (21). In prior art...
4326239 Printed circuit board  
A printed circuit board includes an insulating board; at least one pair of conductive patterns arranged on the insulating board and spaced from each other by a predetermined length; and a paint...
4313152 Flat electric coil  
A miniaturized electric coil having a low self-capacitance comprises a bottom conductor pattern provided on a substrate, an insulating intermediate layer and a top conductor pattern which is...
4313151 Flat electric coil with tap  
A miniaturized electric coil having a center tap which is constructed from a spiral-like bottom conductor pattern provided on a substrate, an insulating intermediate layer and a spiral-like top...
4296272 Composite substrate  
An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer...
4294009 Method of manufacturing a hybrid integrated circuit  
A hybrid integrated circuit having a partially enamelled steel support. The process starts with an unprocessed steel plate 20 which is first treated to allow bonding of a coat of enamel. Before...
4288840 Printed circuit board  
An improved printed circuit board for use in electrical and electronic appliances includes an electronic part for a jumper having crossover wiring and disposed on an electrically insulative...
4242720 Integrated circuit mounting board having internal termination resistors  
A logic card for interconnection of integrated circuits comprises a laminate for supporting integrated circuit devices. The laminate includes a relatively highly conductive layer. A selected...
4221925 Printed circuit board  
A printed circuit board is disclosed which comprises a metal substrate having a first coating thereon and through holes through said coating and substrate with non-linear, undercut walls and a...
4220810 Printed wiring board  
A new and unique printed wiring board completely free from trouble of solder bridging that often takes place with the conventional printed wiring board. The printed wiring board of the present...
4214212 Tuner device for a television receiver  
A tuning device for a television receiver in which the electrical components are largely formed by thick film deposition techniques on a ceramic support plate. The tuning device includes a...
4208698 Novel hybrid packaging scheme for high density component circuits  
A hybrid solid state package in which integrated circuits, precision resistor networks, capacitors and their interconnections are accommodated on a multi-layer process substrate while thick film...
4187529 Terminal construction for electrical circuit device  
An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the...
4174531 Printed circuit board with increased arc track resistance  
This invention pertains to increasing the arc track resistance of printed circuit boards by applying an acrylic resin to the printed circuit board wherein the acrylic resin is a polymer having the...
4129390 Stacked blade matrix printer heads  
A printer head for use in an impact printer of the dotmatrix type utilizes a stack of pivoted thin blades, each having a printing tip at one end thereof. A pancake coil is attached to each blade...
4127934 Method of making terminal construction for electrical circuit device  
An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the...
4109297 Conduction system for thin film and hybrid integrated circuits  
A metallization scheme for interconnection of elements in thin film and hybrid circuits is described. A thin layer of titanium is first formed, preferably by evaporation or sputtering, on the...
4051550 Thick film integrated circuits  
A thick film integrated circuit comprises a ceramic substrate, conductors formed on one surface of the ceramic substrate, circuit components mounted on the one surface of the ceramic substrate, a...
4021705 Resonant tag circuits having one or more fusible links  
A planar resonant tag circuit especially useful in electronic security systems wherein the value of a circuit component can be electrically and selectively altered by one or more fusible links...
4010488 Electronic apparatus with optional coupling  
In the manufacture of certain types of electronic devices, a plurality of leads are simultaneously bonded in side-by-side relation to a corresponding number of "active" bonding sites or pads on a...
3967161 A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination  
An electronic security system adapted for use in a controlled area such as a retail store and employing a multi-frequency resonant tag circuit having distinct frequencies for detection and...
3947956 Multilayer thick-film hybrid circuits method and process for constructing same  
A method and process of screening multilayer thick-film structures to produce complex hybrid electronic circuits. After deposition, drying and firing of the first conductor plane on the substrate,...
Matches 201 - 250 out of 311 < 1 2 3 4 5 6 7 >