Matches 251 - 300 out of 453 < 1 2 3 4 5 6 7 8 9 10 >
Match Document Document Title
6052287 Silicon ball grid array chip carrier  
A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond...
6049465 Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor  
The present invention provides a microprocessor, the microprocessor having a substrate with a first and a second side, the first and second sides being on opposite sides of the substrate. The...
6049470 Package with reticulated bond shelf  
A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one...
6049464 Electronic modules manufacturing  
In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum...
6049463 Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same  
A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12)...
6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board  
A card for a computer is described which has a printed circuit board having a substrate which includes a number of layers, and vias extending into the substrate. By configuring the vias correctly...
6043987 Printed circuit board having a well structure accommodating one or more capacitor components  
Printed Circuit Board fabrication costs are decreased, and device placement densities are increased by the use of well structures designed for receiving components such as capacitors on portions of...
6040984 Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels  
High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding...
6040983 Vertical passive components for surface mount assembly  
In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring...
6038137 Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon  
A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at...
6031728 Device and method for interconnection between two electronic devices  
The present invention relates to the interconnection of two electronic devices (2 and 3) by means of an interconnection device (1). According to the invention, the interconnection device (1) has...
6031726 Low profile mounting of power converters with the converter body in an aperture  
Power conversion apparatus includes a circuit board and a power converter. The circuit board has top and bottom faces separated by a thickness, and an aperture penetrating through the thickness...
6028773 Packaging for silicon sensors  
An integrated circuit package for direct mounting of an integrated circuit die to a printed circuit board is disclosed. The integrated circuit die includes a silicon sensor that detects changes in...
6028774 Base cards and IC cards using the same  
A base card improves the mounting reliability of a COB package particularly when the package has molding by-products such as epoxy burrs or molding flashes. The base card has a COB package...
6025995 Integrated circuit module and method  
An integrated circuit module is provided having a substrate, an integrated circuit on the substrate and defining an active surface remote from the substrate, and a die attached to the active...
6021048 High speed memory module  
A high-speed memory module defined by first and second elements the first element including a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior...
6014318 Resin-sealed type ball grid array IC package and manufacturing method thereof  
An IC package suitable for high density mounting and high speed is provided, by improving the humidity resistance and mounting stress resistance at a resin-sealed type BGA package and improving the...
6011330 Miniature power supply  
A power supply integrated module includes a metal substrate having a surface and a body of a dielectric material, such as a glass or ceramic, mounted on and bonded to the surface of the substrate....
6008993 Chip card with chip support element and coil support element  
A chip card consists of a chip support assembly and a coil support assembly which are combined by an electrically conducting adhesive material (7). The chip support assembly has a contact-face...
5999437 Processor-inclusive memory module  
A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed...
5995374 Resin-coated mount substrate and method of producing the same  
A substrate unit is constituted by a printed substrate on which electronic parts such as a relay block is mounted, and at least printed circuit conductors and terminals in the printed substrate and...
5991162 High-frequency integrated circuit device and manufacture method thereof  
A high-frequency power module is provided which has excellent heat radiating characteristics for carrying heat away from a power device element contained in the module. Also, the module can be...
5990564 Flip chip packaging of memory chips  
The specification describes an interconnect strategy for memory chip packages to reduce or eliminate alpha particle contamination from the use of high lead solder interconnections in the vicinity...
5982628 Circuit configuration having a smart card module and a coil connected thereto  
A circuit configuration includes a planar carrier which has at least two contact lugs. A semiconductor chip which is disposed on the carrier is electrically conductively connected to the insulated...
5982630 Printed circuit board that provides improved thermal dissipation  
A printed circuit board to support an integrated circuit and provide thermal dissipation. A layer of thermally conductive material is disposed between lower and upper dielectric layers. Above this...
5978229 Circuit board  
An apparatus and a process for precisely mounting integrated circuit packages on circuit boards. The package has guide pins on its bottom surface that mate with non standard holes on the circuit...
5973927 Mounting structure for an integrated circuit  
A mounting structure for an integrated circuit device comprises a first substrate, a second substrate and an insulator. The first substrate contains conductive wiring electrically connected to the...
5973928 Multi-layer ceramic substrate decoupling  
A multi-layer ceramic module comprises a multi-layer ceramic substrate having an upper side and a lower side, at least one semiconductor chip mounted on the upper side of the substrate, a plurality...
5966293 Minimal length computer backplane  
An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a...
5963429 Printed circuit substrate with cavities for encapsulating integrated circuits  
A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other...
5959846 Modular surface mount circuit device and a manufacturing method thereof  
First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the...
5956237 Primary printed wiring board  
A primary printed wiring board includes: secondary printed wiring boards arranged in plural lines; main plated leads formed between the plural lines of secondary printed wiring boards; and...
5953213 Multichip module  
A multichip module having a carrier substrate, on whose component side an IC component and other electronic components are mounted which are interconnected by way of electrically conductive...
5951893 Integrated circuit pad structure with high temperature heating element and method therefor  
Heater circuits (13) are placed in close proximity or integrated with connection points (12) of an integrated circuit. A connection point is an area where a wire bond or conductive bump is coupled...
5949137 Stiffener ring and heat spreader for use with flip chip packaging assemblies  
A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like...
5946195 Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate  
A semiconductor device includes a semiconductor element, an insulating film and a wiring pattern. The insulating film has a first opening and a plurality of second openings. At least part of the...
5943216 Apparatus for providing a two-sided, cavity, inverted-mounted component circuit board  
An apparatus and method of providing a printed wiring board is disclosed. The printed circuit board comprises a printed wiring board that has at least one opening. The printed circuit board further...
5926376 Printed circuit board card for mounting packages in faces thereof  
A Printed Circuit Board (PCB) card for insertion in a computer expansion slot and a method of making such a PCB card are disclosed. The PCB card includes packages disposed at least partially...
5923954 Ball grid array package and fabrication method therefor  
A BGA package and a fabrication method therefor are capable of enhancing the productivity of an assembly by eliminating a wire bonding step, which requires a significant amount of time. The package...
5923538 Support member for mounting a microelectronic circuit package  
A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and...
5923540 Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power  
A semiconductor device has an electrical circuit and a grounding terminal. A multilayer substrate has a plurality of insulator layers and conductor layers in a stacked arrangement and a surface...
5919259 Method and apparatus for supplying power to a CPU using an adaptor card  
A method and apparatus for supplying power to a central processing unit (CPU) in computer systems which normally mount CPUs on a motherboard and supplies power to the CPUs via motherboard circuitry...
5918153 High density electronic circuit and process for making  
High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate...
5912808 Semiconductor component  
A microcomputer module 21 and a memory module 31 are mounted on a mounting substrate 42 in such a manner that first outer leads 23 of the microcomputer module 21 and first outer leads 33 of the...
5904791 Use of preceramic polymers as electronic adhesives  
A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered...
5901046 Surface mount type package unit and method for manufacturing the same  
A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes...
5896271 Integrated circuit with a chip on dot and a heat sink  
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal...
5889655 Integrated circuit package substrate with stepped solder mask openings  
A substrate for an integrated circuit package. Located on a bottom surface of the substrate are a plurality of contact pads. Solder balls are attached to the contact pads and then reflowed to mount...
5877560 Flip chip microwave module and fabrication method  
A monolithic flip chip microwave integrated circuit module formed using titanium coated copper circuitry and a processing method. A dam is formed on a substrate by forming a thin protective layer...
5875100 High-density mounting method and structure for electronic circuit board  
In a high-density mounting method for an electronic circuit board, a stud bump is formed on a connection terminal of a semiconductor chip. The semiconductor chip is buried in a printed circuit...
Matches 251 - 300 out of 453 < 1 2 3 4 5 6 7 8 9 10 >