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6707682 |
Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board
A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation of a power supply layer with respect to a ground layer which occurs on switching an IC device etc.,...
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6704208 |
Printed circuit board and manufacturing method thereof
A manufacturing method of a printed circuit board is composed of a first process of forming a pattern of lower electrode 4 a at a specific portion on a substrate 2 in which a capacitor element ...
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6704209 |
Aggregate of electronic components and mounting method thereof
Three or more, or two or more types of electronic components are formed on one substrate, and these electronic components form an aggregated planar surface on a surface of the substrate.
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6683790 |
Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part
An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit...
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6608757 |
Method for making a printed wiring board
Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with...
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6563214 |
Electronic component and method of manufacturing the same
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion...
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6562643 |
Packaging types of light-emitting diode
A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the...
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6552265 |
Printed board assembly and method of its manufacture
A compact printed board assembly has a patterned copper-coated substrate ( 1 ) with electronic components ( 5, 12 ) mounted thereon. Depending on the height of the components, either SBU lacquer (...
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6542380 |
Dielectric coupling of electromagnetic energy to an external current return path
A Method and system of routing noise current from noise generating devices in an electronic or electrical system is disclosed. The method and system includes dielectric structures that route noise...
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6515868 |
Printed circuit board
Printed circuit board 1 on which LSI 2 is mounted comprises first capacitors 4 a and 4 b for electrically connecting power source terminals 3 a and 3 b to via holes 8 b , first power...
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RE37956 |
Radio frequency identification tag and method
A method of and apparatus for identifying an item to or with which a radio frequency identification tag is attached or associated is provided. The tag is made of a nonconductive material to have a...
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6479757 |
Method of mounting a plurality of electronic parts on a circuit board
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer....
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6469255 |
Composite wiring board and manufacturing method thereof
There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards...
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6462272 |
Planar resist structure, in particular an encapsulation for electronic component, and thermomechanical production process
In a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area, a resist structure, in particular an encapsulation for electronic components, is obtained. In...
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6445593 |
Chip electronic component and method of manufacturing the same
A chip type electronic component and a method of manufacturing the same reduces the steps necessary for applying an electrically conductive paste to define a first external electrode, a second...
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6445589 |
Method of extending life expectancy of surface mount components
A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a...
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6434016 |
Apparatus for interconnecting multiple devices on a circuit board
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first...
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6404643 |
Article having an embedded electronic device, and method of making same
A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a...
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6362525 |
Circuit structure including a passive element formed within a grid array substrate and method for making the same
A circuit structure combines an integrated circuit with a passive circuit element formed within a grid-array substrate. Formation of the circuit structure includes forming a passive circuit element...
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6356455 |
Thin integral resistor/capacitor/inductor package, method of manufacture
A thin electrical circuitry structure is formed which contains conductive circuitry traces, integral capacitors and integral resistors. A first laminate structure comprises a conductive foil having...
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6353539 |
Method and apparatus for matched length routing of back-to-back package placement
A printed circuit board includes a first component mounted on a first side of the printed circuit board. A second component has an identical pin-out as the first component. The second component is...
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6351030 |
Electronic package utilizing protective coating
The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to...
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6351390 |
Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly
A process is given for permitting the application to a substrate ( 2 ) of a microsystem or transducer ( 1 ) having a first partial surface ( 13 ), whose interaction with the environment is to be...
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6347039 |
Memory module and memory module socket
A memory module includes a plurality of semiconductor memory devices mounted on a printed wiring board (PWB); longitudinal contact terminals that are for connection to a computer mother board and...
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6344973 |
Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of...
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6341070 |
Wafer-scale packing processes for manufacturing integrated circuit (IC) packages
This invention discloses a wafer level packaging method and configuration. This improved wafer level package includes a processed wafer mounted on a first printed circuit board (PCB) carrier. The...
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6324066 |
Surface mountable electronic device
A surface mountable electronic device (1) includes a mount (2), an electrical component (3) supported by the mount and two external terminals (5, 5a) electrically coupled to the component, the...
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6320754 |
Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package
A device that reduces the interfacial stress caused by differential thermal expansion in an IC/PC board assembly can be created by attaching an annular part, that has a higher coefficient of...
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6317331 |
Wiring substrate with thermal insert
A wiring substrate with reduced thermal expansion. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a flip...
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6313747 |
Resonant tag
The invention relates to a resonant tag including an insulating thin film and coiled circuits made of a metal foil respectively formed on both sides of the insulating thin film. The coiled circuits...
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6292372 |
Solder thieving pad for wave soldered through-hole components
An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit...
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6266249 |
Semiconductor flip chip ball grid array package
A semiconductor package is present along with an associated method. The package comprises a substrate with a top surface and a bottom surface, the substrate having a plurality of electrically...
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6262890 |
Computer system utilizing front and backside mounted memory controller chipsets
A device for solving the electrical, physical, architectural and thermal challenges associated with designing a computer system is disclosed. A memory controller chipset having two or more chips...
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6259369 |
Low cost long distance RFID reading
In the production radio frequency (RF) sensable objects, it is possible to produce a package, envelope, or like container which has enhanced read distance, producable by a simple method. Large...
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6256207 |
Chip-sized semiconductor device and process for making same
A chip-sized semiconductor device includes a semiconductor element having a plurality of electrodes and a plurality of connecting pads electrically connected to the respective electrodes. A...
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6243272 |
Method and apparatus for interconnecting multiple devices on a circuit board
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first...
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6233157 |
Printed circuit board and method for wiring signal lines on the same
Disclosed are a printed circuit board and a method for wiring signal lines on the same. Connecting lines for electrically connecting chip select pins of a semiconductor chip, no connect pins and...
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6229097 |
Substrate having trim window in a C5 array
A substrate 15 has an electrically adjustable trim pad 50 on the bottom side. A circuit pattern 18 resides on the top side, covered by an RF shield 20. The trim pad is located on the bottom side...
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6229098 |
Method for forming a thick-film resistor and thick-film resistor formed thereby
A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable...
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6205031 |
Electronic control apparatus
An electronic control unit having a housing, a substrate, particularly a hybrid, arranged in the housing and having an electronic control circuit. The electronic control unit also includes at least...
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6185105 |
Discharge structure of printed circuit board
In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit...
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6175506 |
Multilayer printed circuit board
In a multilayer printed circuit board having at least two conductive layers, including a power-supply layer with a plurality of power-supply planes having different supply voltages and a ground...
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6172878 |
Multi-element module and production process thereof
A multi-element module is constituted by a substrate having thereon a plurality of first electrodes, a plurality of electrical elements each having at least one second electrode and disposed so...
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6169663 |
Integrated circuit connection using an electrically conductive adhesive
A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads...
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6169664 |
Selective performance enhancements for interconnect conducting paths
In an integrated circuit, the conducting paths electrically coupling the electronic components can be fabricated to conform to conflicting physical property requirements. After formation of the...
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6154366 |
Structures and processes for fabricating moisture resistant chip-on-flex packages
A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a...
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6147875 |
Circuit body
A circuit body 10 includes a main circuit body 12 having an inner circuit; a plurality of connector blocks 13, 14 integrally supported by the main circuit body 12 and directly connected to electric...
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6137690 |
Electronic assembly
An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at...
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6134117 |
Method for high resolution trimming of PCB components
A method for high resolution trimming of PCB components, such as capacitors, inductors, transmission lines, transformers, antennas, resistors, etc. The method includes drilling or milling the PCB...
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6128200 |
Butt-joint CPU mounting structure
A butt-joint CPU mounting structure includes a connector having two opposite faces. Each face has a receiving slot disposed therein adapted to respectively and receivingly engage with a CPU module...
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