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8699233 Circuit module and method of manufacturing the same  
Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of...
8692135 Wiring board capable of containing functional element and method for manufacturing same  
A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating...
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each...
8659143 Stub minimization for wirebond assemblies without windows  
A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending...
8659142 Stub minimization for wirebond assemblies without windows  
A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to...
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the...
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second...
8654538 Wiring board and method for manufacturing the same  
A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple...
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through...
8654539 Capacitor-incorporated substrate and component-incorporated wiring substrate  
An object of the present invention is to provide a capacitor-incorporated wiring substrate in which connection reliability can be improved through ensuring of a path for supply of electric...
8649183 Electronic assembly  
An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large...
8638567 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
8629354 PCB having embedded IC and method for manufacturing the same  
A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to...
8625300 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
8618421 Electronics component embedded PCB  
An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed...
8619431 Three-dimensional system-in-package package-on-package structure  
The present invention provides a three-dimensional System-In-Package (SIP) Package-On-Package (POP) structure comprising a support element formed around a first electronic device. A filling...
8614898 Printed wiring board, electronic device, and printed wiring board manufacturing method  
A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the...
8592691 Printed wiring board  
A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film...
8593823 Suspension board with circuit  
A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically...
8587955 Electronic device with a ceramic component  
An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The...
8575763 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a first wiring hoard, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first...
8575496 Multilayer printed wiring board and method of manufacturing the same  
A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes...
8559184 Electronic component built-in substrate and method of manufacturing the same  
A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is...
8558636 Package embedded equalizer  
A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be...
8546922 Wiring board  
A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first...
8546700 Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment  
A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones...
8537553 Devices having anisotropic conductivity heatsinks, and methods of making thereof  
In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further...
8525630 Laminated inductor  
A laminated inductor having a laminate structure constituted by magnetic layers and internal conductive wire-forming layers, wherein the magnetic layer is formed by soft magnetic alloy grains, the...
8519270 Circuit board and manufacturing method thereof  
A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric...
8508950 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise  
Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through...
8505613 Die having a via filled with a heat-dissipating material  
A structure including a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot. The via is at least partially filled with a heat-dissipating...
8498130 Solid state drive, structure for supporting solid state drives and scalable information processing system including a plurality of solid state drives  
A solid state drive includes a printed circuit board, at least one memory and a controller. The at least one memory stores data. The at least one memory is embedded in the substrate of the printed...
8493741 Subsea electronics module  
A Subsea Electronics Module for a well installation, comprising: a housing;at least two printed circuit boards having control circuitry provided thereon; anda communications component for enabling...
8492658 Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance  
An apparatus comprises a multi-layer printed circuit board having at least three conductor layers, a dielectric material layer between each of the conductor layers, and a laminate capacitor stack...
8479375 Method of making an embedded electromagnetic device  
A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical,...
8482930 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Electronic device with a ceramic component
 
An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The...
8481863 Substrate and method for manufacturing the same  
A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the...
8482929 Systems for circuit board heat transfer and method of assembling same  
A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between...
8481864 Method for the production of a functional constructional unit, and functional constructional unit  
The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which...
8472207 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods  
An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with...
8461463 Composite module  
A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a...
8461458 Card structure, socket structure, and assembly structure thereof  
A card structure includes a first substrate, a second substrate, and a connector. The first substrate includes a base surface, wherein at least one electronic part region and a terminal region are...
8461957 In-molded resistive and shielding elements  
An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element...
8451618 Integrated antennas in wafer level package  
A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements...
8451613 Television and electronic apparatus  
According to one embodiment, an electronic apparatus includes a housing, a module in the housing, and an electrical interconnection. The housing includes a first portion, a second portion including...
8450616 Circuit board and manufacturing method thereof  
A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the...
8446736 Circuit board and manufacturing method thereof  
An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in...
8422243 Integrated circuit package system employing a support structure with a recess  
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support...
8418356 Method of manufacturing an embedded printed circuit board  
The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in...
8420954 Printed circuit board and method for fabricating the same  
The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A...