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6689634 |
Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability
A modeling technique for selectively depopulating solder balls ( 12 ) (and their respective solder ball pads ( 34 ), vias ( 32 ) and traces or lines ( 30 )) from a conventional foot print of a ball...
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6690185 |
Large contactor with multiple, aligned contactor units
A method of fabricating a large contactor ( 62 ) is provided wherein one or more contactor units ( 78 ) are mounted on a support substrate ( 74 ) such that contact elements ( 80 ) attached to the...
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6687133 |
Ground plane on 2 layer PBGA
A two layer PBGA which includes a metal ground plane at its bottom layer. The ground plane is preferably a metal plane which is connected to ground through a metal connection to a ball pad at the...
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6687132 |
Conductive member grid array interface for mirror array drive apparatus
The present invention discloses drive apparatus for rotating a mirror used for switching light signals. The drive apparatus has reduced internal wiring and uses a base printed circuit board which...
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6687131 |
Transponder and injection-molded part and method for manufacturing same
A transponder contains an integrated circuit, a power transmitting component (antenna) and a capsule made of a thermoplastic resin (hot glue) that surrounds the circuit continuously at least on one...
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6683790 |
Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part
An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit...
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6680436 |
Reflow encapsulant
A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and...
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6679707 |
Land grid array connector and method for forming the same
The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of...
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6680848 |
Device and method for mounting integrated circuits on a printed circuit card
The subject of the present invention is a device ( 1 ) for mounting at least two electrical components ( 4 A, 4 B) on a printed circuit card ( 2 ), the card ( 2 ) comprising connection pads on...
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6678167 |
High performance multi-chip IC package
The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to...
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6677669 |
Semiconductor package including two semiconductor die disposed within a common clip
A co-package semiconductor device including an outer clip in the form of a metal can includes also two semiconductor dies, at least one of which uses the outer clip as an electrical connector. An...
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6674646 |
Voltage regulation for semiconductor dies and related structure
An output of a voltage regulator is a core voltage line that runs adjacent to a die attach area on a packaging substrate. An input of the voltage regulator is typically coupled to a power supply...
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6674645 |
High frequency signal switching unit
A high frequency signal switching unit includes a printed circuit board accommodated in the casing and having a ground layer formed on substantially one entire surface thereof. Input and output...
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6674649 |
Systems having modules sharing on module terminations
In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules,...
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6674648 |
Termination cards and systems therefore
In some embodiments, the invention includes a termination card having a substrate having groups of fingers on a first side of the substrate and groups of fingers on a second side of the substrate...
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6674016 |
Electronic component
An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said...
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6674647 |
Low or no-force bump flattening structure and method
Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump...
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6671176 |
Method of cooling heat-generating electrical components
A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of...
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6670556 |
Printed circuit board unit with detachment mechanism for electronic component
A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole for receiving the solder bump. The...
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6670557 |
Design for constructing an input circuit to receive and process an electrical signal
A design for constructing an input circuit to receive and process an electrical signal, such as a voltage signal from a voltage source, where the input circuit has an extremely high resistance of...
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6671778 |
Atomic resolution storage device configured as a redundant array of independent storage devices
A redundant array of independent storage devices is disclosed herein. The redundant storage device includes one or more atomic resolution storage devices and a control system. The atomic resolution...
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6667888 |
Cassette structure with a card connector
A structure of the cassette with a card connector is disclosed. The cassette comprises a chassis, an upper metallic board, a lid, and a bottom metallic board. The upper metallic board is detachably...
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6665193 |
Electronic circuit construction, as for a wireless RF tag
An electronic circuit arrangement comprises a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined...
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6665194 |
Chip package having connectors on at least two sides
A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not...
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6657134 |
Stacked ball grid array
A ball grid array mounted circuit includes a stress relief substrate having spaced conductive vias extending between its surfaces and connection pads at the surfaces. Solder connections formed from...
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6657133 |
Ball grid array chip capacitor structure
A BGA-type capacitor structure including a conventional chip capacitor mounted on the upper surface of an inexpensive substrate, and having solder balls mounted on a lower surface of the substrate....
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6657137 |
Connection structure and connection method of for connecting two circuit boards
In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are...
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6657871 |
Multiple channel modules and bus systems using same
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
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6657870 |
Die power distribution system
A power distribution system for distributing external power across a die is disclosed, wherein the die has horizontal and vertical centerlines. The system and method include providing a power mesh...
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6653563 |
Alternate bump metallurgy bars for power and ground routing
An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of...
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6654254 |
Printed circuit board assembly having retention module and back plate
A printed circuit board assembly includes a printed circuit board ( 10 ), a retention module ( 20 ) mounted on the printed circuit board, and a back plate ( 30 ) attached to an underside of the...
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6650549 |
Hub having a bluetooth system
A hub includes a bluetooth system module coupled to a hub module. The hub module is also coupled to an upstream port and a plurality of downstream ports provided on a housing of the hub...
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6646886 |
Power connection structure
A multi-layer printed circuit board (PCB) has a plated through hole for receiving a pin of a component. The plated through hole passes through all layers of the PCB and includes a first conductive...
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6643923 |
Processes for manufacturing flexible wiring boards
A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps ( 16 ) using a mask film patterned by photolithography. Fine openings are formed...
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6633005 |
Multilayer RF amplifier module
An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in...
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6630628 |
High-performance laminate for integrated circuit interconnection
A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature...
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6628527 |
Mounting structure for electronic parts and manufacturing method thereof
A unit interconnection substrate for mounting leadless type electronic parts on a mount substrate by superposing them on each other in two or more stages, comprising an insulating surface on the...
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6628526 |
Electronic device manufacturing method, electronic device and resin filling method
The present invention provides an electronic device manufacturing method and an electronic device which make it possible to reduce the waste of materials and the number of manufacturing steps...
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6628178 |
Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof
The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to...
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6624448 |
Semiconductor device with multiple supporting points
A semiconductor device having a supporting member that reduces a resonance phenomenon. A pair of reinforcing members is fixed on a gate drive substrate with spacers interposed there between and...
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6621705 |
Miniature surface mount heatsink element and method of use
A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an...
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6621710 |
Modular probe card assembly
A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to...
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6618265 |
Wiring arrangement ensuring all-or-none operation of a series of modular load elements
All-or-none operation of a series of modular load elements is ensured by routing high and low voltage lines from a power source through opposite nodes positioned at either end of the series of load...
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6617529 |
Circuit board and electronic equipment using the same
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by...
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6618261 |
Electrical sensor mount
A sensor mount assembly including a housing, fastener and a lever mechanism. The housing contains a sensor having two electrical leads and includes an integral flange adapted to receive a fastener....
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6617518 |
Enhanced flex cable
A flex cable has a number of conductive wirings for electrically coupling electrical leads of an electrical component to a wiring board. The flex cable has a conductive tab for electrically...
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6617525 |
Molded stiffener for flexible circuit molding
A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A...
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6617523 |
Assembly and method for retaining circuit board assembly components
A fastener assembly and method are provided to engage a component to a circuit board assembly having a circuit board and a retainer positioned adjacent the circuit board. The fastener assembly...
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6617522 |
Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of...
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6617524 |
Packaged integrated circuit and method therefor
To mitigate mold encapsulant bleeding and solder mask cracking in plastic semiconductor packages, a damming structure constructed from metal traces is formed in-line with the encapsulant perimeter....
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