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6618272 |
Electric component connecting structure
An electric component connecting structure including a resin case having a first surface and a second surface, at least one metal bus bar fixed on the first surface of the resin case and having at...
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6614658 |
Flexible cable stiffener for an optical transceiver
An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The...
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6612022 |
Printed circuit board including removable auxiliary area with test points
A method for manufacturing a Personal Computer Memory Common Interface Architecture (“PCMCIA”) printed circuit board (“PCB”) includes providing a PCB having a PCMCIA area and an auxiliary...
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6611434 |
Stacked multi-chip package structure with on-chip integration of passive component
A stacked multi-chip package structure with on-chip integration of passive component is proposed, which is characterized in the mounting of passive component on a remaining surface area of the...
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6608757 |
Method for making a printed wiring board
Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with...
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6606249 |
Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component
A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which,...
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6606247 |
Multi-feature-size electronic structures
Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry...
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6606250 |
Circuit board having a stable L-shaped antenna
A circuit board includes an antenna having an extension extended from one end and secured to the circuit board and having a free end. A supporting member may be secured on the circuit board and...
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6603663 |
Electronic unit
The invention relates to an electronic unit having a mounting board ( 4 ) and electronic components ( 1-3 ) mounted on it, with the mounting board ( 4 ) having metal webs ( 41 ) which are embedded...
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6600865 |
Stacked GBIC guide rail assembly
A stacked Gigabyte Interface Converter (GBIC) guide rail assembly for removable optoelectronic modules includes a raiser mounted on a circuit board, a plurality of guide rails fixed to the raiser,...
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6601125 |
Minimizing signal stub length for high speed busses
An integrated circuit package for electrically interconnecting a first bus signal path disposed on a printed circuit board and a second bus signal path disposed on the printed circuit board. The...
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6597582 |
Semiconductor device incorporating module structure
A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The...
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6594891 |
Process for forming multi-layer electronic structures
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material...
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6593167 |
IC card indicating state of usage and system therefor
An IC card whose state of usage can be judged by a user from an appearance of the card, and a relevant IC card system and method are provided. In an IC card fed electricity from an IC card...
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6594151 |
Frame support for a printed board assembly
An assembly includes a substrate with mounting apertures. A frame is disposed through the apertures, optionally in a non-core area of the substrate, where a chassis at least partially encompasses a...
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6593535 |
Direct inner layer interconnect for a high speed printed circuit board
A multi-layer printed circuit board includes a non-conductive via which intersects a conductive trace on an inner layer of the board and is adapted to receive a conductive element configured to...
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6590907 |
Integrated circuit with additional ports
An integrated circuit which has a packet router to which a plurality of functional modules are connected by respective ports is described. One of the ports acts as a socket port for an expansion...
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6590772 |
CPU and circuit board mounting arrangement
A CPU and circuit board mounting arrangement in which a CPU connector is installed in a circuit board for top loading of a CPU to electrically connect respective bottom pads of the CPU to...
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6585525 |
Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges
Memory modules, and related memory module sockets, can include a plurality of connector pins adjacent to a first edge of the memory module that are configured to conduct a plurality of first...
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6587353 |
Semiconductor device
In the semiconductor device, externally connecting electrodes are placed on a semiconductor substrate. A rewiring pattern for connecting each on-chip electrode to corresponding external connecting...
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6587056 |
Solid state flight deck modules and components thereof
A conventional light plate for a systems control panel is mounted on a machined front plate which, in turn, is maintained a predetermined uniform distance from a front printed wiring assembly...
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6581279 |
Method of collectively packaging electronic components
Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated...
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6580619 |
Multilayer reference plane in package devices
An apparatus comprising an integrated circuit comprising a plurality of memory devices and signal circuitry coupled to the plurality of memory devices, and a package substrate comprising a first...
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6580620 |
Matrix type printed circuit board for semiconductor packages
Disclosed is a matrix type printed circuit board (PCB) for semiconductor packages having a structure including a plurality of PCB units arranged in a matrix array having at least two rows in such a...
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6580618 |
Low-profile multi-chip module
A low-profile multi-chip module is provided, wherein two or more chips are integrated in a package unit connected to a printed circuit board (PCB), to provide a manifold level of functionality and...
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6577015 |
Partial slot cover for encapsulation process
A system and method for encapsulating an integrated circuit package. More specifically, a system and method for encapsulating a board-on-chip package is described. A strip of material is disposed...
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6573459 |
Graded metallic leads for connection to microelectronic elements
Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the...
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6570774 |
Capacitor module for use in inverter, inverter, and capacitor module
The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path...
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6563687 |
Piezoelectric device for injector, method for producing the same, and injector
A stacked-type piezoelectric device 1 to be built in an injector includes a metal case 41 outside its side surfaces. An insulating member 45 having an electric insulation property is...
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6563712 |
Heak sink chip package
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring...
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6563696 |
Solderless laser assembly
A connect and disconnect assembly for connecting and disconnecting a laser diode having leads to a printed circuit board (PCB). The assembly includes a heatsink that connects with the printed...
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6561410 |
Low cost and high speed 3 load printed wiring board bus topology
A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of...
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6563214 |
Electronic component and method of manufacturing the same
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion...
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6563058 |
Multilayered circuit board and method for producing the same
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled...
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6559733 |
Reducing effects of electrical impedance
The present invention, in various embodiments, provides techniques for reducing effects of electrical impedance. In one embodiment, the impedance is in the form of inductance and arises from vias...
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6560121 |
Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the...
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6560122 |
Chip package with molded underfill
An integrated circuit chip package according to the present invention includes an integrated circuit chip that is mounted on a substrate by a reflow process and by a plurality of solder bumps. At...
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6560117 |
Packaged microelectronic die assemblies and methods of manufacture
Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an...
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6555757 |
Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions
A pin standing resin substrate 311 comprises a resin substrate 313 and many pins 301 soldered (HD) to a pin-pad 317 A, the resin substrate comprising such as a resin and having a pin-pad ...
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6556454 |
High density contact arrangement
The present disclosure relates to a contact arrangement. The contact arrangement comprises a plurality of contacts formed along a line in a staggered configuration. The staggered configuration...
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6556453 |
Electronic circuit housing with trench vias and method of fabrication therefor
An electronic circuit package ( 400 , FIG. 4 ) includes one or more trench vias ( 404 , FIG. 4 ). Each trench via makes electrical contact with one or more terminals ( 526 , FIG. 5 ) of a...
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6555759 |
Interconnect structure
An embodiment of the present invention is a method for wafer level IC packaging that includes the steps of: (a) forming compliant, conductive bumps on metalized bond pads or conductors; and (b)...
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6552275 |
Surface mount component
An apparatus including a substrate, and a surface mount component coupled with a top surface of the substrate, where the component includes side surfaces and a bottom surface, and the bottom...
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6553555 |
Maintaining signal guard bands when routing through a field of obstacles
An apparatus and method for integrating high-speed DRAM in a computer system including guard bands on either side of each data signal path between a memory module and a memory controller on a...
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6552910 |
Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
A stacked-die assembly and a method of manufacturing a stacked-die assembly having a plurality of microelectronic devices. In one embodiment, a stacked-die assembly can include a first die, a...
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6549420 |
Method and apparatus for increasing memory capacity
A system includes a memory module formed of a first portion having a first side that directly connects to a mount in the system, which first side is of a first length; and a second portion having a...
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6549412 |
Fixing apparatus for heat sink
A fixing apparatus includes a retention module ( 10 ) and a back plate ( 30 ). The retention module is attached on a motherboard ( 20 ) which defines a plurality of through apertures ( 22 ). The...
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6545351 |
Underside heat slug for ball grid array packages
An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to...
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6545875 |
Multiple channel modules and bus systems using same
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
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6545226 |
Printed wiring board interposer sub-assembly
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a...
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