Matches 1 - 50 out of 103 1 2 3 >
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7433201 Oriented connections for leadless and leaded packages  
The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating...
7295445 Holder for surface mount device during reflow  
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one...
7197819 Method of assembling an electric power  
A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also...
7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards  
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
7045902 Circuitized substrate for fixing solder beads on pads  
A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a...
6959489 Methods of making microelectronic packages  
A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends...
6853542 Video-apparatus-tuner mounting board  
A video-apparatus-tuner mounting board includes a television tuner mounted on the board; a predetermined circuit to be connected to pins connected to an internal circuit of the television tuner;...
6791184 Support assembly for an integrated circuit package having solder columns  
A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably...
6750081 Header for electronic components board in surface mount and through-hole assembly  
A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame...
6693801 Electronic device  
An electronic device includes a wiring board, and at least one pair of signal lines that is provided on the wiring board in parallel and has an equal length. A chip is mounted on the wiring board...
6690088 Integrated circuit package stacking structure  
A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending...
6664622 Header for electronic components board in surface mount and through-hole assemble  
A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame...
6661674 System comprising at least two printed circuit boards  
In a system having two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One...
6651321 Microelectronic joining processes  
A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the...
6646863 Semi-private internet kiosk  
An embodiment of the present invention includes a kiosk having a computer system therein that allows a seated person to access a computer network, such as the Internet. A hinged keyboard retracts...
6608384 Semiconductor device and method of forming the same  
A semiconductor device includes a bonding-structure for electrically and mechanically bonding a solder ball to the electrode pad. The bonding-structure includes flexible arms that are connected to...
6603663 Electronic unit  
The invention relates to an electronic unit having a mounting board ( 4 ) and electronic components ( 1-3 ) mounted on it, with the mounting board ( 4 ) having metal webs ( 41 ) which are embedded...
6594152 Board-to-board electrical coupling with conductive band  
A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit...
6574113 Electronic package with stacked connections and method for making same  
An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and...
6552277 Techniques for forming a connection between a pin and a circuit board  
The invention is directed to techniques for forming a connection between a pin and a circuit board using a pin having protruding portions and grooved surfaces that extend between the protruding...
6496381 Contact arrangement and counter-contact module  
A contact arrangement for an electrically contactable module that is arranged on a card-shaped carrier, having a first contact bank with a plurality of contact areas, of which at least one is...
6493240 Interposer for connecting two substrates and resulting assembly  
The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard,...
6493238 Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards  
A method and system of utilizing inexpensively manufactured, electrically conductive and mechanically compliant disks to interconnect an area grid array (“AGA”) chip to a printed wiring board....
6465747 Microelectronic assemblies having solder-wettable pads and conductive elements  
A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the...
6442033 Low-cost 3D flip-chip packaging technology for integrated power electronics modules  
Resistance and parasitic inductance resulting from interconnection of semiconductor chips in power modules are reduced to negligible levels by a robust structure which completely avoids use of wire...
6437989 Circuit board with an electronic component and a method for producing a connection between the circuit board and the component  
This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at...
6424535 Hybrid circuit with contact surfaces (solder pads)  
A plate-shaped ceramic circuit substrate ( 6 ), which is adapted to be vertically mounted on a mother board, has near a lower edge ( 7 ) thereof a series of contact areas (solder pads) ( 1 ) for...
6407927 Method and structure to increase reliability of input/output connections in electrical devices  
A method and connecting structure includes a first surface and a connection pad on said first surface, wherein, said first surface includes an opening adjacent to said connection pad, and wherein,...
6399889 Head interconnect circuit with alignment finger  
A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads...
6377468 Electric circuit apparatus  
Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls...
6373714 Surface mounting part  
The present invention is to provide a surface mounting part, capable of corresponding to high density mounting of a mother board and capable of achieving a small size, to be mounted on a mother...
6372998 Electrical component connecting structure of wiring board  
An electrical component connecting structure for an electrical component having a terminal is disclosed. The electrical component connecting structure comprises an insulating plate and a bus bar....
6362437 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same  
A mounting structure of an integrated circuit device includes an integrated circuit device, a mounting board, a first solder bump, and a second solder bump. The integrated circuit device is mounted...
6362436 Printed wiring board for semiconductor plastic package  
Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder...
6359790 Multichip module having a silicon carrier substrate  
Semiconductor chips are mounted in flip-chip technology on the multilayer wiring of the silicon carrier substrate. The underside of the substrate is provided with soldering contacts in the form of...
6344781 Broadband microwave choke and a non-conductive carrier therefor  
An electrically conductive wire wound into a conical coil 1 with leads from the small and large ends of the coil. The coil is filled with fine-grained magnetic material 11 , and is mounted in a...
6324754 Method for fabricating microelectronic assemblies  
Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and...
6295206 Memory card, and receptacle for same  
A memory card is disclosed which has a card body (2) having a concavity (9) formed at the forward end thereof in the inserting direction and in which terminals (5) are disposed and projections (10)...
6294742 Apparatus and method for adapting surface mount solder pad for heat sink function  
A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface...
6291894 Method and apparatus for a semiconductor package for vertical surface mounting  
A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least...
6243268 Cooled IC chip modules with an insulated circuit board  
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the...
6208524 Electronic apparatus, battery powerable apparatus, and radio frequency communication device  
Electronic apparatus, battery powerable apparatus, and radio frequency communication devices are disclosed. In but one implementation, an electronic apparatus comprises a substrate having a...
6201350 Discharge lamp lightning apparatus and manufacturing method therefor  
In a discharge lamp lighting apparatus for a discharge lamp, each circuit component including a starter transformer is assembled to a bus bar casing, and a high voltage terminal of the starter...
6191472 Hole geometry of a semiconductor package substrate  
A semiconductor package substrate includes at least one insulative layer, at least two metal lines next to one another on a first side of the insulative layer, and a first metal layer on a second...
6184576 Packaging and interconnection of contact structure  
A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation. The packaging and...
6137690 Electronic assembly  
An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at...
6133626 Three dimensional packaging configuration for multi-chip module assembly  
A multi-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be...
6075708 Partly bent electric circuit substrate and method for manufacturing the same  
A partly bent electric circuit is formed including a main circuit substrate in which electric parts such as IC are carried to form an electric circuit, a sub-circuit substrate in which electric...
6010061 Reflow soldering method  
With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a...
5996880 Method of manufacturing dual-bank memory modules with shared capacitors  
A memory module has DRAM chips mounted on both a front and a back surface but decoupling capacitors mounted on only the front surface. Each decoupling capacitor is for suppressing current spikes...
Matches 1 - 50 out of 103 1 2 3 >