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7405949 |
Memory system having point-to-point (PTP) and point-to-two-point (PTTP) links between devices
A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one...
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7397134 |
Semiconductor device mounted on and electrically connected to circuit board
The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting...
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7394458 |
Low EMI capacitive trackpad
A printed circuit board (PCB) assembly provides a two layer capacitive trackpad sensor in which an EMI ground grid is interposed among the sensor's capacitive elements on each of its layers. The...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7382627 |
Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the...
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7379306 |
Multilayer substrate including components therein
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a...
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7366629 |
High frequency module board device
The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high...
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7365273 |
Thermal management of surface-mount circuit devices
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first...
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7361844 |
Power converter package and thermal management
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
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7355854 |
Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board,...
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7352260 |
Transceiver using low temperature co-fired ceramic method
Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7348494 |
Signal layer interconnects
Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at...
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7345889 |
Method and system for reducing radiated energy emissions in computational devices
A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a...
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7345888 |
Component built-in wiring board and manufacturing method of component built-in wiring board
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in...
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7342799 |
System using power converter, microsurge suppressor and microsurge suppression method
A motor driving system includes an AC power supply 1 , an AC reactor 2 , a power converter 3 and a motor 4 . A microsurge suppressor 5 is inserted on a power supply line from the power...
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7339260 |
Wiring board providing impedance matching
A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said...
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7321495 |
Capacitor and method for manufacturing the same
A multilayer ceramic capacitor ( 10 ) having reduced inductance which is separated into a first layer body ( 11 ) and a second layer body ( 12 ). The first layer body ( 11 ) and the second layer...
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7317250 |
High density memory card assembly
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate....
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7315455 |
Surface-mounted electronic component module and method for manufacturing the same
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available....
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7313001 |
Electrical switch having a mount for an electrical circuit
The invention relates to an electrical circuit arrangement ( 3 ) having electrical and/or electronic components ( 4 ). The components ( 4 ) are arranged on a mount substrate ( 5 ). The conductor...
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7310240 |
Method for increasing stability of system memory through enhanced quality of supply power
An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a...
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7310238 |
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board
The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof. A thin film embedded capacitance...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7304858 |
Printed circuit board unit and electronic apparatus
A printed circuit board has separate first, second and third sections arranged in a predetermined direction. A connector is mounted at the first section. A noise cut filter is mounted at the second...
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7304248 |
Multi-layer printed circuit board and method for manufacturing the same
A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode...
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7292455 |
Multilayered power supply line for semiconductor integrated circuit and layout method thereof
The present invention provides a multilayered power supply line suitable for use in a semiconductor integrated circuit and a layout method thereof. In the multilayered power supply line ( 10 ) for...
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7286366 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7283372 |
Circuit element having a first layer of an electrically insulating substrate material and method for manufacturing a circuit element
Circuit element having a first layer composed of an electrically insulating substrate material, a first electrically conductive material which is in the form of at least one discrete area, such...
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7269033 |
Suppressor device
A suppressor device for an electronic device comprising a plug-in device, comprising at least one plug element, which is arranged on a electrically conducting housing of the electronic device. A...
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7269021 |
Smart card containing a carrier body for receiving at least one system component having a plurality of electrical components and uniting electrical functions for operating the smart card
A smart card contains a carrier body for receiving at least one system component, which has (in each case) a plurality of electrical components, and which unites the electrical functions for the...
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7266882 |
Method of manufacturing a miniaturized three- dimensional electric component
Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at...
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7266451 |
Shock resistant device
A shock resistant device. A printed circuit board comprising electronics and a frequency reference is rigidly mounted to a central support member. The electronics can be mounted to both surfaces of...
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7262974 |
Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs
A circuit board has a first component interface configured to connect to a first circuit board component, a second component interface configured to connect to a second circuit board component, a...
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7262497 |
Bumpless assembly package
A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second...
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7253510 |
Ball grid array package construction with raised solder ball pads
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised...
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7247945 |
Semiconductor apparatus
A semiconductor apparatus includes a printed circuit board, a peripheral type first semiconductor package which has a first group of ball electrodes arranged in a peripheral type first arrangement...
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7247226 |
Coating support and method for the selective coating of conductive tracks on one such support
The present invention concerns a lining support comprising a plurality of conductive pads ( 12 ) associated with a shared addressing contact ( 18 ) and means of selecting at least one pad to be...
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7242591 |
Wiring board incorporating components and process for producing the same
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in...
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7233498 |
Medium having data storage and communication capabilities and method for forming same
A method for forming a medium is provided. In accordance with the method a base layer is provided. A material layer is formed on the base layer. The material layer has void. A transponder having a...
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7230332 |
Chip package with embedded component
A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes...
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7221960 |
Mobile telephone device comprising multiwire electrical connection devices
Described is a high-frequency connecting device comprising a first connecting element and a second connecting element which in the connecting position are in electrical contact without engaging...
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7221244 |
Localized enhancement of multilayer substrate thickness for high Q RF components
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as...
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7218529 |
Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming
A circuit arrangement includes a programmable memory element mounted on a circuit board, with programming contacts of the memory element connected to conductor paths of the circuit board. Data...
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7209362 |
Multilayer ceramic substrate with a cavity
A multilayer ceramic substrate with a cavity includes a multilayer composite member including a plurality of ceramic layers disposed one on another. A cavity is formed in the multilayer composite...
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7197818 |
Method and structures for implementing customizable dielectric printed circuit card traces
A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric...
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7186919 |
Printed circuit board including embedded capacitors and method of manufacturing the same
Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer...
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7180749 |
Circuit board and its manufacturing method
A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first...
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7173192 |
Position fixing in printed circuit boards
The invention relates to a position-fixing arrangement for use in printed circuit boards, preferably for mechanically determining the position of optical couplers. According to the invention,...
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7167376 |
Multilayer wiring board, method of mounting components, and image pick-up device
A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is...
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