Matches 101 - 150 out of 311 < 1 2 3 4 5 6 7 >
Match Document Document Title
6128199 Composite device and manufacturing method thereof  
A resistance element, a capacitor and an intermediate electrode are formed on a substrate. The capacitor and the resistance element are connected with the intermediate electrode interposed. Two...
6124778 Magnetic component assembly  
A magnetic component assembly includes a circuit board having at least one layer. A first winding is provided on at least one surface of a layer of the circuit board and a further winding is...
6122178 Electronics package having electromagnetic interference shielding  
A PCMCIA electronics package adapted to enclose, and provides EMI shielding to, a printed circuit board (PCB). The PCB has an electrical connector adapted for plugging into a computer is at a one...
6115260 Memory module with obstacle removing terminal structure  
A terminal structure in a memory module includes a male connector having a plurality of terminal strips adapted to be engaged with the terminal tongues in the female socket. Each of the terminal...
6115261 Wedge mount for integrated circuit sensors  
A sensor mount for mounting a sensor to a substrate having a support member, a substrate attachment surface, and a sensor attachment surface. The support member can be attached to the substrate at...
6108212 Surface-mount device package having an integral passive component  
The surface-mount device package comprises a pad located on a face of the surface-mount device, a solder bump bonded to the pad, and a terminal spaced radially apart from the pad. A terminal...
6097609 Direct BGA socket  
An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a series...
6094354 Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board  
A chip component mounting board includes a chip mounting portion and a first groove. A chip component is mounted on the chip mounting portion. The chip mounting portion has a connection pad...
6094349 Electrical device having a printed-circuit board and method for assembling the device  
An electrical device has a printed-circuit board secured to a cover of the electrical-device housing, as well as a heat-dissipation mat arranged on a housing wall. The cover secured to the housing,...
6091607 Resonant tag with a conductive composition closing an electrical circuit  
Briefly stated a tag includes a dielectric substrate having first and second opposite principal surfaces. An electrical circuit having an electrically conductive pattern is formed on at least one...
6088230 Procedure for producing a chip mounting board and chip-mounting board thus produced  
Procedure for producing a transponder unit (55) provided with at least one chip (16) and one coil (18), and in particular a chip card/chip-mounting board (17) wherein the chip and the coil are...
6088234 Connection structure of circuit protection element  
The connection structure of a circuit protection element for securely connecting at least two lead terminals of the circuit protection element to a circuit board includes terminal connection...
6078505 Circuit board assembly method  
A method is disclosed for attaching a device package to a circuit board with a chip mount area that has a set of elongated pads located near the perimeter of a chip mount area. In accordance with...
6075710 Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips  
The present invention discloses a novel electronic package. This semiconductor packaging assembly is for supporting and containing an integrated circuit (IC) chip. The IC chip is supported on a...
6052287 Silicon ball grid array chip carrier  
A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond...
6052286 Restrained center core anisotropically conductive adhesive  
A polymeric three-layer membrane having metal-filled microscopic pores extending through the complete thickness of the membrane, including a central restraining core layer, and an adhesive layer on...
6049464 Electronic modules manufacturing  
In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum...
6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board  
A card for a computer is described which has a printed circuit board having a substrate which includes a number of layers, and vias extending into the substrate. By configuring the vias correctly...
6040983 Vertical passive components for surface mount assembly  
In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring...
6038132 Memory module  
A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board. The mother board has...
6031728 Device and method for interconnection between two electronic devices  
The present invention relates to the interconnection of two electronic devices (2 and 3) by means of an interconnection device (1). According to the invention, the interconnection device (1) has...
6028773 Packaging for silicon sensors  
An integrated circuit package for direct mounting of an integrated circuit die to a printed circuit board is disclosed. The integrated circuit die includes a silicon sensor that detects changes in...
6021048 High speed memory module  
A high-speed memory module defined by first and second elements the first element including a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior...
6002593 Reducing electromagnetic noise radiated from a printed board  
A printed board has at least two conductor layers including a power supply layer and a ground layer, and a spiral coil inductor disposed in opposite ones of the conductor layers. The spiral coil...
5997998 Resistance element  
Concerning a resistance element comprising a laminated and sintered article of an insulating material substrate layer and a conductor layer formed on or embedded in the insulating material...
5986533 Monolithic thick film inductor  
A monolithic thick film inductor is made by printing alternating conductive layers and dielectric layers above one another, using the same dielectric printing screen and the same conductor printing...
5982629 Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith  
A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first...
5978229 Circuit board  
An apparatus and a process for precisely mounting integrated circuit packages on circuit boards. The package has guide pins on its bottom surface that mate with non standard holes on the circuit...
5973927 Mounting structure for an integrated circuit  
A mounting structure for an integrated circuit device comprises a first substrate, a second substrate and an insulator. The first substrate contains conductive wiring electrically connected to the...
5953213 Multichip module  
A multichip module having a carrier substrate, on whose component side an IC component and other electronic components are mounted which are interconnected by way of electrically conductive...
5953215 Apparatus and method for improving computer memory speed and capacity  
A method and apparatus for enhancing memory speed and capacity utilizes a set of electronic switches to isolate the computer data bus from the memory chips. The apparatus includes one or more...
5949654 Multi-chip module, an electronic device, and production method thereof  
A substantially lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having a substantially lead-free electrode is face-down mounted...
5936844 Memory system printed circuit board  
A memory system printed circuit board having an array of memory units disposed on a surface of the printed circuit board. The memory units are arranged in a matrix of row and columns. A first pair...
5920463 Component mounting device for an electrical controller  
A device with components arranged on a p.c. board and attached by connector contact pads, fasteners for additionally fixing the components in place, and at least one connector strip positioned...
5920454 Capacitor-mounted circuit board  
A printed capacitor-mounted circuit board capable of increasing a capacity of each of printed capacitors formed on a printed board. A copper-clad laminate is arranged so as to act as an insulating...
5912808 Semiconductor component  
A microcomputer module 21 and a memory module 31 are mounted on a mounting substrate 42 in such a manner that first outer leads 23 of the microcomputer module 21 and first outer leads 33 of the...
5896275 Ground and shield for a surface acoustic wave filter package  
A grounding member for installation between a surface acoustic wave filter package and a circuit board to which the filter package is mounted. The grounding member is formed from electrically...
5847936 Optimized routing scheme for an integrated circuit/printed circuit board  
A method and structure for routing electrically conductive interconnect paths through a printed circuit board. The printed circuit board includes a plurality of insulating layers and conductive...
5838547 Electrical safety barrier  
An electrical safety barrier for use as a protective device between a hazardous area and a non-hazardous area has a substrate of ceramic material which carries thick film printed resistors and...
5831832 Molded plastic ball grid array package  
An improved leadless semiconductor device package consists of a molded plastic carrier (30) with a plurality of C5 bumps (52) integrally molded into the bottom side of the carrier. The bumps are...
5815372 Packaging multiple dies on a ball grid array substrate  
An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second...
5815373 Coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit  
The invention relates to a coupling device presenting a capacitance belonging to a board with a printed circuit, where said board (1) consists of several electrically conducting layers (50e, 50g)...
5808873 Electronic component assembly having an encapsulation material and method of forming the same  
An electronic component assembly (10) is formed by mounting an electronic component (31) to a substrate (11). An encapsulating material (33) is used to protect the electronic component (31) from...
5805423 Battery contact and retention apparatus for printed circuit boards  
The present invention relates generally to an apparatus for securely retaining a small battery or electric cell on a printed circuit board, and for providing electrical contacts which engage the...
5790384 Bare die multiple dies for direct attach  
A chip package includes a substrate formed from a first die and its attendant wiring interconnections, having a first thermal coefficient of expansion. The first die includes primary input/output...
5790385 One-chip electronic composite component  
Disclosed are a structure and a method of manufacture of a one-chip electronic composite component which is reduced of size while providing a resistance value properly adjusted. A resistor is...
5751555 Electronic component having reduced capacitance  
An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12)...
5751556 Method and apparatus for reducing warpage of an assembly substrate  
A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component...
5731959 Resistor-printed board built in a flyback transformer for a video display appliance  
A resistor-printed board built in a flyback transformer for a video display appliance with a reduced size as well as the resistance error of the printed resistors. A focus volume and a screen...
5729438 Discrete component pad array carrier  
A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a...
Matches 101 - 150 out of 311 < 1 2 3 4 5 6 7 >