|
Match
|
Document |
Document Title |
|
|
6469905 |
Guide rail device for receiving a GBIC module
A guide rail ( 1 ) for receiving a GBIC module therein mounts to a printed circuit board ( 2 ) and includes a frame ( 10 ) having a receiving space ( 26 ) for receiving the GBIC module therein, a...
|
|
|
6469908 |
Dual-socket interposer and method of fabrication therefor
An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer....
|
|
|
6469257 |
Integrated circuit packages
An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided...
|
|
|
6465082 |
Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said...
|
|
|
6462955 |
Component alignment casing system
A component alignment casing system for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable...
|
|
|
6462960 |
High frequency shielding structure and method
In order to obtain electromagnetic shielding and hermetic shielding for a high frequency circuit easily and surely, a complex adhesive sheet is provided at the joint between a metal stem ( 1 ) and...
|
|
|
6459592 |
Circuit assembly including VLSI package
A VLSI package assembly comprising a package substrate carrying thereon an IC chip, a mother board supporting thereon the package substrate, and a connection means for providing electric connection...
|
|
|
6459039 |
Method and apparatus to manufacture an electronic package with direct wiring pattern
An electronic package assembly for electrical interconnection between two electronic modules having differing conductive array parameters is disclosed. The electronic package assembly includes two...
|
|
|
6459588 |
Noncontact IC card and fabrication method thereof
A noncontact IC card is provided with a card substrate 11 , an IC chip 12 disposed on the card substrate 11 , and a antenna circuit 13 formed on the card substrate 11 and having a pair of...
|
|
|
6456505 |
Electronic device and attachment structure thereof
An electronic device having a plurality of leader patterns, and penetration portions penetrating the leader patterns, provided in an extension portion of a printed board projecting from a housing....
|
|
|
6455783 |
Multilayer printed wiring board and method for manufacturing the same
A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive...
|
|
|
6452807 |
Test interposer for use with ball grid array packages, assemblies and ball grid array packages including same, and methods
An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned...
|
|
|
6447321 |
Socket for coupling an integrated circuit package to a printed circuit board
A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated...
|
|
|
6449166 |
High capacity memory module with higher density and improved manufacturability
The present invention provides a double-sided memory module with improved memory device density and improved manufacturability, and with optional bus terminations mounted directly on the memory...
|
|
|
6449167 |
Method and apparatus for building and testing electronic circuits
A method and system with a magnetically attractive breadboard and associated devices for constructing and testing electronic circuits. The breadboard can comprise a single or multi-layer circuit...
|
|
|
6449165 |
Electrical interconnecting device for a semiconductor assembly
A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a...
|
|
|
6448640 |
Ball array layout in chip assembly
The present invention relates to chip assembly with a ball array capacitance minimizing layout that includes a ball array disposed upon a substrate with trace routing laid out between each ball pad...
|
|
|
6444923 |
Method of connecting printed wiring boards with each other, and printed circuit board
At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC...
|
|
|
6445589 |
Method of extending life expectancy of surface mount components
A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a...
|
|
|
6441316 |
Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
A printed-circuit board of the present invention, comprises a circuit substrate 1 ; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1 ; a plurality of lands 2 ,...
|
|
|
6442040 |
Embedded memory assembly
Memory devices, such as random access memory, are affixed to an electrical contact frame and coupled to signals lines on the contact frame which is, in turn, mounted on a top surface of an...
|
|
|
6442042 |
Circuit configuration having at least one nanoelectronic component and method for fabricating the component
At least one CMOS component which is configured in a semiconductor substrate is part of the inventive circuit assembly. An insulating layer is configured on the semiconductor substrate. The...
|
|
|
6442039 |
Metallic microstructure springs and method of making same
A spring suitable for use in interposers such as those used to electrically interconnect electronic devices such as integrated circuits and printed wiring boards. The spring includes a central...
|
|
|
6441314 |
Multilayered substrate for semiconductor device
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face...
|
|
|
6442041 |
MCM—MLC technology
Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved...
|
|
|
6441509 |
Controller for battery-operated vehicle
A controller, for a battery-operated vehicle or the like, comprises a plurality of mosfet/diode/capacitor circuits. A printed circuit board (PCB) has the mosfet/diode/capacitor circuits arranged in...
|
|
|
6438637 |
Dual solder-hole layout for expansion slots
A dual solder-hole layout for expansion slots is disclosed. The dual solder-hole layout, which comprises a first solder-hole layout and a second solder-hole layout, can be electrically connected to...
|
|
|
6437990 |
Multi-chip ball grid array IC packages
The specification describes a high density IC BGA package in which one or more IC chips are wire bonded to a BGA substrate in a conventional fashion and the BGA substrate is solder ball bonded to a...
|
|
|
6437989 |
Circuit board with an electronic component and a method for producing a connection between the circuit board and the component
This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at...
|
|
|
6432748 |
Substrate structure for semiconductor package and manufacturing method thereof
Disclosed is a structure of substrate and a fabricating method for IC (integrated circuit) chip package. Selected areas of the copper plate are etched for forming the plural conducting columns, and...
|
|
|
6434016 |
Apparatus for interconnecting multiple devices on a circuit board
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first...
|
|
|
6434009 |
Power distribution module with reversible relay footprint
A power distribution module utilizes a planar substrate having an array of repeating slots configured to accept two types of relays, one having four terminals and the other having five terminals....
|
|
|
6426879 |
Load adjustment board and data processing apparatus
The invention provides a circuit-mounted board which can improve the reliability in the operations of a system having expansion slots. The load adjustment board is a circuit-mounted board to be...
|
|
|
6426878 |
Bare chip carrier utilizing a pressing member
The present invention provides a bare chip carrier comprising: a carrier body having a base portion on which a bare chip is mounted and also having at least one cap holder ; and a carrier cap...
|
|
|
6426880 |
Surface mounted device with grooves on a termination lead
Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive...
|
|
|
6424541 |
Electronic device attachment methods and apparatus for forming an assembly
Improved methods and apparatus for forming an assembly by attaching an electronic package to a substrate are disclosed. The electronic package includes a microelectronic device, conductive leads to...
|
|
|
6423906 |
Surface mount package for long lead devices
Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is...
|
|
|
6420018 |
Low thermal expansion circuit board and multilayer wiring circuit board
A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe—based alloy...
|
|
|
6421248 |
Chip card module
A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening...
|
|
|
6421254 |
Multi-chip module having interconnect dies
A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one...
|
|
|
6421253 |
Durable laminated electronics assembly using epoxy preform
A delamination resistant electronics module assembly includes a printed circuit board layer coupled to a pallet via a cured epoxy preform. The preform may include conductive epoxy, or...
|
|
|
6421250 |
Multi in-line memory module and matching electronic component socket
A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least...
|
|
|
6417688 |
Method and apparatus for implementing a highly robust, fast, and economical five load bus topology based on bit mirroring and a well terminated transmission environment
In one embodiment, the invention is a method of forming a bus. A first conductor having a first impedance is provided, the first conductor is routed through a fifth chip. Coupling of the first...
|
|
|
6418029 |
Interconnect system having vertically mounted passive components on an underside of a substrate
An interconnect system for use with interposers or chip carriers provides highly efficient area utilization by attaching very small chip components ( 50 ) such as resistors or capacitors to the...
|
|
|
6418030 |
Multi-chip module
A multi-chip module includes bare IC chips mounted on respective areas of a printed wiring board. Outer electrode pads on the peripheries of the board are soldered to another printed wiring board...
|
|
|
6414849 |
Low stress and low profile cavity down flip chip and wire bond BGA package
A low stress, low profile, cavity down wire bond or flip-chip BGA package is formed by injection molding or thermosetting of liquid crystal plastic (LCP) to form a die carrier including a polymer...
|
|
|
6414847 |
Integral dielectric heatspreader
Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the...
|
|
|
6410366 |
Semiconductor device and manufacturing method thereof, circuit board and electronic equipment
A semiconductor device comprising: a semiconductor chip ( 10 ) which is subjected to face-down bonding, having a plurality of electrodes ( 12 ) aligned on a straight line (L); a substrate ( 20 ) on...
|
|
|
6411524 |
Dual planar printed wiring board for compact fluorescent lamp
A printed wiring board assembly for a compact fluorescent lamp unit that has a lamp portion and a base portion includes a first generally planar wiring board containing a first group of electronic...
|
|
|
6407447 |
Tape carrier package
A tape carrier package, in which inner leads are prevented from bending by external force, and the yield is made to improve, and short-circuits at non-intentional positions between wiring on a base...
|