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7619316 |
Semiconductor package and method for manufacturing the same
A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal...
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7615856 |
Integrated antenna type circuit apparatus
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes...
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7613007 |
Power core devices
The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated...
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7612294 |
Electrical component having a flat mounting surface
An electrical component includes a base object made of two insulating objects with curved external surfaces, and external electrodes. Each of the external electrodes is disposed adjacent to one of...
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7609527 |
Electronic module
An electronic module in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the surface of the insulating-material layer. The conductive...
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7609526 |
Circuit board
A circuit board including a capacitor structure formed on a surface of an insulating substrate, wherein the capacitor structure includes paired linear conductive layers arranged on the surface of...
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7606400 |
Arrangement for authentication of a person
A capacitive fingerprint sensor is fabricated on a plastic substrate ( 363 ) with an embedded integrated circuit chip ( 380 ). The invention describes a way to create two or three dimensional forms...
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7606046 |
Semiconductor device and method for mitigating electrostatic discharge (ESD)
A semiconductor device including a PCB including conductive patterns formed on at least one surface of the PCB, external connection terminals including at least one ground terminal and coupled to...
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7606040 |
Memory module system and method
Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of...
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7602614 |
Electronic module and method for the production thereof
An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a...
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7601920 |
Surface mount composite electronic component and method for manufacturing same
The present invention provides a surface mount composite electronic component which can be made compact. The structure of the surface mount composite electronic component is one in which a circuit...
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7599191 |
Electrochemical low ESR capacitor with connector
An electrochemical double layer capacitor (DLC) is configured for mounting on a PCB. A first connector component is configured at each individual terminal lead of the DLC capacitor. A second...
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7599190 |
High-frequency module, and method of producing same
A high-frequency module having a communication function is provided which includes a base substrate block ( 2 ) formed from organic substrates ( 11, 12 ), the organic substrate ( 11 ) having wiring...
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7598459 |
Electronic board, method of manufacturing the same, and electronic device
An electronic board includes: a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; rearrangement wiring for the...
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7595999 |
System and method for coupling an integrated circuit to a circuit board
An information handling system circuit board has an opening formed through it proximate a coupling point of an integrated circuit to the circuit board. The opening manages stress at the coupling...
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7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
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7595546 |
Printed circuit board
Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions....
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7593236 |
Semiconductor light emitting device
A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2 ; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted;...
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7593235 |
Thermal conduit
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit...
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7593234 |
Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
Disclosed herein is an electro-optical device including a substrate for the electro-optical device connected with a flexible circuit board, wherein the flexible circuit board partially faces one...
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7593231 |
Adhesive sheet for attaching an electronic part and an electronic device having such an electronic part
An electronic device includes an element having a surface, an electronic part having a surface to be adhesively attached to the surface of the element, and an adhesive sheet having a first adhesive...
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7586758 |
Integrated circuit stacking system
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of...
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7586756 |
Split thin film capacitor for multiple voltages
An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful...
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7586755 |
Electronic circuit component
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small...
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7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
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7580268 |
Built-in capacitor type power feed device to power pins of electrical component
A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive...
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7579693 |
Mounting structure of ball grid array
A ball grid array is mounted on a wiring board in a rectangular shape provided with screw insertion holes and fixed with screws to a mounting member at four points. Solder banks are formed around...
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7576996 |
Telecommunications components having reduced alien crosstalk
A telecommunications system comprising: a first printed circuit board associated with a first port, the first printed circuit board having first plated through holes for receiving first insulation...
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7576995 |
Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex...
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7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
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7573727 |
Connecting device for contacting a semiconductor component
A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal...
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7573722 |
Electronic carrier board applicable to surface mounted technology (SMT)
An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with...
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7573721 |
Embedded passive device structure and manufacturing method thereof
Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source...
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7573720 |
Active socket for facilitating proximity communication
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon...
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7573471 |
Electro-luminescence display
An electro-luminescence display that is capable of being made into a small thickness and minimizing its length. In the electro-luminescence display, an electro-luminescence panel has a display area...
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7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g.,...
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7571536 |
Method of making capacitive/resistive devices
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
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7570493 |
Printed circuit board with embedded circuit component
In one embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through some of the layers. A resistive plug at least partially fills the...
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7570492 |
Apparatus for venting an electronic control module
An electronic control module comprising a vent assembly is provided. The electronic control module comprises a housing having a first aperture and a substrate disposed within the housing. The...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7564693 |
Power saving wake-up device for wireless mouse
A power saving wakeup device for wireless mouse is disclosed. The wireless mouse has a microprocessor with a wake-up pin, and is waked up from the power saving mode when the wake-up pin is...
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7561438 |
Electronic device incorporating a multilayered capacitor formed on a printed circuit board
An electronic device. The device comprises a printed circuit board, a multilayered capacitor formed on the printed circuit board, and a conductive strip disposed on a top surface of the printed...
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7561437 |
Electronic element module and electronic device using the same
An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment,...
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7561436 |
Circuit assembly with surface-mount IC package and heat sink
A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of...
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7558071 |
Substrate mounted with electronic element thereon
A substrate mounted with an electronic element thereon, comprises a base, an insulator, a fluid passage, and a pressurizer. The base is made of a metal. The insulator is made of a ceramic material...
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7557302 |
Printed circuit board with electrostatic discharge damage prevention
A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The...
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7551452 |
Printed circuit board
In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality...
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7550842 |
Integrated circuit assembly
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
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7548433 |
Apparatus and method for setting adequate drive strength based upon DC trace resistance
An information handing system having apparatus for setting adequate drive strength based upon direct current (DC) trace resistance uses a resistance detection traces for each signal layer of a...
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7548431 |
Optically connectable circuit board with optical component(s) mounted thereon
An optically connectable circuit board and optical components mounted thereon. At least one component includes optical transceivers and provides an optical connection to the board. Electronic...
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