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7601419 |
Printed circuit board and method of manufacturing the same
Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry...
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7596000 |
Signal transmitting apparatus using flexible flat cable for an optical disc drive
The disclosure relates to a signal transmitting apparatus. The signal transmitting apparatus includes a conductor, a first and a second circuit boards, and a signal transmitting medium that is...
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7582965 |
Electronic device and method for bonding an electronic device
An electronic device ( 1 ) has a base plate ( 2 ) and an electronics housing ( 3 ) connected thereto, with a bonding contact terminal ( 5 ). The latter is supported relative to the base plate ( 2 )...
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7551454 |
Thin-film assembly and method for producing said assembly
A thin-film assembly ( 1 ) including a substrate ( 2 ) and at least one electronic thin-film component ( 8 ) applied on the substrate by thin-film technology, wherein a base electrode ( 4 ) is...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7510759 |
Electronic part and manufacturing method thereof
An electronic component includes conductive pattern ( 2 ) on insulating substrate ( 1 ), a metal film formed by a plating method on a surface of conductive pattern ( 2 ), and metal oxide layer ( 3...
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7485361 |
Multilayered printed wiring board and manufacturing method thereof
An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the...
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7479013 |
Printed board and manufacturing method thereof
A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A...
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7455915 |
Selective application of conductive material to substrates by pick and place of compliant contact arrays
Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material...
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7452612 |
Wiring substrate
Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point...
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7446261 |
Flexible circuit boards with tooling cutouts for optoelectronic modules
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on...
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7430799 |
Apparatus for deforming flexible cable sections extending between rigid printed circuit boards
A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover,...
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7423220 |
Conductive paste for multilayer electronic components and multilayer electronic component using same
A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent,...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7381902 |
Wiring board and method of manufacturing the same
A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above...
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7378345 |
Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof
A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at...
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7359204 |
Multiple cover memory card
A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon....
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7335414 |
Printed circuit board and camera module
A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera...
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7323642 |
Thin printed circuit board for manufacturing chip scale package
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is...
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7292448 |
Circuit substrate
A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second...
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7230187 |
Printed wire board and associated mobile terminal
A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile...
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7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers
A multilayer wiring board (X 1 ) comprises a core portion ( 100 ) and out-core wiring portion ( 30 ). The core portion ( 100 ) comprises a carbon fiber reinforced portion ( 10 ) composed of a...
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7208218 |
Method of suppressing the oxidation characteristics of nickel
A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C....
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7189598 |
Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument
A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied...
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7169327 |
Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
The dielectric-forming composition according to the invention is characterized by consisting of:
composite particles for dielectrics in which part or all of the surfaces of inorganic...
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7158383 |
Techniques for fabricating a resistor on a flexible base material
A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is...
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7091899 |
Remote control transmitter
Hook portion is formed on sheet an electric discharge preventing sheet put between battery and electrode. Hook portion which is deformable with a prescribed force comes into contact with holder 6 ...
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7071419 |
Tear resistant flexible substrate
A flexible circuit having improved tear resistance is provided. A flexible circuit, made of polyimide film, includes at least one extension which needs to be folded. To prevent tearing, an annular...
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6994918 |
Selective application of conductive material to circuit boards by pick and place
A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed...
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6992864 |
Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature
A thermal component is mounted on the front surface of an isolator sheet within a first specific area. A thermally-conductive material is located on the back surface of the isolator sheet on the...
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6921575 |
Carbon nanotube structures, carbon nanotube devices using the same and method for manufacturing carbon nanotube structures
Carbon nanotube structures are provided, in which the networks with a desired area and volume, where the carbon nanotubes are electrically or magnetically connected, are formed and the method for...
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6918179 |
Method of deforming flexible cable sections extending between rigid printed circuit boards
A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover,...
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6863962 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin...
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6861591 |
Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same
A printed circuit board having an insulating board and a plurality of wiring patterns formed over the insulating board by screen printing and provided with first conductive pattern bent parts and...
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6842344 |
Multi-layer printed circuit board and signal routing therein
A printed circuit board having a dielectric layer is disclosed. At least one signal trace is disposed adjacent a first surface of the dielectric layer in a first signal area. A reference plane is...
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6835442 |
Flexible printed wiring board
A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm 2 , and a polyimide resin layer formed...
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6824857 |
Circuit elements having an embedded conductive trace and methods of manufacture
Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a...
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6822873 |
Structure of electronic device providing decreased fatigue of wire
An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an...
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6815620 |
Flexible circuit with electrostatic damage limiting feature
A flexible circuit incorporating an electrostatic discharge limiting feature, comprising a dielectric substrate selected from polyimide or liquid crystal polymer film having at least one conductive...
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6771348 |
Displaying substrate and liquid crystal display device having the same
Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal...
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6756138 |
Micro-electromechanical devices
A device having electrical and mechanical components. The device comprises multiple layers in which: a first layer or set of layers arranged is to function as one or more electrodes or conductors;...
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6734370 |
Multilayer modules with flexible substrates
A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic...
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6707677 |
Chip-packaging substrate and test method therefor
A chip-packaging substrate and test method therefor. The chip-packaging substrate includes at least one package area and a connection area enclosed by and connected to the package areas. A test...
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6705005 |
Method of forming assemblies of circuit boards in different planes
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is...
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6690580 |
Integrated circuit structure with dielectric islands in metallized regions
This disclosure describes use of dielectric islands embedded in metallized regions of a semiconductor device. The islands are formed in a cavity of a dielectric layer, as upright pillars attached...
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6669273 |
Vehicle instrument panel structure to support electronics packaging
An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends...
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6633487 |
Method for manufacturing hybrid circuit board
A required interlayer circuit board 1 is constituted so as to provide a punched portion in which only a collapsible cable portion 2 for connecting a plurality of component mounting portions to...
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6625032 |
AQUEOUS DISPERSION FORMING CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPENT, CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
An aqueous dispersion of the invention has conductive microparticles and organic particles dispersed in an aqueous medium and can form a conductive layer of a volume resistivity of for example 10...
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6611065 |
Connection material
The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an...
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