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7636242 |
Integrated inductor
An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein.
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7630206 |
Releasably mountable electronics component
A releasably mountable electronics component is provided. The electronics component comprises a backing having a mounting surface and an electronic module joined to the mounting surface of the...
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7625222 |
Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus
According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface...
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7626827 |
High density in-package microelectronic amplifier
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package...
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7613007 |
Power core devices
The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated...
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7609527 |
Electronic module
An electronic module in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the surface of the insulating-material layer. The conductive...
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7606047 |
Module with embedded electronic components
In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7593235 |
Thermal conduit
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit...
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7586755 |
Electronic circuit component
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small...
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7582834 |
Printed circuit board having reduced mounting height
A printed circuit board including an opening for receiving a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7557302 |
Printed circuit board with electrostatic discharge damage prevention
A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The...
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7554822 |
Power converter for led large area light source lamp
Power converter for receiving an input current at an input voltage and for providing an output current at an output voltage. The power converter comprises a transformer ( 133 ) having a primary (...
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7550842 |
Integrated circuit assembly
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
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7551454 |
Thin-film assembly and method for producing said assembly
A thin-film assembly ( 1 ) including a substrate ( 2 ) and at least one electronic thin-film component ( 8 ) applied on the substrate by thin-film technology, wherein a base electrode ( 4 ) is...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7545652 |
Printed circuit board and differential signaling structure
Provided is a system adopting a differential signaling system including a low frequency signaling line arranged to be adjacent to a pair of differential signaling lines in parallel to each other,...
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7542301 |
Creating recessed regions in a substrate and assemblies having such recessed regions
An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge....
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7542302 |
Minimizing thickness of deadfronted display assemblies
An apparatus is provided and includes a label layer, disposed in a user visible interface of a front bezel, in which an icon is etched, a multi-layer printed circuit board (PCB), abutting a rear...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7535728 |
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid...
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7531755 |
Trimming of embedded structures
The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates,...
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7525602 |
Liquid crystal television apparatus
A liquid crystal television apparatus includes a tuner, a signal processor, a liquid crystal cell, a light source for backlight, an inverter, and a power supply, includes a first circuit board...
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7525814 |
Wiring board and method for manufacturing the same
A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed...
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7523551 |
Manufacturing method of a multi-layer circuit board embedded with a passive component
A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points;...
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7521779 |
Roughened printed circuit board
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
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7520978 |
Fluid purification system with ultra violet light emitters
A system for purifying a fluid uses ultra violet (UV) light to inactivate micro-organisms present in the fluid. The system has an arrangement of UV light emitters on perforated plates. The fluid,...
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7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
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7515434 |
Technique for enhancing circuit density and performance
A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and...
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7515448 |
AC adapter which can be reduced in size and lowered in profile
In an AC adapter provided with a circuit board having first and second surfaces opposite to each other in a thickness direction, a transformer portion is mounted on the circuit board. A secondary...
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7511940 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
Disclosed is a method of fabricating a metal-insulator-metal (MIM) capacitor. In this method, a dielectric layer is formed above a lower conductor layer and an upper conductor layer is formed above...
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7505282 |
Laminated bond of multilayer circuit board having embedded chips
A multilayer circuit board has a bottom and an upper multilayer circuit boards, a glue layer, multiple outer contact vias and two insulating lacquer layers. The bottom and the upper multilayer...
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7505283 |
Reinforcing structure for metal core board and electric connection box
The metal-core-board reinforcing structure has a metal core board having a metal core and a resin plate having substantially the same extent as that of the metal core board and being fixedly...
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7495929 |
Reference layer openings
A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
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7491896 |
Information handling system utilizing circuitized substrate with split conductive layer
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a...
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7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
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7488897 |
Hybrid multilayer substrate and method for manufacturing the same
A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic...
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7485489 |
Electronics circuit manufacture
A circuit with embedding components ( 13 ) is produced by placing the components ( 13 ) on a substrate ( 14 ) and applying sheets ( 15 ) of prepreg. The prepreg sheets ( 15 ) have apertures to...
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7483277 |
Method and apparatus for inspecting component mounting accuracy
A component is mounted in a component mounting position on a component mounting-side surface of an inspection-use board which is formed from a light transmitting material and which has a reflecting...
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7479604 |
Flexible appliance and related method for orthogonal, non-planar interconnections
At least one flexible appliance ( 120 ) and related method ( 300 ) for orthogonal, non-planar interconnections of at least a first electronic interface ( 115 ) disposed on a substrate ( 110 ) to an...
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7480151 |
Wiring board and method of manufacturing the same
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7480150 |
Printed wiring board and method of manufacturing the same
In a printed wiring board 10 , an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first...
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7477523 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist...
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7453705 |
Barrier, such as a hermetic barrier layer for O/PLED and other electronic devices on plastic
A protective layer for an electronic device and devices with a protective layer. In one exemplary embodiment, the protective layer includes two different layers which can be etched by the same...
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7453702 |
Printed wiring board
A printed wiring board comprises the insulating layer 11 ( 12 ); at least one resistance element 31 1 ( 31 2 ) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in...
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7450395 |
Circuit module and circuit device including circuit module
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between....
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7450393 |
Driver chip and display apparatus including the same
A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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