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7633142 |
Flexible core for enhancement of package interconnect reliability
An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an...
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7626270 |
Coreless package substrate with conductive structures
A method of manufacturing a coreless package substrate together with a conductive structure of the substrate is disclosed. The method can produce a coreless package substrate which comprises: at...
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7619181 |
Heating system for bathing unit
A control system suitable for use with a bathing unit system having a water receptacle is provided. The control system comprises a heating module, a power source and a controller in communication...
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7616447 |
IC card
An IC memory card ( 11 ) has a mode change switch ( 18 ) for switching operation modes of a semiconductor component in the vicinity of an end side opposite the external connection terminals ( 17 a ...
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7616449 |
Crash-hardened memory device and method of creating the same
A crash-hardened memory device in which only a single electronic component, such as a memory chip, mounted on a small printed circuit board (PCB), is protected against an impact. The portion of the...
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7609525 |
Computer system
A computer system includes a motherboard ( 10 or 50 ) with at least one CPU heat sink mounted thereon and a chassis ( 20 ) for mounting the motherboard therein. The chassis includes a plurality...
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7592706 |
Multi-layer circuit board with fine pitches and fabricating method thereof
A method for fabricating a multi-layer circuit board with fine pitch is provided. First, a plurality of contact pads is disposed on a core substrate. Next, a first dielectric layer, a second...
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7583509 |
Memory module and memory system having the same
A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory...
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7576991 |
Electrical equipment for junction and method of manufacturing the same
The present invention provides electrical equipment for junction improved in sealing performance and reduced in size and weight, and also provides a method of manufacturing the same. A face cover ...
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7570312 |
Liquid crystal display module having replaceable light sources
Disclosed is a liquid crystal display module which makes it possible to reduce the number of components and manufacturing processes of the liquid crystal display module and to easily replace a...
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7561433 |
Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system
In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged,...
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7558073 |
Multifunctional peripheral device
A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other...
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7553164 |
Circuit device and method of manufacturing the same
A circuit device of the present invention includes a first element which is placed parallel to a first reference plane and which senses a physical quantity, and a second element placed parallel to...
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7554822 |
Power converter for led large area light source lamp
Power converter for receiving an input current at an input voltage and for providing an output current at an output voltage. The power converter comprises a transformer ( 133 ) having a primary (...
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7548433 |
Apparatus and method for setting adequate drive strength based upon DC trace resistance
An information handing system having apparatus for setting adequate drive strength based upon direct current (DC) trace resistance uses a resistance detection traces for each signal layer of a...
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7535723 |
Surface mounted electrical components and method for mounting and retaining same
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7518065 |
Printed wiring board for plasma display and process for producing the same
A printed wiring board for a plasma display, comprising: an insulating film having a folding slit(s) provided at its folding position; a wiring pattern provided on at least one surface of the...
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7515431 |
Handheld computing device
A handheld computing device is disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7506092 |
Bridge card for converting a bus connection of a parallel daughter card mounted thereon to a different bus connection of a mother board
The present invention discloses an apparatus for operatively connecting a PCI-X or AGP device card (having a PCI-X or AGP bus) to a PCI-E bus connection on a mother board by mounting the PCI-X or...
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7483274 |
Galvanic isolation of a signal using capacitive coupling embedded within a circuit board
A method and apparatus for providing galvanic isolation for signal communication between two electrical circuits via a capacitive coupler that is constructed from conductive and non-conductive...
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7482800 |
Wired circuit board and connecting structure thereof
A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size...
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7477521 |
Isolating stress on a printed circuit board
Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed...
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7477522 |
High density high reliability memory module with a fault tolerant address and command bus
A high density high reliability memory module with a fault tolerant address and command bus. The memory module includes a rectangular printed circuit board having a first side and a second side, a...
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7474540 |
Silicon carrier including an integrated heater for die rework and wafer probe
A silicon carrier package includes a multi-layer member having at least a first layer and a second layer. A first electronic component includes a plurality of connector members that establish a...
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7459200 |
Circuit board design
A circuit board is described where the fiberglass fiber pattern as been modified than what is found in conventional FR4 circuit boards. In one embodiment, the sets of fiberglass fibers are disposed...
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7457130 |
Packaging for plasma display module
Packaging for a display module which is easy to install due to a simple structure, and protects the front, sides and back of the display module securely. The packaging includes a protective plate...
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7457128 |
Flexible cell configuration for multi-processor systems
A cell configuration for a multi-processor system comprises: a first circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a...
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7453700 |
Display device
A display device is arranged such that a voice device ( 2 ) is laminated on a liquid crystal panel ( 1 ) so as to be confined in a planar area of the liquid crystal panel ( 1 ), and a voice-system...
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7447039 |
Motherboard configured to minimize or prevent damage to a chip thereon
A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat...
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7447038 |
Module
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to...
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7442091 |
Back-to-back PCB double-sided USB connector
A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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7433178 |
Plasma display apparatus
A plasma display apparatus comprising a panel displaying images, a circuit board that drives the panel, and a chassis base that supports the panel and the circuit board. A signal transfer member...
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7433200 |
Wired circuit board
A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least...
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7430125 |
Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium
A second ground plane ( 18 ); has one end opposite to a connector ( 14 ), which end is connected to a first ground plane ( 17 ) by resistor connection element ( 41 ). Accordingly, it is possible to...
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7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
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7427717 |
Flexible printed wiring board and manufacturing method thereof
A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component...
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7423884 |
Multilayer circuit board
A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers...
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7420817 |
MEMS device seal using liquid crystal polymer
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape...
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7420830 |
Memory card module
A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is...
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7420816 |
Apparatus and method for installing an electrical support structure
An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the...
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7417194 |
ESD protection devices and methods of making same using standard manufacturing processes
Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed...
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7408785 |
Structure for mounting electronic component on wiring board
A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an...
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7397669 |
Semiconductor device mounting socket
A semiconductor device mounting socket is disclosed that is fixed to a motherboard and is used for mounting a surface mounted semiconductor device on the motherboard. The semiconductor device...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7375971 |
Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same type
In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one...
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7361848 |
Wiring board, magnetic disc apparatus, and manufacturing method of wiring board
Disclosed is a wiring board including: a first insulating layer made of a flexible material; a second insulating layer stacked on a partial region of the first insulating layer; a first wiring...
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