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9039271 Interface and fabrication method for lighting and other electrical devices  
Interfaces for electrical (e.g., lighting) devices involve use of electrically conductive edge contacts arranged on or protruding from edges of printed circuit boards (PCBs) that provide or...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9036356 Printed circuit board laminate  
A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of...
9036357 Display device and method of manufacturing the same  
A method of manufacturing a display device includes preparing a display panel that has a display region where an image is displayed and a non-display region adjacent to the display region, and...
9030836 Apparatus capable of selectively using different types of connectors  
An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector...
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9013870 Electrical assembly having impedance controlled signal traces  
An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In...
9007779 Electronic apparatus and hard disk drive  
According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion...
8998620 Molding method for COB-EUSB devices and metal housing package  
A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads,...
8995145 Circuit board unit  
A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block...
8995141 Connector pin on springs  
An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.
8995142 Power module and method for manufacturing the same  
Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention...
8995146 Electrical assembly and method  
An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one...
8988885 Electronic circuit module and method for producing the same  
An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a...
8988889 Connection wire structure of direct light bar and connection method thereof  
The present invention relates to a connection wire structure of a direct light bar and a connection method thereof. The connection wire structure of the direct light bar includes a plurality of...
8988891 Micro and millimeter waves circuit  
Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is...
8988893 Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device  
A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to...
8981881 Stacked module  
A stacked module includes a first multilayer substrate including an opening having a stepwise wall face, and a first transmission line including a first grounding conductor layer, a second...
8976527 Force and heat spreading PCB for LCD protection and interconnection  
The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed...
8971054 Component assembly  
A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in...
8971053 Wiring board and method for manufacturing the same  
A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer...
8971006 Electronic control device including interrupt wire  
An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The...
8964392 Device for screening an electronic module  
A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically...
8964403 Wiring board having a reinforcing member with capacitors incorporated therein  
There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an...
8963017 Multilayer board  
In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base...
8964409 Electronic module with EMI protection  
An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is...
8964407 Substrate with built-in electronic component  
A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating...
8963016 Printed wiring board and method for manufacturing same  
Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is...
8953330 Security protection device and method  
A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further...
8952262 Component-incorporated wiring substrate and method of manufacturing the same  
A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a...
8953335 Semiconductor control device  
A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that...
8947884 Support for a printed circuit assembly  
A device includes a printed circuit assembly (PCA) including a printed circuit board and at least one electronic component integrated with the printed circuit board, and a support to which the PCA...
8946562 Printed circuit boards including strip-line circuitry and methods of manufacturing same  
A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first...
8942003 Multilayered printed wiring board  
A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality...
8942002 Three dimensional passive multi-component structures  
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first...
8941016 Laminated wiring board and manufacturing method for same  
A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the...
8937255 Superconductive multi-chip module for high speed digital circuits  
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting...
8937257 Electronic module  
An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed...
8934258 Motor controller  
A motor controller comprising multiple types of interfaces assigned automatically, including a mother circuit board and a daughter circuit board. The daughter circuit board is plugged into the...
8929090 Functional element built-in substrate and wiring substrate  
An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the...
8923003 Flexible circuit connectors with reduced profiles  
An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact...
8923007 Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)  
In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at...
8923009 Substrate with built-in electronic component  
In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four...
8923004 Microelectronic packages with small footprints and associated methods of manufacturing  
Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate,...
8921706 Component-embedded substrate, and method of manufacturing the component-embedded substrate  
A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the...
8923008 Circuit board and method for manufacturing circuit board  
A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and...
8916780 Z-directed delay line components for printed circuit boards  
A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the...
8917520 Circuit substrate  
A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the...
8912639 IC package with embedded transformer  
Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a...
8913402 Triple-damascene interposer  
This interposer provides interconnections between stacked layers of circuits, which may include integrated circuits, PC boards, and hybrid substrates. Fabricated as an integrated circuit itself...