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8446736 |
Circuit board and manufacturing method thereof
An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in...
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8422243 |
Integrated circuit package system employing a support structure with a recess
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support...
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8418356 |
Method of manufacturing an embedded printed circuit board
The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in...
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8420954 |
Printed circuit board and method for fabricating the same
The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A...
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8411448 |
Security protection device and method
A security protection device includes a cover circuit board, at least one inner wiring layer being included within the cover circuit board. The device also includes a base circuit board, at least...
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8411459 |
Interposer-on-glass package structures
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion...
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8389867 |
Multilayered circuit substrate with semiconductor device incorporated therein
For the purpose of providing a semiconductor element built-in type multilayered circuit board in which a semiconductor element is closely joined to a recess of an insulating substrate to...
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8381394 |
Circuit board with embedded component and method of manufacturing same
A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole...
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8385028 |
Galvanic isolator
A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being...
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8375576 |
Method for manufacturing wafer scale heat slug system
A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer;...
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8354338 |
Carrier board structure with embedded semiconductor chip and fabrication method thereof
A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a...
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8355262 |
Electronic component built-in substrate and method of manufacturing electronic component built-in substrate
An electronic component is provided between at least two wiring boards. An electrode of the electronic component is electrically connected to at least one of the wiring boards. Also, the wiring...
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8354748 |
In-package microelectronic apparatus, and methods of using same
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor...
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8351215 |
Method of manufacturing a chip embedded printed circuit board
The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an...
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8350306 |
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the...
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8351214 |
Electronics module comprising an embedded microcircuit
This publication discloses an electronics module comprising an insulating-material layer having two opposite surfaces, and at least one microcircuit embedded to the insulating-material layer. The...
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8351213 |
Electrical assembly
An electrical assembly including a substantially planar substrate having at least one recess therein and a plurality of electrical components. The electrical components are positioned in the at...
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8345433 |
Heterogeneous organic laminate stack ups for high frequency applications
Organic laminate stack ups are disclosed for a variety of applications, including high frequency RF applications. One or more inner core layers may be disposed between outer layers along with...
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8345434 |
High frequency circuit having multi-chip module structure
According to one embodiment, there is a high frequency circuit having a multi-chip module structure, including a semiconductor substrate set formed with discrete transistors connected in series, a...
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8344486 |
Semiconductor device and display apparatus
In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly,...
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8338294 |
Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods
Methods of forming semiconductor devices include providing a substrate including a layer of semiconductor material on a layer of electrically insulating material. A first metallization layer is...
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8339798 |
Printed circuit boards with embedded components
Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board...
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8339796 |
Embedded printed circuit board and method of manufacturing the same
Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when...
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8335084 |
Embedded actives and discrete passives in a cavity within build-up layers
Disclosed are any electronic system or module which includes embedded actives and discrete passives, and methods for use in fabricating packages containing embedded active devices and/or discrete...
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8331100 |
Device having several contact areas
A device has a first terminal, second terminal and at least four lateral faces provided with contact areas, of which two respective ones each are mutually opposite. The contact areas of the...
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8331103 |
Wiring board, method of manufacturing same, tuner module, and electronic device
Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the...
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8324509 |
Electronic component and manufacturing method thereof
The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can...
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8325490 |
Circuit manufacturing and design techniques for reference plane voids with strip segment
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
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8320134 |
Embedded component substrate and manufacturing methods thereof
An embodiment of an embedded component substrate includes: (1) a semiconductor device including lower, lateral, and upper surfaces; (2) a first patterned conductive layer including a first...
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8315060 |
Electronic component module and method of manufacturing the electronic component module
An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided...
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8314343 |
Multi-layer board incorporating electronic component and method for producing the same
In a multi-layer substrate including a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top...
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8310837 |
Circuit module and power line communication apparatus
A circuit module is mounted with an IC that modulates and demodulates a multicarrier signal. The circuit module has a laminated board, which is provided internally with a plurality of conductive...
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8309860 |
Electronic component built-in substrate and method of manufacturing the same
A method of manufacturing an electronic component built-in substrate, includes the steps of mounting a chip-like electronic component having a connection pad and a metal protection layer formed on...
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8305764 |
Method and semifinished product for producing an inlay
The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two...
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8305766 |
Electronic component-embedded printed circuit board and method of manufacturing the same
Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and...
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8300420 |
Circuit substrate for mounting electronic component and circuit substrate assembly having same
A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned...
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8300423 |
Stackable treated via package and method
A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in...
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8294036 |
Electronic component and electronic component module
In a dielectric element, the side faces are roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate and insulating...
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8289724 |
Signal-producing mechanism
The present invention provides devices for controlling a desired output of an output device. These devices include a first conductor, a second conductor having a varying, predetermined spacing from...
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8284561 |
Embedded component package structure
The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures...
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8284562 |
Electro device embedded printed circuit board and manufacturing method thereof
An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with...
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RE43720 |
Integrated circuit device having stacked dies and impedance balanced transmission lines
A multi-chip device which includes a plurality of integrated circuit die disposed one over another. Each integrated circuit die includes one or a plurality of bond pads. One or a plurality of...
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8279614 |
Modem, in particular for subsea power line communication
A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated...
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8279616 |
Printed circuit board with embedded chip capacitor
A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first...
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8270177 |
Electronic device and method for manufacturing electronic device
An electronic device is provided with an improved reliability and a reduced contamination in a functional unit of an exposed element, and a method for manufacturing thereof is also provided. An...
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8264848 |
Electrical assembly having impedance controlled signal traces
An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In...
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8264849 |
Mold compounds in improved embedded-die coreless substrates, and processes of forming same
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array...
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8264846 |
Ceramic package substrate with recessed device
A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array...
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8259460 |
Submount for electronic components
A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head...
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8253034 |
Printed circuit board and semiconductor package with the same
Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned...
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