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4945323 |
Filter arrangement
A filter arrangement is described for filtering a plurality of conductors which are guided from a space comprising electromagnetic fields through a separating wall to a device located in a shielded...
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4931908 |
Housing for an electronic circuit
The housing comprises a bottom 1 in the thickness of which the extension of an input/output pin 5 of the housing is embedded. This extension ends in a contact terminal 15 which lies flush with the...
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4922376 |
Spring grid array interconnection for active microelectronic elements
A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures...
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4907125 |
Circuit module including a plate-shaped circuit carrier of glass or ceramic
A metal plate is connected over a large area to one side of a glass or ceramic substrate for good heat distribution and removal. The metal plate consists of three layers, namely two outer copper...
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4890153 |
Single bonding shelf, multi-row wire-bond finger layout for integrated circuit package
An integrated circuit assembly (10) includes a bipolar VLSI die (12) contained in a multilayer ceramic pin-grid array package (14). A bonding shelf (18) defined on a single ceramic layer contains...
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4878155 |
High speed discrete wire pin panel assembly with embedded capacitors
Decoupling capacitance is provided with negligible inductance in a high speed discrete wire logic panel by the use of SMT (surface mounting) capacitors that are mounted in holes in the circuit...
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4860442 |
Methods for mounting components on convoluted three-dimensional structures
There is disclosed a method of mounting a pressure transducer on a convoluted three-dimensional structure as for example a turbine blade. The method first forms a groove on a surface of a blade....
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4806808 |
Printed circuit board for external rotor motor with recess for Hall transducers
In order to be able to decrease the axial height, while simultaneously simplifying the manufacture, and also increasing the operational safety of printed circuit boards with electrical structural...
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4780794 |
Electronic device
A electronic multilayer device is formed within a photocured insulative layer using a transparent substrate thereby forming a surface contamination free device without shorts between the layers of...
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4773955 |
Printed wiring board for mounting electronic parts and process for producing the same
A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a...
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4772820 |
Monolithic flat panel display apparatus
Methods for fabricating monolithic flat panel displays together with the resulting display are disclosed in accordance with the teachings of the present invention. According to the invention the...
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4758927 |
Method of mounting a substrate structure to a circuit board
A substrate structure having contact pads is mounted to a circuit board which has pads of conductive material exposed at one main face of the board and has registration features which are in...
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4758063 |
Optical device and circuit board set
A plane or "board" for use in the interconnection of a plurality of optical circuit devices is disclosed. Each circuit device will have attached at least one optical signal transmission fiber or...
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4742431 |
Flexible circuit board
A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for...
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4737742 |
Unit carrying surface acoustic wave devices
A unit comprising a printed board on which a plurality of surface acoustic wave (SAW) devices are installed. Each SAW device comprises a piezoelectric substate on which arrays of strip electrodes...
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4729061 |
Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
The invention discloses an improved PC board package for at least one integrated circuit die utilizing a plurality of PC boards bonded together to form a composite. The composite has at least one...
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4707765 |
Printed wiring board mounted control instrument
A control instrument which is mounted in a recess on a printed wiring board is disclosed. The control instrument includes terminals, provided at a bottom surface and offset from a central plane,...
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4705917 |
Microelectronic package
A microelectronic package for the protection, housing, cooling and interconnection of a microelectronic chip. The package is made of a plurality of ceramic layers, each of which carries a...
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4688867 |
Circuit board with integral positioning means
A circuit board with circuit paths on the upper and/or lower surface, the conductive paths being adapted to provide a connection between the components located on the surfaces. Positioning elements...
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4686607 |
Daughter board/backplane assembly
A daughter board/backplane assembly including a backplane having first and second surfaces and holes extending from the first surface to the second surface, pairs of separate first contacts having...
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4675787 |
Thin electronic apparatus
According to this invention, a plate member provided at a thin electronic apparatus reinforces same using the rigidity of the plate member, makes opposite contacts able to contact using a...
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4653822 |
Electronic apparatus with a battery
An electronic apparatus having a battery as an electrical power supply and a battery chamber formed by a frame. A contact with the battery and an engaging member that engages with a portion of the...
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4635093 |
Electrical connection
An improved electrical connection between a leadless chip carrier and one or more circuits on a printed circuit board is disclosed. A solder fillet connects a metallization layer on the groove face...
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4630172 |
Semiconductor chip carrier package with a heat sink
A semiconductor chip carrier and contact array package having an apertured dielectric bottom layer (11), one or more chip connection layers such as wire bond layers (16, 17) insulated from one...
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4628527 |
Mini hearing aid
A miniature hearing aid (1) includes a microphone (12), a receiver (14) an amplifier (15), and a battery connectable via a contact (18), all of which are contained in a housing (2,3). The amplifier...
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4618879 |
Semiconductor device having adjacent bonding wires extending at different angles
A semiconductor device includes a semiconductor chip, a package for housing the semiconductor chip, and wires for bonding one of a plurality of electrodes formed on the semiconductor chip and one...
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4616655 |
Implantable pulse generator having a single printed circuit board and a chip carrier
The implantable pulse generator herein may take the form of a cardiac pacer. The generator includes a pulse generator circuit including passive and active chips. These are mounted on a chip carrier...
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4614837 |
Method for placing electrically conductive paths on a substrate
A process for placing conductive paths on to the surface of a heat softenable substrate by applying a layer of metal powder to the substrate, compacting the powder in a pre-determined pattern by...
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4614194 |
Implantable pulse generator having a single printed circuit board for carrying integrated circuit chips thereon with chip carrier means
The human implantable pulse generator herein may serve as a cardiac pacer. The housing for the generator is minimized in size by mounting integrated circuit chips, forming the pulse generator...
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4604678 |
Circuit board with high density electrical tracers
An improved circuit board having electrically conductive traces connected to respective terminals of a number of electrically current components mounted on a substrate. The substrate has cavities...
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4602318 |
Substrates to interconnect electronic components
Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the...
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4540226 |
Intelligent electronic connection socket
An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the...
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4539445 |
Click disc switch assembly
There is disclosed a click disc switch assembly comprising a plate-like base having on it electroconductive ink paths including (a) "row" paths each including a respective row of contact pads in a...
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4511796 |
Information card
Disclosed herein is an information card consisted of a card member formed with a circular hole in a position thereof and an information unit disposed within said hole, said unit comprising...
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4410927 |
Casing for an electrical component having improved strength and heat transfer characteristics
A casing for an electrical component comprises a metal base member. A metal housing member is mounted on the base member to provide a hollow enclosed casing for receiving the electrical component....
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4405971 |
Electrical circuit apparatus
Electrical circuit apparatus comprising a mother board having pattern of conductive leads on a surface thereof and including at least one opening therein of predetermined size and shape into which...
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4402135 |
Method of forming a circuit board
A circuit board is fabricated by injection molding a support of an insulating material. The support is provided with channels in the pattern of conductive paths. The channels are filled by...
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4393438 |
Porcelain coated metal boards having interconnections between the face and reverse surfaces thereof
In accordance with this invention a porcelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In...
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4392181 |
Circuit board and contact assemblies
A row of connectors 14 is assembled on a printed circuit board 11 by inserting a leg section 41 of each terminal 14 into a mounting aperture 32 and bending a flat contact portion 42 of each...
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4361862 |
Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor
Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface...
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4336419 |
Construction for mounting plate-like electric parts
A construction for mounting plate-like electric parts within insertion holes formed in a printed circuit board is described which has additional holes for releasing any gases formed by soldering...
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4150420 |
Electrical connector
This disclosure describes an electrical connector for joining microcircuit or microcircuit modules, such as leadless integrated or hybrid circuit carriers to utilization means, such as printed or...
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4126882 |
Package for multielement electro-optical devices
Disclosed is a semiconductor device package for a multielement electro-optical device. The package includes a base structure, a cover and an environmental seal. The cover is secured with screws to...
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4120020 |
Electronic component with heat cooled substrates
An electronic module having two insulating substrates which are provided with printed wiring and which are connected to circuit elements, and mounted against opposite sides of a heat-dissipating...
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4089041 |
Circuit programming device
The present invention relates to a circuit selection or programming device for a printed circuit board wherein a plurality of strap conductors are mounted on a dielectric substrate and provided...
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4079284 |
Mounting piezoelectric elements
A method of mounting an elongate piezoelectric element on a laminated printed wiring board by forcing said element into the board at an angle normal to the surface of the board and at a point where...
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4049227 |
Mounting arrangement for electrical components and electrical component cases adapted to be used therewith
This invention relates to mounting blocks for receiving electrical components encased in individual cases. The mounting blocks include a plurality of openings and the electrical component...
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4030001 |
Co-planar lead connections to microstrip switching devices
A method and apparatus are disclosed for providing co-planar connections to the terminal leads of a switching device from circuit elements located on opposite sides of a planar microstrip...
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4027206 |
Electronic cooling chassis
Electronic apparatus employing components generating substantial amounts of heat to be dissipated, and particularly solid state components, is in the form of a subassembly that includes a heat sink...
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3934336 |
Electronic package assembly with capillary bridging connection
An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends...
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