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9041181 Land grid array package capable of decreasing a height difference between a land and a solder resist  
A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a...
9040841 Axiocentric scrubbing land grid array contacts and methods for fabrication  
A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier...
9036366 Terminal unit  
The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9036356 Printed circuit board laminate  
A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of...
9036357 Display device and method of manufacturing the same  
A method of manufacturing a display device includes preparing a display panel that has a display region where an image is displayed and a non-display region adjacent to the display region, and...
9036359 Component built-in module, electronic device including same, and method for manufacturing component built-in module  
A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface...
9035196 Circuit board and method of manufacturing the same  
Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core...
9036364 Circuit board with signal layers of different dimensions to communicate signals of different frequencies  
Electronic devices to output signals at different frequencies are mounted to a circuit board that has a group of layers, where the group of layers include reference plane layers and signal layers...
9030839 Track pad acoustic features related to a portable computer  
The present application describes various embodiments of systems and methods for providing internal and external components for portable computing devices having a thin profile. More particularly,...
9030836 Apparatus capable of selectively using different types of connectors  
An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector...
9025339 Adhesive dam  
On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the...
9019714 Circuit component and method of making the same  
The present invention provides a circuit component that enables satisfactory connection between a substrate and an IC chip and a method of making the same. The circuit component includes an IC...
9018537 Surface-mountable electronic device  
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion....
9019715 Touch panel and touch display panel  
A touch panel includes a substrate, a transparent sensor electrode pattern, a patterned compensation electrode, a passivation layer, a transparent shielding electrode and at least one connection...
9013891 3-D integrated package  
An electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed...
9013890 Semiconductor packages and methods for producing the same  
In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the...
9013894 Printed circuit board and method for manufacturing the same  
A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion...
9013892 Chip stacking structure  
A chip stacking structure including a plurality of microbump structures, a plurality of first substrates, at least one first space layer, a plurality of second substrates and at least one second...
9012787 Electronic system for wave soldering  
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for...
9001518 Power module with press-fit clamps  
According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one...
9000303 Method for preparing a patterned electric circuit  
The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an...
9001519 Protective circuit module and battery pack having the same  
A protective circuit module and a battery pack having the same are disclosed. In one embodiment, the protective circuit module includes a printed circuit board, an electronic device mounted on a...
9000306 Interconnect board and electronic apparatus  
An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that...
9001522 Printed circuits with staggered contact pads and compact component mounting arrangements  
Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array...
8995145 Circuit board unit  
A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block...
8995146 Electrical assembly and method  
An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one...
8995137 Modular mass storage system and method therefor  
A modular mass storage system and method that enables cableless mounting of ATA and/or similar high speed interface-based mass storage devices in a computer system. The system includes a printed...
8995144 On board wireless module architecture  
Embodiments of the present disclosure provide an assembly comprising circuitry of a wireless module disposed on a first region of a circuit board, and circuitry of a host controller module...
8995141 Connector pin on springs  
An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.
8995142 Power module and method for manufacturing the same  
Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention...
8987875 Balanced stress assembly for semiconductor devices  
An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the...
8988888 Instrument device  
A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the...
8988893 Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device  
A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to...
8988889 Connection wire structure of direct light bar and connection method thereof  
The present invention relates to a connection wire structure of a direct light bar and a connection method thereof. The connection wire structure of the direct light bar includes a plurality of...
8988890 Component mounting structures with breakaway support tabs  
Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or...
8982561 Lightweight audio system for automotive applications and method  
A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio...
8983399 Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system  
Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and...
8982580 Electronic device  
In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and...
8982564 Electronic device  
An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic...
8982578 Connector system and assembly having integrated protection circuitry  
A system configured to protect a load within a vehicle includes a plug subassembly and a sensor connector subassembly. The sensor connector subassembly is selectively connectable to the plug...
8975535 Many-up wiring substrate, wiring substrate, and electronic device  
In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality...
8975529 Interposer and electronic device using the same  
There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness...
8975755 Chip package  
An embodiment of the disclosure provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface...
8964403 Wiring board having a reinforcing member with capacitors incorporated therein  
There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an...
8959759 Method for assembling computer modules small in thickness  
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and...
8964395 System and method for managing cooling airflow for a multiprocessor information handling system  
Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing...
8964410 Transformer with externally-mounted rectifying circuit board  
A transformer has two magnetic cores, at least one primary winding unit mounted in the magnetic cores, at least one secondary winding unit mounted in the magnetic cores and two rectifying circuit...
8964402 Electronic device, interposer and method of manufacturing electronic device  
An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second...
8964407 Substrate with built-in electronic component  
A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating...