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7489517 |
Die down semiconductor package
A semiconductor package is disclosed for an integrated circuit die ( 52 ). The integrated circuit die is electrically connected to the package substrate by either die solder balls ( 53 a ), or...
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7485812 |
Single or multi-layer printed circuit board with improved via design
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an...
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7483276 |
Semiconductor package and method for manufacturing same
Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a...
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7483275 |
Electronic unit, circuit design for the same, and production method
A method for the production of an encapsulated and at least partly organic electronic device wherein the device comprises a combination of three groups of different electronic units or components...
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7480153 |
EMI shielding package and method for making the same
An exemplary Electromagnetic Interference (EMI) shielding package ( 1 ) includes a substrate ( 10 ), a metal cap ( 15 ), and a potting compound ( 18 ). The substrate has a plurality of electronic...
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7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
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7480748 |
Printed circuit board (PCB) having a plurality of integrated circuits (ICS) interconnected through routing pins in one central integrated circuit
An IC assembly having a routing structure mounted on a PCB of an electronic apparatus includes a central IC mounted on a central portion of the PCB; and a plurality of peripheral ICs disposed...
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7480151 |
Wiring board and method of manufacturing the same
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7480150 |
Printed wiring board and method of manufacturing the same
In a printed wiring board 10 , an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first...
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7477523 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist...
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7477522 |
High density high reliability memory module with a fault tolerant address and command bus
A high density high reliability memory module with a fault tolerant address and command bus. The memory module includes a rectangular printed circuit board having a first side and a second side, a...
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7476811 |
Semiconductor device and manufacturing method therefor
A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central...
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7474537 |
Circuit board with multiple layer interconnect and method of manufacture
A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is...
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7474536 |
Audio sound quality enhancement apparatus and method
An audio enhancement apparatus includes a thermally insulating container and a substrate mounted at least partially within the thermally insulating container. A heat source is provided within the...
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7471501 |
Circuit arrangement comprising several capacitors
A device includes a base plate, a first cell, a second cell, and a housing in which the-first cell and the second cell are arranged. The first cell and the second cell each include at least one...
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7471520 |
Impedance matching external component connections with uncompensated leads
In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground...
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7459638 |
Absorbing boundary for a multi-layer circuit board structure
The invention comprises an improved PCB board design having particular utility for high frequency application, and especially useful to alleviate the problem of electromagnetic disturbance of...
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7457129 |
Multilayer printed wiring board
There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first...
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7453705 |
Barrier, such as a hermetic barrier layer for O/PLED and other electronic devices on plastic
A protective layer for an electronic device and devices with a protective layer. In one exemplary embodiment, the protective layer includes two different layers which can be etched by the same...
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7453702 |
Printed wiring board
A printed wiring board comprises the insulating layer 11 ( 12 ); at least one resistance element 31 1 ( 31 2 ) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in...
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7453700 |
Display device
A display device is arranged such that a voice device ( 2 ) is laminated on a liquid crystal panel ( 1 ) so as to be confined in a planar area of the liquid crystal panel ( 1 ), and a voice-system...
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7453703 |
Electronic component module having electronic component with piezoelectric device
The present invention is to provide a small-sized electronic component module in which RF units of a mobile phone for multi-band and multi-system are integrated at low cost. In the RF module, an RF...
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7453704 |
Printed wiring board and information processing apparatus
According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided...
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7450395 |
Circuit module and circuit device including circuit module
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between....
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7450393 |
Driver chip and display apparatus including the same
A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being...
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7450392 |
Cable modem device and method of assembling the same
There is discolsed a cable modem device capable of reducing unnecessary signals inputted into a circuit substrate which processes signals and signal terminals from the outside and unnecessary...
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7450399 |
Signal coupling apparatus and transmitter including signal coupling apparatus
A signal coupling apparatus includes a coaxial type signal coupling element and a structure for fixing the element at a predetermined position on a circuit board. The structure includes a...
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7450394 |
PCB contact arrangement
A printer circuit board for mounting electrical components such as LEDs has outward edge protrusion on which an electrically conductive material is deposited such that the board itself can be used...
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7446403 |
Carrier structure stacking system and method
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
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7447041 |
Compression connection for vertical IC packages
An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device...
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7443694 |
25 degree tool-less expansion card bracket
An expansion card bracket for a computer server has an expansion card support attachable to a motherboard and an expansion card accepting portion disposed near a top of the support. The expansion...
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7443037 |
Stacked integrated circuit package system with connection protection
A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate,...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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7443696 |
Riser card to support different kinds of connectors
A connecting apparatus comprises a riser card ( 10 ) and a slot ( 20 ). The riser card comprises a PCI-X slot ( 13 ), a PCI-E slot ( 11 ), a first connector ( 15 ), a second connector ( 17 ) and a...
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7440289 |
Memory module
A memory module includes a memory chip MC 1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC 3 disposed at a position not opposite to the memory buffer...
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7436682 |
Wiring board, electronic component mounting structure, and electronic component mounting method
A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are...
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7436678 |
Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the...
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7436679 |
Radio-frequency module for communication
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body...
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7432816 |
Printed circuit board with RFID antenna
A printed circuit board (PCB) includes an antenna for an RFID chip. An RFID chip for a tag is operable to be placed on the PCB such that the RFID chip is connected to the antenna and is operable to...
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7433192 |
Packaging for electronic modules
An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one...
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7433200 |
Wired circuit board
A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least...
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7433197 |
Electronic module and method for sealing an electronic module
A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (“PCB”) with electronic components, an integral...
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7433201 |
Oriented connections for leadless and leaded packages
The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating...
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7430127 |
Electronic circuit board
An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O...
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7428140 |
Electronic apparatus
According to one embodiment, an electronic apparatus includes: a case having an upper wall and a lower wall; a connector housed in the case; a duct portion having a first opening that opens in the...
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7426117 |
Chip on a board
An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly...
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7423886 |
Electronic member and rotary electronic component
An electronic member capable of reducing a loss of light until reaching the end of an operation shaft and enhancing the illumination intensity at the end of the operation shaft, and a rotary...
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7423884 |
Multilayer circuit board
A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers...
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7423221 |
Printed wiring board and fabrication method for printed wiring board
A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of the 1005 size or less is mounted. The printed wiring board includes a...
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