Matches 101 - 150 out of 452 < 1 2 3 4 5 6 7 8 9 10 >
Match Document Document Title
6798052 Fexible electronic device  
An electronic device ( 38 ) for mounting on a curved or flexible support ( 42 ) and a method for fabrication of the same. The electronic device comprises a layer ( 2 ) of rigid material having...
6791186 Mounting substrate and structure having semiconductor element mounted on substrate  
A mounting substrate on which a semiconductor element is to be mounted by flip-chip bonding, the semiconductor element having a surface on which a plurality of electrode terminals are arranged in a...
6789146 Socket for receiving a single-chip video controller and circuit board containing the same  
A circuit board socket is provided which is adapted to accept a plug-in single video controller having embedded video memory. The socket allows a circuit board to be easily wired to accommodate...
6787895 Leadless chip carrier for reduced thermal resistance  
According to one embodiment, a semiconductor die is situated in a cutout section of a substrate. In one embodiment, the substrate is situated on a printed circuit board such that the semiconductor...
6775149 Multichip mounted structure, electro-optical apparatus, and electronic apparatus  
A multichip mounted structure has a substrate 11 provided with substrate-side terminals 16 a and 16 b and a plurality of IC chips 12 a and 12 b provided with bumps 14 a and 14 b ,...
6768649 Method and a circuit system for using equivalent integrated-circuit devices operating at different voltages  
The circuit system includes an integrated circuit which is one of a family of equivalent integrated circuits that comprises a first-generation integrated circuit operating at the supply voltage of...
6765801 Optical track drain package  
A package includes a substrate having a pocket, an overflow reservoir around a periphery of the pocket, and a mating surface around a periphery of the overflow reservoir. An electronic component is...
6732588 Pressure transducer  
The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone...
6732428 Method for increasing electronic component density on an electronic circuit board  
A technique for increasing electronic component density on circuitry boards is disclosed. In one embodiment, the technique is realized as a method for increasing electronic component density on an...
6731512 Active package for integrated circuit  
An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at...
6724599 Power semiconductor device  
A power semiconductor device comprises a power switching element having two main electrodes and one control electrode, a metal electrode connected to one of main electrodes of the power switching...
6724638 Printed wiring board and method of producing the same  
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makesit possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to...
6721187 Multi-layered high density connections  
A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points...
6717822 Lead-frame method and circuit module assembly including edge stiffener  
An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may...
6711025 Combination device of the IC connection device and the main board  
A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket....
6707682 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board  
A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation of a power supply layer with respect to a ground layer which occurs on switching an IC device etc.,...
6707677 Chip-packaging substrate and test method therefor  
A chip-packaging substrate and test method therefor. The chip-packaging substrate includes at least one package area and a connection area enclosed by and connected to the package areas. A test...
6706564 Method for fabricating semiconductor package and semiconductor package  
A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a...
6703792 Module for mounting driver IC  
A module, for mounting a driver IC constituting a drive circuit of a display apparatus using a flat display panel, is disclosed, which includes a driver IC chip for driving the display electrodes...
6700790 Circuit board with integrated circuit  
In a circuit board comprising multiple layers and having an integrated circuit mounted on the outer layer thereof, a main power supply plane and a sub-power supply plane, which is disposed in an...
6691406 Methods of die attachment for BOC and F/C surface mount  
Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The...
6690583 Carrier for electronic components  
A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low...
6690580 Integrated circuit structure with dielectric islands in metallized regions  
This disclosure describes use of dielectric islands embedded in metallized regions of a semiconductor device. The islands are formed in a cavity of a dielectric layer, as upright pillars attached...
6678877 Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas  
A method and apparatus for PCB layout of a circuit simulated over a network is provided. Techniques are provided for designing a circuit that satisfies user-specified functional requirements...
6678168 System including power conditioning modules  
In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit...
6678167 High performance multi-chip IC package  
The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to...
6674646 Voltage regulation for semiconductor dies and related structure  
An output of a voltage regulator is a core voltage line that runs adjacent to a die attach area on a packaging substrate. An input of the voltage regulator is typically coupled to a power supply...
6657523 Stacked radio-frequency module  
A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and...
6653563 Alternate bump metallurgy bars for power and ground routing  
An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of...
6651321 Microelectronic joining processes  
A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the...
6642554 Memory module structure  
A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides...
6626931 Implantable medical electronics using high voltage flip chip components  
An implantable medical device having reduced volume includes a high voltage die mounted to a substrate and assembled into a device body. The die is flip chip mounted, reducing the size of the...
6618269 Discrete circuit component and process of fabrication  
A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically...
6614650 Portable terminal apparatus  
This invention provides a portable terminal apparatus increasing brightness at a light emitting portion of the portable terminal apparatus. Light emitted from a light source is made to be incident...
6611434 Stacked multi-chip package structure with on-chip integration of passive component  
A stacked multi-chip package structure with on-chip integration of passive component is proposed, which is characterized in the mounting of passive component on a remaining surface area of the...
6601293 Method of making an electromagnetic interference shield device  
A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An...
6597585 Power semiconductor module  
A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is...
6590907 Integrated circuit with additional ports  
An integrated circuit which has a packet router to which a plurality of functional modules are connected by respective ports is described. One of the ports acts as a socket port for an expansion...
6562643 Packaging types of light-emitting diode  
A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the...
6560117 Packaged microelectronic die assemblies and methods of manufacture  
Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an...
6556453 Electronic circuit housing with trench vias and method of fabrication therefor  
An electronic circuit package ( 400 , FIG. 4 ) includes one or more trench vias ( 404 , FIG. 4 ). Each trench via makes electrical contact with one or more terminals ( 526 , FIG. 5 ) of a...
6557154 Printed circuit board design support system, printed circuit board design method and storage medium storing control program for same  
A PCB (Printed Circuit Board) design support system and a PCB design method reduce radiation of electromagnetic waves by optimizing layout of a substrate while following a conventional method for...
6542374 Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board  
A FPC board 400 is manufactured by patterning copper foils which are bonded onto both sides of a base film 410 having insulation and flexibility without an adhesive layer, and forming an input...
6542375 Hybrid PCB-IC directional coupler  
The present invention relates to a method for providing non-contact power/current sensing in an electronic circuit. Specifically, the method provides an electronic coupler in the form of an...
6538898 Method and apparatus of die attachment for BOC and F/C surface mount  
A method and apparatus for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface, mounting comprise protrusions on the surface of...
6529385 Component array adapter  
Apparatus and methods for connecting a device to an integrated circuit. The apparatus includes an insulating substrate that has two major sides and a number of sites for housing components. Each...
6525945 Method and system for wide band decoupling of integrated circuits  
An eletronic package comprising a printed circuit board on which are mounted a plurality of decoupling capacitors is disclosed. A carrier component electrically connects an integrated circuit to...
6525944 Windowed package for electronic circuitry  
An apparatus and method for enabling interaction between electronic circuitry and optical signals with a package for enclosing the electronic circuitry having contacts and a window for the passage...
6507496 Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component  
A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different...
6501665 Structure of a ball grid array IC mounting seat  
An improved structure of a Ball Grid Array IC mounting seat is disclosed. The IC mounting sear is characterized in that the middle section of the elongated thin strap is provided with a notch such...
Matches 101 - 150 out of 452 < 1 2 3 4 5 6 7 8 9 10 >