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7633764 |
Ball grid array configuration for reducing path distances
Presented herein are ball grid array configurations for reducing path distances. In an exemplary embodiment, there is presented a memory system. The memory system comprises a printed circuit board,...
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7626828 |
Providing a resistive element between reference plane layers in a circuit board
A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive...
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7623354 |
Folding USB drive
Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces...
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7623353 |
Securing an electrical sub-circuit assembly to a printed circuit board
An electrical sub-circuit assembly is secured to a printed circuit board by providing a printed circuit board with a basin, the printed circuit board having electrical pathways leading to the top...
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7619901 |
Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system
Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a...
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7619317 |
Carrier structure for semiconductor chip and method for manufacturing the same
A carrier structure for a semiconductor chip and a method for manufacturing the same are disclosed. The method includes the following steps: providing a carrier board having at least one through...
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7616451 |
Semiconductor package substrate and method, in particular for MEMS devices
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the...
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7609527 |
Electronic module
An electronic module in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the surface of the insulating-material layer. The conductive...
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7579693 |
Mounting structure of ball grid array
A ball grid array is mounted on a wiring board in a rectangular shape provided with screw insertion holes and fixed with screws to a mounting member at four points. Solder banks are formed around...
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7570493 |
Printed circuit board with embedded circuit component
In one embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through some of the layers. A resistive plug at least partially fills the...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7567665 |
Function for controlling line powered network element
A method of controlling power in a network element includes powering the network element by receiving power from a power communication medium and providing a telecommunication service over a...
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7554822 |
Power converter for led large area light source lamp
Power converter for receiving an input current at an input voltage and for providing an output current at an output voltage. The power converter comprises a transformer ( 133 ) having a primary (...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7545651 |
Memory module with a predetermined arrangement of pins
A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support...
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7542305 |
Memory module having on-package or on-module termination
A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the...
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7539022 |
Chip embedded packaging structure
A chip embedded packaging structure includes a first metal board, a second metal board having at least a through cavity, in which the second metal board is disposed on the upper surface of the...
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7489517 |
Die down semiconductor package
A semiconductor package is disclosed for an integrated circuit die ( 52 ). The integrated circuit die is electrically connected to the package substrate by either die solder balls ( 53 a ), or...
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
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7454012 |
Managing power in a line powered network element
A system for managing power from a power source for at least one line powered network element in an access network is provided. The system includes a power manager that establishes at least one...
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7453704 |
Printed wiring board and information processing apparatus
According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided...
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7446263 |
Multilayer printed circuit board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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7440289 |
Memory module
A memory module includes a memory chip MC 1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC 3 disposed at a position not opposite to the memory buffer...
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7440290 |
Control systems
The present invention provides systems, devices and methods for controlling a desired output of an output device. These systems, devices and methods include connecting an electrical resistance...
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7436679 |
Radio-frequency module for communication
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body...
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7432816 |
Printed circuit board with RFID antenna
A printed circuit board (PCB) includes an antenna for an RFID chip. An RFID chip for a tag is operable to be placed on the PCB such that the RFID chip is connected to the antenna and is operable to...
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7433202 |
Electronic device and method of manufacturing thereof
The electronic device comprises a body ( 40 ) of electrically insulating material that is provided with a through-hole or cavity. In the cavity or through-hole an electric component ( 20 ) is...
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7430127 |
Electronic circuit board
An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O...
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7429786 |
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a...
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7417870 |
Multi-layer board with decoupling function
A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric...
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7394665 |
LSI package provided with interface module and method of mounting the same
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7388756 |
Method and system for angled RF connection using a flexible substrate
A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate...
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7382628 |
Circuit-component-containing module
A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from...
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7352588 |
Semiconductor device and a method for manufacturing the same
A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and...
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7342803 |
Printed circuit board and method of manufacturing printed circuit board
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to...
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7339798 |
Electronic assemblies and systems comprising interposer with embedded capacitors
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the...
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7317250 |
High density memory card assembly
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate....
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7315455 |
Surface-mounted electronic component module and method for manufacturing the same
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available....
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7310239 |
IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader
Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7304857 |
Sensor node and circuit board arrangement
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a...
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7298628 |
Power delivery to base of processor
A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the...
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7294921 |
System-on-a-chip with multi-layered metallized through-hole interconnection
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance...
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7294933 |
Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the...
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7283373 |
Electronic device
An electronic device comprises an IC provided with an array of pads a preselected number of which define inspection pads of the IC. A substrate has inspection patterns and is mounted on the IC so...
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7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits
An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump.
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