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8792248 Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board  
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit...
8791558 Stacked semiconductor package  
A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a...
8786102 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a first wiring board, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first...
8780572 Printed circuit board having electronic component  
A printed circuit board that include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the...
8779299 Electronic component-embeded board and method for manufacturing the same  
An electronic component or the like is mounted on a substrate, and on the electronic component, an insulating layer is provided. Afterward, via-holes V are made in the insulating layer on terminals...
8780569 Electrical assembly having impedance controlled signal traces  
An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In...
8772644 Carrier with three-dimensional capacitor  
A carrier with three-dimensional capacitor includes a substrate and a three-dimensional capacitor, wherein the substrate comprises a trace layer having a first terminal and a second terminal. The...
8766099 Component mounting structures for electronic devices  
Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact...
8767408 Three dimensional passive multi-component structures  
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer...
8767398 Thermal management system for electrical components and method of producing same  
A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one...
8766104 Printed circuit boards including strip-line circuitry and methods of manufacturing same  
A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a...
8754335 Ceramic electronic component and wiring board  
A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external...
8745859 Component built-in module, and manufacturing method for component built-in module  
A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic...
8740444 Light source circuit boards  
Methods for manufacturing a light source circuit board having one or more light emitting components that include providing at least one circuit component on a light source circuit board, wherein...
8743555 Methods for suppressing power plane noise  
Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least...
8743560 Circuit board and semiconductor module including the same  
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a...
8743554 Apparatus for improved power distribution or power dissipation to an electrical component and method for the same  
Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer...
8737081 Cover structure and manufacturing method thereof  
A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second...
8736033 Embedded electronic device package structure  
An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer...
8737085 Wiring board with a built-in component and method for manufacturing the same  
Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and...
8717775 Fingerprint sensor package and method  
A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges...
8717016 Current sensors and methods  
Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a conductor portion having a first portion and a second portion; at least three slots formed in the...
8711572 Circuit board having semiconductor chip embedded therein  
A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole...
8705247 Circuit board and mother laminated body  
A circuit board includes a laminated body including insulation layers made of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the...
8704101 Package carrier and manufacturing method thereof  
In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed...
8699233 Circuit module and method of manufacturing the same  
Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of...
8692135 Wiring board capable of containing functional element and method for manufacturing same  
A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating...
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each...
8659143 Stub minimization for wirebond assemblies without windows  
A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending...
8659142 Stub minimization for wirebond assemblies without windows  
A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to...
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the...
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second...
8654538 Wiring board and method for manufacturing the same  
A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple...
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through...
8654539 Capacitor-incorporated substrate and component-incorporated wiring substrate  
An object of the present invention is to provide a capacitor-incorporated wiring substrate in which connection reliability can be improved through ensuring of a path for supply of electric...
8649183 Electronic assembly  
An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large...
8638567 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
8629354 PCB having embedded IC and method for manufacturing the same  
A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to...
8625300 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
8618421 Electronics component embedded PCB  
An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed...
8619431 Three-dimensional system-in-package package-on-package structure  
The present invention provides a three-dimensional System-In-Package (SIP) Package-On-Package (POP) structure comprising a support element formed around a first electronic device. A filling...
8614898 Printed wiring board, electronic device, and printed wiring board manufacturing method  
A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the...
8592691 Printed wiring board  
A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film...
8593823 Suspension board with circuit  
A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically...
8587955 Electronic device with a ceramic component  
An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The...
8575763 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a first wiring hoard, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first...
8575496 Multilayer printed wiring board and method of manufacturing the same  
A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes...
8559184 Electronic component built-in substrate and method of manufacturing the same  
A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is...
8558636 Package embedded equalizer  
A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be...
8546922 Wiring board  
A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first...