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8873245 Embedded chip-on-chip package and package-on-package comprising same  
An embedded chip-on-chip package includes a printed circuit board having a recessed semiconductor chip mounting unit constituted by a recess in the printed circuit board and a circuit pattern at...
8872041 Multilayer laminate package and method of manufacturing the same  
A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a...
8867225 Wiring board  
A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first...
8867226 Monolithic microwave integrated circuits (MMICs) having conductor-backed coplanar waveguides and method of designing such MMICs  
A MMIC having: a substrate; a plurality of active and passive electrical elements disposed on a top surface of the substrate; a plurality of coplanar waveguide transmission line sections disposed...
8861215 Semiconductor device  
A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals...
8853559 Insulation circuit board, and power semiconductor device or inverter module using the same  
The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device,...
8848385 Embedded isolation filter  
The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing...
8837159 Low-profile circuit board assembly  
Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer...
8835773 Wiring board and method of manufacturing the same  
A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted;...
8830690 Minimizing plating stub reflections in a chip package using capacitance  
Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an...
8829355 Multilayer printed wiring board  
A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material...
8829839 System and method for temperature estimation in an integrated motor drive  
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the...
8830692 Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component  
A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having...
8826527 Electronic component-embedded printed circuit board and method of manufacturing the same  
Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and...
8829356 Packaging substrate having a passive element embedded therein and method of fabricating the same  
A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element...
8824156 Pocket-enabled chip assembly for implantable devices  
Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living...
8824163 RF layered module using three dimensional vertical wiring and disposing method thereof  
Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical...
8817485 Single-layer component package  
A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in...
8811019 Electronic device, method for producing the same, and printed circuit board comprising electronic device  
An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least...
8804362 High-frequency module  
In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged...
8804361 Wiring substrate  
A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and...
8804363 Printed circuit boards with embedded components  
Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board...
8802998 Ceramic multilayer substrate and method for producing the same  
A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding...
8804358 Method of forming an electronic multichip module  
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting...
8797755 Wiring board and manufacturing method of wiring board  
There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is...
8792248 Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board  
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit...
8791558 Stacked semiconductor package  
A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a...
8786102 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a first wiring board, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first...
8780572 Printed circuit board having electronic component  
A printed circuit board that include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the...
8779299 Electronic component-embeded board and method for manufacturing the same  
An electronic component or the like is mounted on a substrate, and on the electronic component, an insulating layer is provided. Afterward, via-holes V are made in the insulating layer on terminals...
8780569 Electrical assembly having impedance controlled signal traces  
An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In...
8772644 Carrier with three-dimensional capacitor  
A carrier with three-dimensional capacitor includes a substrate and a three-dimensional capacitor, wherein the substrate comprises a trace layer having a first terminal and a second terminal. The...
8766099 Component mounting structures for electronic devices  
Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact...
8767408 Three dimensional passive multi-component structures  
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer...
8767398 Thermal management system for electrical components and method of producing same  
A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one...
8766104 Printed circuit boards including strip-line circuitry and methods of manufacturing same  
A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a...
8754335 Ceramic electronic component and wiring board  
A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external...
8745859 Component built-in module, and manufacturing method for component built-in module  
A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic...
8740444 Light source circuit boards  
Methods for manufacturing a light source circuit board having one or more light emitting components that include providing at least one circuit component on a light source circuit board, wherein...
8743555 Methods for suppressing power plane noise  
Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least...
8743560 Circuit board and semiconductor module including the same  
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a...
8743554 Apparatus for improved power distribution or power dissipation to an electrical component and method for the same  
Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer...
8737081 Cover structure and manufacturing method thereof  
A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second...
8736033 Embedded electronic device package structure  
An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer...
8737085 Wiring board with a built-in component and method for manufacturing the same  
Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and...
8717775 Fingerprint sensor package and method  
A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges...
8717016 Current sensors and methods  
Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a conductor portion having a first portion and a second portion; at least three slots formed in the...
8711572 Circuit board having semiconductor chip embedded therein  
A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole...
8705247 Circuit board and mother laminated body  
A circuit board includes a laminated body including insulation layers made of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the...
8704101 Package carrier and manufacturing method thereof  
In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed...