Matches 151 - 200 out of 311 < 1 2 3 4 5 6 7 >
Match Document Document Title
5729439 Printed wiring substrate  
A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of...
5706181 Sensor unit for controlling an occupant protection system of a motor vehicle  
A sensor unit for controlling an occupant protection system has a sensor which is held in its position on a printed circuit board through the use of an elastic damping holder. The damping holder is...
5706180 Electronic device protected from shocks by encapsulation  
An electronic device (1) includes a set of boards (2) carrying electronic components (3). The boards are mounted so as to be separated from and parallel to one another. The electronic device (1) is...
5663530 Wire bond tape ball grid array package  
A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is...
5656862 Solder interconnection structure  
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor...
5644207 Integrated power source  
A self-contained, small, lightweight, portable, renewable, modular integrated power source. The power source consists of solar cells that are laminated onto a solid state polymer battery which in...
5633785 Integrated circuit component package with integral passive component  
A high-performance, high-density integrated circuit component package includes an IC chip having a plurality of IC bond pads and an interconnect substrate overlying the IC chip. The interconnect...
5622769 Ceramic circuit board having a thermal conductivity substrate  
According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and...
5617298 Collinear terminated transmission line structure  
A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors....
5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant  
An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example,...
5576517 Low Dielectric constant materials for high speed electronics  
An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and...
5563380 Apparatus for mounting integrated circuit chips on a Mini-Board  
An apparatus and method for mounting and connecting a plurality of integrated circuit chip dice to a printed circuit substrate by means of a small circuit board (such as a Mini-Board) that may be...
5558795 Module encapsulation by induction heating  
An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high...
5508684 Article tag  
The tag circuit system uses resonant circuit technology in conjunction with an insulative substrate and conductive ink or metal conductor to permit the tag to be sewn into the clothing, protecting...
5495395 Face-mounting type module substrate attached to base substrate face to face  
A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other...
5493259 High voltage, low pass filtering connector with multiple ground planes  
The invention provides improved high voltage, low pass filtering connectors. The connectors described herein comprise an assembly having a low impedance path to ground for use in the connector. The...
5488200 Interconnect structure with replaced semiconductor chips  
A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are...
5467253 Semiconductor chip package and method of forming  
A semiconductor device having a substrate support (22) and a method of forming the semiconductor device. A substrate (11) has conductive traces (12) and a bonding pad (13) on a bottom surface and...
5461545 Process and device for hermetic encapsulation of electronic components  
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a...
5394304 Shielded self-molding package for an electronic component  
An electromagnetically shielded self-molding package for an electronic component comprises a pair of bags having an electrically conductive coating therebetween and disposed about the component and...
5392197 Moisture proof of electric device for motor vehicles  
The electric device has a printed circuit board (10) which carries an electronic circuit with electronic components (12). The circuit is provided with a plug connector strip (14) for making...
5388029 Semiconductor chip carrier capable of stably mounting a semiconductor chip  
In a semiconductor chip carrier which has a rectangular insulating substrate having four corners and electrode leads deposited on a peripheral surface of the substrate and which is mounted onto a...
5383093 Hybrid integrated circuit apparatus  
A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as...
5381306 Method and apparatus for delivering power using a multiplane power via matrix  
Disclosed is an apparatus and method for delivering power utilizing a multiplane power via matrix wherein the vias are each interconnected on each of the planes through which they pass such that a...
5365402 Cooling apparatus of electronic device  
A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer...
5345365 Interconnection system for high performance electronic hybrids  
An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits....
5315484 Printed circuit board and method for attaching movable switch thereto  
A printed circuit board is provided with two soldering land portions on respective lead lines. Each of the soldering land portions has two sub-soldering land portions and a narrow connecting...
5311405 Method and apparatus for aligning and attaching a surface mount component  
A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702)...
RE34395 Method of making a chip carrier with terminating resistive elements  
A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The...
5250848 Solder interconnection structure  
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing...
5251108 Laminated electronic device with staggered holes in the conductors  
A laminated electronic device wherein internal conductors are connected electrically through through holes For each connection of the conductors, at least two through holes are formed for providing...
5243320 Resistive metal layers and method for making same  
Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards....
5153385 Transfer molded semiconductor package with improved adhesion  
A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an...
5144536 Electronic circuit substrate  
An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed...
5136366 Overmolded semiconductor package with anchoring means  
An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding...
5122620 Chip carrier with terminating resistive elements  
A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The...
5119272 Circuit board and method of producing circuit board  
A circuit board includes an insulative ceramic substrate, electrode portions and wiring portions formed on the ceramic substrate by selectively removing portions of a conductor layer plated on said...
5107325 Structure and method of packaging a semiconductor device  
A semiconductor device comprises a semiconductor chip with an active surface having output bonding pads to which a plurality of conductive leads or finger contacts are attached via a TAB method and...
5083237 Electronic parts and electronic device incorporating the same  
In the inventive electronic parts, external leads are installed at a board on which a multilayer capacitor is mounted, external leads being electrically connected with terminal electrodes of the...
5065502 Method for modifying electrical performance characteristics of circuit paths on circuit panels  
The present invention disclosures a method of printing an electrical component onto a substrate to join a pair of circuit path elements to complete a circuit path to modify the electrical...
5055913 Terminal arrangement for integrated circuit device  
An integrated circuit includes electrically conductive terminals arranged to be connected to external leads for communication between the leads and the circuitry of the integrated circuit device....
4980798 Cuffed tape wrap and fill wound capacitor  
A wrap and fill capacitor having a cuffed tape outer wrapping is provided. The cuff comprises a thin conductive foil folded about the edges of a high temperature resistant dielectric tape. The...
4954814 Tag and method of making same  
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral...
4949065 Resistor composition, resistor produced therefrom, and method of producing resistor  
A resistor composition containing no boride powder is obtained by mechanical grinding of at least one of silicon, silicon monoxide and higher oxidation state precursor of silicon monoxide; and a...
4864471 Component for surface mounting and method for fastening a component for surface mounting  
A component for surface mounting is fixed by means of adhesive to a surface of a member. For improving the adhesion, the fixable surface of the component includes a structure which makes it...
4855866 Capacitor network  
A capacitor network is provided for noise elimination on the input/output terminals of an electric computer or the like. A plurality of data electrodes are disposed on one surface of a dielectric...
4846922 Method of making deactivatable tags  
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral...
4839775 Thick-film circuit arrangement having a ceramic substrate plate  
The invention relates to a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths...
4827328 Hybrid IC device  
A compact and dense hybrid integrated circuit device which can be encapsulated by transfer molding can be manufactured by forming through holes in a ceramic or glass substrate, which through holes...
4818312 Method of making electronic tags  
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral...
Matches 151 - 200 out of 311 < 1 2 3 4 5 6 7 >