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6934152 |
Systems and methods for connecting an electronic apparatus to a backplane
An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of...
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6788526 |
Housing structure of network device
The present invention is to provide a network device having a parallelepiped housing comprising a plurality of slots on two opposite sides and two opposite edges at each of an underside and a top...
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6788535 |
Outdoor electronic equipment cabinet
An outdoor telecommunications cabinet comprising an electronic compartment adapted to contain heat-generating electrical equipment, having a main electronic compartment including a rear wall panel...
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6747871 |
Electronic equipment assembly
The present invention relates to an electronic assembly and, more particularly, to a computing assembly comprising a computing platform and an external power supply. The computing platform has an...
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6675471 |
Method of producing high-frequency modules
A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub...
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6630727 |
Modularly expandable multi-layered semiconductor component
A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and...
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6468091 |
Electrical distribution center
An electrical distribution center has a circuit board interposed between an upper housing and a lower housing. The upper housing has a panel provided with a universal cavity design by a...
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6418033 |
Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first...
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6351383 |
Heat conducting device for a circuit board
A heat conducting device for providing a thermal path between a circuit board and a missile airframe includes a thermal plane that is adapted to receive a circuit board and a collar that...
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6278605 |
Modular circuit breaker interconnection system
A modular circuit breaker system includes a plurality of modules mounted side-by-side. The modules include electrical terminals for connection to live and neutral conductors of an electrical...
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6219240 |
Three-dimensional electronic module and a method of its fabrication and repair
The invention relates to an area of electronic equipment assembly using packaged and unpackaged electronic components. The invention solves a problem of creating an all-purpose construction of...
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6163459 |
Semiconductor mounting system and semiconductor chip
A semiconductor mounting system of the present invention includes a first semiconductor chip in which a first semiconductor integrated circuit is packaged and a second semiconductor chip in which a...
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RE36916 |
Apparatus for stacking semiconductor chips
A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory...
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6111751 |
Connector and connecting structure using connector
A connector is provided which can simplify the path for heat radiation between electronic devices, ease restrictions in the structures of the electronic devices and in the arrangement of parts on...
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6084768 |
Non-operational shock protection for disk carriers in a high density package
A hot-pluggable hard disk drive is supported on a carrier structure for removable insertion into a sheet metal cage structure in a manner such that an SCA connector on the rear end of the drive is...
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6059614 |
Modular information and processing center
A modular home information center includes a number of processing modules having substantially identical housings with each of the modules having an operating structure and a multi-bus connector...
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5999414 |
Physically separating printed circuit boards with a resilient, conductive contact
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a...
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5963432 |
Standoff with keyhole mount for stacking printed circuit boards
A standoff for mounting two or more printed circuit boards to a chassis in which one keyhole cut printed circuit board may be slidably mounted on the keyhole mount of the standoff and a second...
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5949657 |
Bottom or top jumpered foldable electronic assembly
An electronic assembly is made up of a number of rigid manufactured on the same or different substrates or panels and with the same materials separated from each other electrically and physically....
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5936840 |
Stacked passive components
The invention is component module (20) for combining a plurality of components (21, 23, 25, 27 and 29)into a single module (20) for use with a printed wiring board. A plurality of components, each...
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5907903 |
Multi-layer-multi-chip pyramid and circuit board structure and method of forming same
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a...
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5864467 |
Cascadable modem apparatus
A cascadable modem apparatus includes a modem housing having a top and a bottom. A plurality of angled feet are attached to the housing bottom in cantilever fashion to define a distal portion of...
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5796592 |
Module mounting structure
In a module mounting structure, a plurality of lead frames are affixed to an affixing block of resin and then respectively soldered to a plurality of input/output pads provided on a daughter board....
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5783870 |
Method for connecting packages of a stacked ball grid array structure
Stackable ball grid array packages are disclosed, wherein a plurality of separate ball grid array packages may be stacked, one on top of another, and interconnected by conductive terminals located...
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5761050 |
Deformable pin connector for multiple PC boards
A press-fit or compliant section or deformable pin electrical connector. The connector is designed to be inserted into several plated through holes in printed circuit boards. Specifically, the pin...
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5754405 |
Stacked dual in-line package assembly
Each flat package is provided with locking elements of snap fasteners that allow several packages to be assembled into a stack so as to align the leads of each package with respect to the leads of...
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5731956 |
Electronic devices for connection into back planes
An electronic assembly of two planar electronic devices for insertion into a shelf for back plane connection. Each device may be a printed circuit board or a circuit pack incorporating such a...
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5701233 |
Stackable modules and multimodular assemblies
Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive,...
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5696030 |
Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
Semiconductor structures and associated methods for limiting electromigration at wiring interfaces. Increased cross-sectional contact sections are employed, with conducting studs in contact...
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5663871 |
Dual PCB subassembly for an electronic device having an electronic component
A printed circuit board (PCB) subassembly of first and second PCB's disposed back to back, a group of jumper pins extending through the PCB's to electrically connect the circuit elements of the...
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5646828 |
Thin packaging of multi-chip modules with enhanced thermal/power management
A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction,...
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5633783 |
Multi-chip ceramic module for mounting electric parts on both substrate and cap connected through interconnecting pins
Multi-layer wiring structures are respectively formed in upper and lower ceramic substrates for electric parts, and interconnecting pins held in contact with contact pads establish electrical...
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5604666 |
Outdoor communication device having disk-like mounting portion, units stacked on the mounting portion, and fixing members for fixing the units on the mounting portion
The structure of an outdoor communication device includes a device body and a mounting base. The device body includes a device body, a disk-like mounting portion, a plurality of units, and a...
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5548486 |
Pinned module
An electrical connection pin blank having at least one compliant section is affixed to a first circuit board by compressive deformation in such a way that the compliant section of the pin blank...
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5544969 |
Stacked enclosure locking mechanism
A module is sandwiched between an underlying member and a superimposed enclosure. The underlying member may be a base or another enclosure. The module is constructed so that it can be secured to...
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5526230 |
3D interconnection process for electronic component packages and resulting 3D components
A device and method for interconnection packages in a stack. Each package encapsulates, for example a semiconductor chip containing an integrated circuit, which for example may be a memory. The...
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5490041 |
Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same
A plurality of memory modules are stacked so as to form a multilayer integrated memory circuit. All of the memory modules have a plurality of bare memory IC chips mounted thereon, and have the same...
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5479320 |
Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to...
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5457609 |
Charging contact for use with a battery powered electronic device
A battery powered device (100) utilizing a rechargeable battery (135) comprises a ball bearing (300) having a first diameter for receiving a current and a housing (200) having an opening (405)...
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5440453 |
Extended architecture for FPGA
The invention provides a packaging technique implementing an electronic circuit, comprising several individually packaged sub-circuits, on a circuit board within the footprint of a single package....
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5435734 |
Direct integrated circuit interconnector system
A system for directly connecting one integrated circuit to another achieved by depositing gold onto the bonding pads of both integrated circuits, aligning the respective bonding pads and biasing...
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5434745 |
Stacked silicon die carrier assembly
Disclosed is a stacked die carrier assembly and method for packaging and interconnecting silicon chips such as memory chips. The carrier is constructed from a metalized substrate onto which the...
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5430617 |
Modular electronic packaging for internal I/O modules
A modularized electronic system such as notebook or palmtop computer for packaging and assembling one or more electronic I/O module assemblies comprises one upper case assembly and one lower case...
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5426564 |
Modular electronic packaging
A modularized electronic system for packaging and assembling one or more electronic module assemblies comprising at least one external enclosure case having one internal room for module mounting....
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5424920 |
Non-conductive end layer for integrated stack of IC chips
An integrated stack of layers incorporating a plurality of IC chip layers has an end layer which is formed of dielectric material (or covered with such material). The outer surface of the end layer...
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5394300 |
Thin multilayered IC memory card
In an IC memory card, sub-modules, in each of which a plurality of memory ICs are mounted on each of two opposed surfaces of a sub-substrate, are mounted on each of two opposed surfaces of a single...
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5371654 |
Three dimensional high performance interconnection package
The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both...
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5355282 |
Connector structure for modules in electronic apparatus
An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality...
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5353191 |
Combination heat sink and housing for flexible electrical connector used in an electrical or electronic assembly
A unitary heat sink and connector housing (10, 10', 10", 10"') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in...
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5343366 |
Packages for stacked integrated circuit chip cubes
This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical...
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