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6538898 |
Method and apparatus of die attachment for BOC and F/C surface mount
A method and apparatus for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface, mounting comprise protrusions on the surface of...
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6538896 |
Surface mount type electronic component
A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which...
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6535396 |
Combination circuit board and segmented conductive bus substrate
A combination circuit board ( 12 ) and segmented bus structure ( 54 ) defines a composite circuit board/bus assembly ( 52 ) upon which an electrical circuit may be assembled. The various segments (...
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6535398 |
Multichip module substrates with buried discrete capacitors and components and methods for making
Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate,...
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6532654 |
Method of forming an electrical connector
A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact...
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6530412 |
Surface mount technology with masked cure
A method for temporarily attaching an electrical component to a pad, testing the component, removing and replacing the component if necessary, and making a final attachment of the component to the...
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6529385 |
Component array adapter
Apparatus and methods for connecting a device to an integrated circuit. The apparatus includes an insulating substrate that has two major sides and a number of sites for housing components. Each...
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6525945 |
Method and system for wide band decoupling of integrated circuits
An eletronic package comprising a printed circuit board on which are mounted a plurality of decoupling capacitors is disclosed. A carrier component electrically connects an integrated circuit to...
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6525928 |
Case with communication module having a latching connector for a handheld computer system
A case for a handheld computer system is described. In an embodiment, the handheld computer system comprises a personal digital assistant. The case has multi-functional capability. The case...
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6525944 |
Windowed package for electronic circuitry
An apparatus and method for enabling interaction between electronic circuitry and optical signals with a package for enclosing the electronic circuitry having contacts and a window for the passage...
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6522555 |
Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an...
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6518502 |
Ceramic multilayer circuit boards mounted on a patterned metal support substrate
A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to...
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6515868 |
Printed circuit board
Printed circuit board 1 on which LSI 2 is mounted comprises first capacitors 4 a and 4 b for electrically connecting power source terminals 3 a and 3 b to via holes 8 b , first power...
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6512680 |
Semiconductor package
In a semiconductor package which contains an IC element therein and effects the inputting and outputting of a signal to the IC element through a plurality of pads, a group of signals is...
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6512185 |
Printed-wiring board
The invention provides a printed-wiring board that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A...
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6511347 |
Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site
This invention relates to electrically connecting a first electronic component to a second electronic component wherein at least one of the electronic components must undergo modifications or...
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6509530 |
Via intersect pad for electronic components and methods of manufacture
To mount electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various...
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6510058 |
Printed circuit board configuration having reduced EMC/EMI interference in electromechanical relay circuits
Isolated planar conductive structures on separated layers of a PCB provide the normally-open, common, and normally-closed components of an electromechanical relay circuit to minimize inductive...
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6507099 |
Multi-chip integrated circuit carrier
An integrated circuit carrier includes a plurality of receiving zones. Each receiving zone includes electrical contacts and each receiving zone is configured to receive a particular type of...
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6507115 |
Multi-chip integrated circuit module
A multi-chip module is disclosed in which a first die connects to a second set of die via a set of C4 connections within a single package. Low resistivity signal posts are provided within the...
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6507122 |
Pre-bond encapsulation of area array terminated chip and wafer scale packages
An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the...
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6507496 |
Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component
A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different...
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6501633 |
Wiring board and electronic device having circuit board
A wiring board according to the present invention includes a mounting region in which memories having different storage capacities can be mounted. The mounting region has: first wires for, when a...
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6501663 |
Three-dimensional interconnect system
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system...
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6501662 |
Motor driving inverter
A motor driving inverter comprises a first printed circuit board provided with electronic components, a heat conduction plate made of a metal with high heat conductivity and adhered at one surface...
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6496400 |
Memory architecture and addressing for optimized density in integrated circuit package or on circuit board
An electrically erasable and programmable read only memory (EEPROM) or other memory integrated circuit (IC) includes memory cells arranged in N blocks. The number of blocks, N, is selected to...
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6496386 |
METHOD AND SYSTEM FOR SHIELDING AN EXTERNALLY MOUNTED CIRCUIT BOARD FROM ELECTROSTATIC DISCHARGE AND MECHANICAL DAMAGE WHILE ALLOWING FOR HEAT EXCHANGE FROM HEAT-PRODUCING COMPONENTS OF THE CIRCUIT BOARD THROUGH THE CIRCUIT BOARD SHIELD INTO AN EXTERNAL ENVIRONMENT
Method and system for shielding a circuit board from electrostatic discharge and from mechanical damage. A circuit board shield of dimensions roughly equivalent to those of the circuit board that...
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6496380 |
High capacity memory module with high electrical design margins
The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips...
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6493237 |
Pressure sensor housing
A novel pressure sensor housing configuration and method of assembly are described. A pressure transducer including a tube for measuring pressure and leads for providing signals indicated of the...
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6493234 |
Electronic components mounting structure
According to the present invention, there is provided an electronic components mounting structure constituted by a plurality of electronic components having lead terminals respectively, and...
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6493238 |
Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards
A method and system of utilizing inexpensively manufactured, electrically conductive and mechanically compliant disks to interconnect an area grid array (“AGA”) chip to a printed wiring board....
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6491528 |
Method and apparatus for vibration and temperature isolation
The method and apparatus of the present invention provide for isolation of one or more modules during stress testing of an overall system. The isolated modules remain in direct contact with...
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6490167 |
Semiconductor package ejector
In an embodiment of the present invention, an apparatus to eject a semiconductor package from a semiconductor package socket includes a package ejector coupled to a semiconductor package socket....
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6490166 |
Integrated circuit package having a substrate vent hole
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and...
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6487082 |
Printed circuit board component packaging
A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four...
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6483715 |
Circuit board coupled with jacks
A circuit board coupled with jacks and conformed to Category 6 standard has conductors to connect IDC contacts and jack pins to reduce cross-talk and improve return-loss. The improvements are...
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6483714 |
Multilayered wiring board
A multilayered wiring board comprising a first stacked structure consisting essentially of a first insulating layer having a first parallel conductor array and a second insulating layer formed...
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6480394 |
Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board
The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component...
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6479763 |
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
A conductive paste containing: conductive particles; foamable material which foams at the time of heating or decompression; and resin; characterized in that even after foaming of the foamable...
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6479757 |
Method of mounting a plurality of electronic parts on a circuit board
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer....
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6479759 |
Submount, electronic assembly and process for producing the same
Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of...
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6479760 |
Printed wiring board for semiconductor plastic package
Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size...
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6477057 |
High frequency de-coupling via short circuits
A method and implementing computer system are provided in which de-coupling capacitors are used at driver and receiver sources, and defined gaps are created separating power and ground areas on a...
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6473307 |
Method and apparatus for efficient electronics positioning and connection systems
The present invention provides a method and apparatus for efficient electronics positioning and connection systems. In one embodiment of the present invention, electronic components are inserted...
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6472747 |
Mixed analog and digital integrated circuits
Techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits. In one...
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6473310 |
Insulated power multichip package
The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is...
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6472609 |
Printed-wiring substrate and method for fabricating the printed-wiring substrate
A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1 A thereof and back-face-side...
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6472607 |
Electronic circuit board with known flow soldering warp direction
An electronic circuit board comprising a flow soldering surface and a plurality of lands is disclosed. The flow soldering surface has an upstream side, a downstream side, and a warp defining a warp...
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6469907 |
Packaging for power and other circuitry
Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is...
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6469906 |
Optical transceiver adaptation
An adapter for adapting a first circuit package to a second circuit packaging, includes a substrate for receiving the first circuit package thereon, a plurality of connectors disposed on the...
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