Matches 501 - 550 out of 695 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 >
Match Document Document Title
5321585 Directly solderable auxiliary circuit board assembly and methods of making and using the same  
Disclosed is a directly solderable circuit board assembly including a main circuit board directly connected to an auxiliary circuit board without the use of interfacing terminals. The main circuit...
5319525 Circuit assembly  
A circuit assembly comprises a plurality of electronic devices mounted on a circuit board, including a matched pair of devices intended for use together in the same circuit. In order to reduce the...
5319522 Encapsulated product and method of manufacture  
A method is provided for encapsulating an object with a heat-shrinkable material prior to subjecting the encapsulated object to insert, injection molding. The encapsulation protects the object from...
5319521 Ceramic frames and capsules for Z-axis modules  
The Ceramic frames and capsules for Z-axis modules shown herein are formed by placing chips 10 into a ceramic frame 12, breaking apart the frame 12 into sub-frames 26, and bonding the sub-frames 26...
5315486 Hermetically packaged HDI electronic system  
A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a...
5313367 Semiconductor device having a multilayer interconnection structure  
Actualized are fingers through which a semiconductor integrated circuit including high density electrode strings can be easily safely mounted on a circuit substrate in the same manner with the...
5311403 Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate  
A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the...
5311400 Low profile header assembly for an encapsulated instrument  
A low profile header assembly for an encapsulated instrument includes a plate member with a cavity which is on the side of the plate member external to the instrument. Terminal pins extend through...
5309322 Leadframe strip for semiconductor packages and method  
A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip...
5307241 Electronic circuit board arrangements including main auxiliary circuit boards  
A electronic circuit board arrangement includes a main circuit board on which components are mounted, with component leads passing through holes in this board. Additional components are provided on...
5303123 Retainer for removable circuit board components  
A retainer for removable components that plug into a printed circuit board retains the removable component in an associated sockets on a printed circuit board. The retainer has the form of a clip...
5300812 Plasticized polyetherimide adhesive composition and usage  
A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density...
5299096 LED mounting holder and device for mounting LED using it  
An LED mounting holder for mounting one or more LEDs on a printed circuit board and for having the printed circuit board on a front panel of an electronic apparatus with the LEDs mounted on the...
5299094 IC card including multiple substrates bearing electronic components  
An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both...
5291375 Printed circuit board and electric device configured to facilitate bonding  
A circuit board for mounting an electric device having a plurality of leads, the circuit board including an insulating substrate and a pad electrode formed on the insulating substrate, the pad...
5289342 System with cooling of electronic components on a circuit board  
The system includes a circuit board on which electrical components are mounted. The components are mounted on the front side of the board, and the back side of the board is thermally coupled to the...
5287247 Computer system module assembly  
A computer system module includes a central processing unit (CPU), a floating-point accelerator (FPA), a read/write buffer (RWB), cache memory, a clock generator, buffers, and reset logic. The...
5285352 Pad array semiconductor device with thermal conductor and process for making the same  
A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal...
5278728 Diode mounting  
A mounting assembly for a plurality of bipolar electrical components connected between two generally parallel electrical supports, each bipolar electrical component having a lower base terminal...
5276590 Flex circuit electronic cards  
A flex circuit, which is fabricated from metallization on thin film, is mounted between two opposite sides of frame to form an electronic card sized to fit as a replacement for a rigid epoxy glass...
5264990 Integrated circuit card that aids in reducing stress on an integrated circuit  
The invention relates to an integrated circuit card comprising a card support (130) which has a cavity (101) in which a vignette (200) is fixed, which vignette (200) comprises a circuit support...
5261153 In situ method for forming a capacitive PCB  
An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides...
5257165 Pin grid array adaptor mounting hardware  
A PGA adaptor mounting hardware comprising a PGA adaptor which has a plurality of double-head fastening pins and contact pins with flush type contact terminals, and a printed circuit board which...
5255158 Microwave connector assembly connected easily to microwave circuit components  
A microwave circuit component (40) has terminals and is mounted on a principal surface (38) of a substrate (34) received in a cavity (45) of a housing (35) with a additional surface (39) brought...
5255157 Plastic pin grid array package with locking pillars  
A plastic pin grid array package is detailed. Where the semiconductor device is mounted within a cavity in the printed wiring board, it is surrounded by a ring of holes that extend completely...
5241456 Compact high density interconnect structure  
An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which...
5241455 L-shaped channel wiring method  
To minimize the area of an L-shaped channel wiring region between VLSI circuit blocks, a trunk 1 is formed in the direction along L-shaped sides A and B in the wiring region interposed between the...
5239127 Electrical interconnect apparatus  
An apparatus provides an electrical connection (113) between an RF shield (109) and a printed circuit board (115) in a radio communication device (100). A spring member (211), having a free end...
5237485 Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board  
A heat sink and method for heat sinking a package containing electronic components is described. The heat sinking is accomplished by use of a cooling plate located beneath a circuit board. The...
5235131 RF shield fabrication method  
An RF conductive shield can be fabricated from, and adhered to, a nonconductive substrate in the following manner. The RF conductive shield is fabricated in a predetermined geometric shape on the...
5233504 Noncollapsing multisolder interconnection  
An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump...
5233503 Pressure-contact type semiconductor device  
A pressure-contact type semiconductor device with pressure-contact electrodes for external connection is disclosed. The pressure-contact electrodes are mounted through an insulating material on a...
5229548 Circuit board having a stamped substrate  
A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the...
5205032 Electronic parts mounting apparatus  
An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined...
5200884 Electrical control device  
A control instrument has a body which is provided at the bottom surface thereof with a plurality of terminals. The terminals are folded upwardly along the side surfaces thereof and the body is...
5177324 In situ RF shield for printed circuit board  
A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically...
5138115 Carrierles surface mounted integrated circuit die  
An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed...
5130889 Integrated circuit protection by liquid encapsulation  
A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends...
5121293 Method and apparatus for interconnecting devices using tab in board technology  
A Tape Automated Bonding (TAB) process prepared multi-chip module (MCM) has semiconductor dice embedded into the substrate of the MCM through its top face. A heatsink, which in a preferred...
5102720 Co-fired multilayer ceramic tapes that exhibit constrained sintering  
Shrinkage is substantially reduced or eliminated in the x-y plane during co-firing interposing predominantly ceramic layer between predominantly glass layers in the green multilayer assembly. The...
5068631 Sub power plane to provide EMC filtering for VLSI devices  
Electromagnetic filtering for a VLSI device having multiple power input leads is realized by employing a sub-power plane which is physically separate from a main power distribution system on a...
5065277 Three dimensional packaging arrangement for computer systems and the like  
A three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed....
5055637 Circuit boards with recessed traces  
Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves...
5042145 Method for mounting an electronic component and memory card using same  
A method for mounting a LSI chip (1) with conductive bumps (2, 3, 4) as terminals into a hole (15) of a card (5) and for interconnecting them. The card and therefore one end of the hole is first...
5038132 Dual function circuit board, a resistor element therefor, and a circuit embodying the element  
A dual function circuit board substrate has a layer or sheet of ultrathin metal of relatively high electrical resistivity having a selected sheet resistivity characteristic bonded to a thin layer...
4994938 Mounting of high density components on substrate  
A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having...
4992925 Converter with intermediate d.c. circuit  
A converter with an intermediate d.c. circuit includes power components grouped together in a plurality of modules. Bus bars are provided to which the modules are connected.
4992688 Printed circuit board with a metallic layer for supporting an electrical component  
A composite printed circuit board having a metallic layer supporting body with a first insulating layer thereon and wherein the insulating layer has copper printed circuits placed thereon. The...
4985601 Circuit boards with recessed traces  
Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves...
4959750 Printed circuit board for carrying a mixed-component assembly  
A printed circuit board provided for mixed-component assembly of electrically hard-wired and surface-mounted components which eliminates the difficulties of bonding large components and which...
Matches 501 - 550 out of 695 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 >