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8937255 Superconductive multi-chip module for high speed digital circuits  
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting...
8937257 Electronic module  
An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed...
8934258 Motor controller  
A motor controller comprising multiple types of interfaces assigned automatically, including a mother circuit board and a daughter circuit board. The daughter circuit board is plugged into the...
8929090 Functional element built-in substrate and wiring substrate  
An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the...
8923003 Flexible circuit connectors with reduced profiles  
An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact...
8923007 Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)  
In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least...
8923009 Substrate with built-in electronic component  
In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four...
8923004 Microelectronic packages with small footprints and associated methods of manufacturing  
Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate,...
8921706 Component-embedded substrate, and method of manufacturing the component-embedded substrate  
A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the...
8923008 Circuit board and method for manufacturing circuit board  
A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and...
8916780 Z-directed delay line components for printed circuit boards  
A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the...
8917520 Circuit substrate  
A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the...
8912639 IC package with embedded transformer  
Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a...
8913402 Triple-damascene interposer  
This interposer provides interconnections between stacked layers of circuits, which may include integrated circuits, PC boards, and hybrid substrates. Fabricated as an integrated circuit itself...
8907227 Multiple surface integrated devices on low resistivity substrates  
The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first...
8908385 Interface module  
An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the...
8908377 Wiring board and method for manufacturing the same  
A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid...
8902603 Solder and lead free electronic circuit and method of manufacturing same  
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks...
8902607 Modular electronic testing apparatus and methods  
A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules...
8902604 Component support and assembly having a MEMS component on such a component support  
A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS...
8897028 Circuit module  
In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and...
8895863 Multilayer printed circuit board  
A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed...
8879276 Flexible circuit assembly and method thereof  
An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to...
8873245 Embedded chip-on-chip package and package-on-package comprising same  
An embedded chip-on-chip package includes a printed circuit board having a recessed semiconductor chip mounting unit constituted by a recess in the printed circuit board and a circuit pattern at...
8872041 Multilayer laminate package and method of manufacturing the same  
A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a...
8867225 Wiring board  
A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first...
8867226 Monolithic microwave integrated circuits (MMICs) having conductor-backed coplanar waveguides and method of designing such MMICs  
A MMIC having: a substrate; a plurality of active and passive electrical elements disposed on a top surface of the substrate; a plurality of coplanar waveguide transmission line sections disposed...
8861215 Semiconductor device  
A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals...
8853559 Insulation circuit board, and power semiconductor device or inverter module using the same  
The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device,...
8848385 Embedded isolation filter  
The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing...
8837159 Low-profile circuit board assembly  
Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer...
8835773 Wiring board and method of manufacturing the same  
A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted;...
8830690 Minimizing plating stub reflections in a chip package using capacitance  
Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an...
8829355 Multilayer printed wiring board  
A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material...
8829839 System and method for temperature estimation in an integrated motor drive  
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the...
8830692 Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component  
A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having...
8826527 Electronic component-embedded printed circuit board and method of manufacturing the same  
Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and...
8829356 Packaging substrate having a passive element embedded therein and method of fabricating the same  
A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element...
8824156 Pocket-enabled chip assembly for implantable devices  
Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living...
8824163 RF layered module using three dimensional vertical wiring and disposing method thereof  
Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical...
8817485 Single-layer component package  
A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in...
8811019 Electronic device, method for producing the same, and printed circuit board comprising electronic device  
An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least...
8804362 High-frequency module  
In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged...
8804361 Wiring substrate  
A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and...
8804363 Printed circuit boards with embedded components  
Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board...
8802998 Ceramic multilayer substrate and method for producing the same  
A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding...
8804358 Method of forming an electronic multichip module  
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting...
8797755 Wiring board and manufacturing method of wiring board  
There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is...
8792248 Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board  
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit...
8791558 Stacked semiconductor package  
A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a...