Matches 351 - 400 out of 452 < 1 2 3 4 5 6 7 8 9 10 >
Match Document Document Title
5615089 BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate  
A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package...
5606198 Semiconductor chip with electrodes on side surface  
A semiconductor device comprising a semiconductor chip substrate, an integrated circuit formed on a surface of the semiconductor chip substrate, and metal electrodes extending from the integrated...
5594626 Partially-molded, PCB chip carrier package for certain non-square die shapes  
A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In...
5579207 Three-dimensional integrated circuit stacking  
A plurality of integrated circuit chips (12) are packaged in a stack of chips in which a number of individual chip layers (10,120,130,132,134) are physically and electrically interconnected to one...
5578796 Apparatus for laminating and circuitizing substrates having openings therein  
According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite...
5576934 Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board  
A mounting unit for a multilayer hybrid circuit having power components provides improved heat dissipation from the power components. The mounting unit includes a thermally conductive substrate...
5563773 Semiconductor module having multiple insulation and wiring layers  
A memory IC having an SOJ type package is mounted on a metal wiring layer on the surface of the outer layer of a multilevel interconnection board. Protecting portions are formed on the package of...
5557502 Structure of a thermally and electrically enhanced plastic ball grid array package  
An integrated circuit package which has internal bonding pads that are located on bonding shelves and coupled to internal conductive power/ground planes by conductive strips that extend along the...
5542175 Method of laminating and circuitizing substrates having openings therein  
According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite...
5504373 Semiconductor memory module  
A semiconductor memory module is formed of semiconductor packages respectively having at least one defect data line combined to be mounted to a module substrate which has two rows of auxiliary pads...
5495394 Three dimensional die packaging in multi-chip modules  
A multi-chip module wherein electrical components, such as integrated circuit devices, are packaged in a three dimensional arrangement. The multi-chip module includes a first, or upper, substrate...
5470795 Method of connecting terminals of a plastic-encapsulated power transistor to a printed-circuit board  
Disclosed is a method of connecting the terminals of at least one heat-sinked, plastic-encapsulated power transistor to circuits of a printed-circuit board. In the method, a main flat surface of...
5468910 Semiconductor device package and method of making  
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the...
5452182 Flexible high density interconnect structure and flexibly interconnected system  
A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During...
5450289 Semiconductor package and a printed circuit board applicable to its mounting  
An arrangement for vertically mounting a semiconductor device to a substrate, e.g., a printed circuit board (PCB), in which a plurality of sequentially arranged external leads of the semiconductor...
5420756 Memory card including stacked semiconductor memory elements located on a printed circuit board having a straight wiring pattern  
TCP (tape carrier package) type semiconductor memory elements, each having a thickness less than that of the conventional package, are provided on the front and rear surface of a print circuit...
5420460 Thin cavity down ball grid array package based on wirebond technology  
A high performance ball grid array is disclosed in which a ball grid array is modified to include a body having a recessed central cavity. The inclusion of a central cavity allows the die to be...
5397921 Tab grid array  
A TAB Grid Array (TGA) pack package for an integrated circuit. A TGA package provides an efficient structure and method to connect a semiconductor die encapsulated in the TGA package to an external...
5353194 Modular power circuit assembly  
A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of...
5352851 Edge-mounted, surface-mount integrated circuit device  
An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads...
5351393 Method of mounting a surface-mountable IC to a converter board  
A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed...
5338975 High density interconnect structure including a spacer structure and a gap  
A high frequency electronic component which is interconnected with other components through a high density interconnect structure sees only an air dielectric constant in the high density...
5317479 Plated compliant lead  
A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit...
5315482 Semiconductor apparatus of module installing type  
A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A...
5305186 Power carrier with selective thermal performance  
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided....
5297006 Three-dimensional multi-chip module  
A three-dimensional multi-chip module having high integration density and a high power output. The module includes a substrate having wiring patterns thereon and a plurality of electrode terminals....
5289336 Static electricity dispersant  
A formable or deformable material is pressed into place and in contact with the leads connected to semiconductor device. A connection is made through a snap or other device to ground or to some...
5289337 Heatspreader for cavity down multi-chip module with flip chip  
A converging design multi-chip module having semiconductor chips connected to a substrate recessed into a cavity of the MCM package body, the chips being interconnected using flip chip and control...
5285352 Pad array semiconductor device with thermal conductor and process for making the same  
A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal...
5274570 Integrated circuit having metal substrate  
An integrated circuit of this application includes a circuit board in which a conductive layer of a desired pattern is formed on a metal substrate through an insulating layer, a circuit element...
5262927 Partially-molded, PCB chip carrier package  
A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In...
5255156 Bonding pad interconnection on a multiple chip module having minimum channel width  
Disclosed is a electrical circuit (20) that includes a plurality of integrated circuits (22a,22b,22c,22d). At a distance from the perimeter (30,32) of each integrated circuit are disposed a series...
5251107 Semiconductor package  
A quadrate semiconductor element in the form of a quad flat package, a bare chip, and the like mounted on a substrate has a plurality of first terminals electrically connected through connecting...
5243497 Chip on board assembly  
A chip-on-board assembly and a method of making is described in which semiconductor chips having center contacts are mounted active side down on the circuit board, with the center contacts centered...
5243496 Molded case integrated circuit with a dynamic impedance reducing device  
A device for reducing dynamic impedances in a molded case integrated circuit comprises a chip (15) and several annular metal planes (21, 22) separated from each other by an insulating film (27,...
5239448 Formulation of multichip modules  
A method of reducing the area of MCMs that are integral to a flexible carrier is provided. A locally complex area, i.e. multilayer MCM carrier is constructed on a flex carrier, along with other...
5235496 Device for packaging integrated circuits  
The device comprises at least one printed circuit board (11,12) on which is fixed a heightening board (15) comprising at least one opening (16) for forming with the surface of the printed circuit...
5177594 Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance  
A semiconductor package is described for supporting and interconnecting semiconductor chips, each chip having contact lands on a contact surface, the package also including a substrate with a...
5173844 Integrated circuit device having a metal substrate  
A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the...
5121294 IC card  
An IC card embedded in molding material has electrical contact pieces located in an indentation to protect the contacts from exposure to static electricity of a person handling that IC card.
5109320 System for connecting integrated circuit dies to a printed wiring board  
Both a system and a method are provided for electrically and mechanically connecting at least one integrated circuit die to a solderless printed wiring board of the type which uses connecting...
5081562 Circuit board with high heat dissipations characteristic  
A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the...
5018051 IC card having circuit modules for mounting electronic components  
An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector...
4980802 Flexible printed circuit  
A flexible printed circuit having contacts and associated leads which are connected to the contacts. The contacts are disposed at a first zone and the leads are for connection from this zone to a...
4979076 Hybrid integrated circuit apparatus  
A hybrid integrated circuit apparatus includes an electrical circuit component, having first and second leads connected thereto, disposed within an aperture extending from a first surface to a...
4965702 Chip carrier package and method of manufacture  
An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.
4964019 Multilayer bonding and cooling of integrated circuit devices  
A method to mount and cool integrated circuit chips within a multilayer printed wiring board structure. The method makes the use of tape automated bonding or flip chip dice attachment techniques in...
4933810 Integrated circuit interconnector  
A flexible film has electrical interconnections on each side. Through-film interconnects pass through openings in the film to connect the electrical interconnects on opposite sides of the film....
4928199 Circuit protection device  
A circuit protection device for protecting electrical circuits against voltage transients comprises a chip package which includes a threshold switch device formed from an amorphous composition.
4924353 Connector system for coupling to an integrated circuit chip  
A connector system for selectively coupling in a desired manner the input/output terminals of an integrated circuit chip to the input/output terminals of one or more other integrated circuit chips...
Matches 351 - 400 out of 452 < 1 2 3 4 5 6 7 8 9 10 >