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7556405 |
Mounting light emitting diodes
A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The...
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7532481 |
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate...
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7417867 |
Printed wiring board and display apparatus
A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to...
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7237330 |
Method for making conductive circuits using powdered metals
Conductive circuits and methods of making conductive circuits are disclosed.
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7113400 |
Housing structure of electronic control unit and mounting structure of the same
A housing for enclosing an electronic control unit is constructed of a resinous cover and a metallic case having heat conductivity higher than that of the resinous cover. An air intake module is...
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6924168 |
Method of forming a structure for supporting an integrated circuit chip
A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in...
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6803114 |
Manufacturing process for laminated cards with intermediate PETG layer
The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene...
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6774971 |
LCD with flexible connecting means to hard transparent circuit substrate
With the embodiment of the present invention, a liquid crystal display can be produced at a low cost, which employs the COG technology, saves installation space, mounts LSIs, and, after the LSIs...
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6757174 |
Switching power-supply module
A switching power-supply module includes a coil pattern of a transformer or an inductor disposed on a substrate. A portion of the coil pattern projects into an edge portion of the substrate. A...
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6496382 |
Radio frequency identification tag
A radio frequency identification tag is made with printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent the antenna coil for carrying...
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6496377 |
Vehicle electric power distribution system
A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of...
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6449167 |
Method and apparatus for building and testing electronic circuits
A method and system with a magnetically attractive breadboard and associated devices for constructing and testing electronic circuits. The breadboard can comprise a single or multi-layer circuit...
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6359233 |
Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof
Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for...
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6294744 |
Multilayer print circuit board and the production method of the multilayer print circuit board
The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an...
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6195257 |
Apparatus and method of adapting a rectifier module to enhance cooling
A module mount for use in electrically and mechanically mounting an encapsulated power rectifier module, having a plurality of rigid leads protruding from a major mounting surface thereof, in an...
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6090468 |
Multilayer wiring board for mounting semiconductor device and method of producing the same
A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus...
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6005766 |
Multi-layered printed circuit board and its manufacturing method
A multi-layered printed circuit board (PCB) for use in items of portable electronic equipment which use a housing having a convex-concave part and/or a bent part, includes a PCB section having a...
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5776662 |
Method for fabricating a chip carrier with migration barrier, and resulating chip carrier
To inhibit the migration of conductive layers in a multilayer chip carrier, e.g., a multilayer printed circuit board, an optically cured layer 13, which is an anti-migration layer, is formed in an...
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5763060 |
Printed wiring board
Described is a printed wiring board comprising a composite of an electrically conductive core laminated with layers of dielectric material and electrically conductive material.
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5703761 |
Shielding for flat modules
For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The...
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5541813 |
Portable telephone apparatus having case with wiring member embedded in a molded plastic hinge
A case houses a portable telephone apparatus having a display portion, an operating portion, a speaker portion and a microphone portion provided with respect to two main portions and a hinge...
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5434748 |
Hermetic electronic equipment with flexible diaphragm, fastened to case by elastic U-shaped ring, for absorbing pressure fluctuations
An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of...
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5432676 |
Electronic apparatus case with wiring member embedded in a molded plastic hinge
A case for housing an electronic apparatus has two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge...
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5371407 |
Electronic circuit with diamond substrate and conductive vias
The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the...
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5315239 |
Circuit module connections
Low temperature, co-fired ceramic (LTCC) modules (10, 80, 82, 110, 102, 140, 160) are interconnected to one another, stacked and automatically connected to other modules by rigid LTCC...
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5243495 |
Removable enclosure housing a rigid disk drive
A removable self-contained rigid disk drive has a head and disk assembly (HDA) and controller enclosed by a top and bottom cover. The industry standard form factor drive is externally dimensioned...
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5075822 |
Housing for installation in motor vehicles
The invention relates to a housing for installation in motor vehicles to hold electronic components arranged on a PCB. In accordance with the invention, the housing comprises a trough-shaped...
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5047896 |
Assembly of multi-layer circuit boards secured by plastic rivets
An assembly of aligned, stacked, circuit boards for hot-pressing in an evacuated bag utilizes a sliding body formed of a thermoplastic material which is inserted into elongated peripheral board...
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5045973 |
Procedure for manufacturing a radio telephone chassis and a chassis manufactured according to this procedure
A procedure for manufacturing a radio telephone chassis and for mounting circuit boards on the chassis, and a radio telephone chassis produced according to the procedure. The chassis is made from a...
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5027255 |
High performance, high current miniaturized low voltage power supply
A high performance, high current, miniaturized low voltage power supply is disclosed which employs a thick copper-ceramic film primary board, a direct bonded copper secondary, flexible printed...
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4893215 |
Electronic circuit apparatus of automobile
Electronic circuits (11,12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the...
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4858075 |
RF shielded and electrically insulated circuit board structure and method of making same
An RF shielded and electrically insulated circuit board structure comprises a first layer of shrink wrap tubing wrapped on a circuit board substrate, and a layer of an electrically conductive RF...
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4855870 |
Assemblies for supporting electrical circuit boards within tubes
The present invention is directed to an assembly for supporting an electrical circuit board within a tube. The assembly comprises a circuit board, an elongated support spine extending...
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4847732 |
Wafer and method of making same
Disclosed is a wafer substrate for integrated circuits 1 which by itself may be made either of conductive or non-conductive material. This substrate carries two planes or layers of patterned metal...
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4843520 |
Electronic circuit module
An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon...
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4823234 |
Semiconductor device and its manufacture
A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of...
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4788626 |
Power semiconductor module
A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom....
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4777563 |
Thin type electronic instrument
Disclosed in a thin type electronic instrument having a structure comprising a circuit base plate for mounting an integrated circuit chip thereon and a power source battery for supplying power to...
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4777562 |
Wire wrap single in-line package
A thick film passive network on an alumina substrate, the passive elements being terminated by conducting metal leads. The network, substrate and a small portion of each lead is encapsulated in a...
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4728834 |
Compact digital resolver/encoder assembly with flexible circuit board
The compact digital resolver/encoder assembly comprises a resolver and a flexible printed circuit board having a number of electronic components for decoding the resolver mounted on the flexible...
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4725923 |
Circuitry protection apparatus
Apparatus for holding a plurality of circuits and related voltage protection devices in a manner such that: (a) the voltage protection devices are located between the circuitry of a system and the...
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4701830 |
Electronic circuit module
An electronic circuit module having a magnetic base plate, a plurality of coils wound on the magnetic base plate, a circuit pattern formed on the surface of the magnetic base plate, a circuit...
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H000307 |
High "G" electronics system
The invention concerns a technique and apparatus for protecting sensitive ectronic components against the high accelerations encountered in a tank-powered projectile, for instance. A first ring is...
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4670813 |
Programmable lamp plug
An encodable printed circuit board is provided. The circuit board has a plurality of circuit runs disposed on its surface, each of the circuit runs corresponding to a unique bit in an encoded word....
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4652974 |
Method and structure for effecting engineering changes in a multiple device module package
In a semiconductor module with a substrate having a plurality of semiconductor devices mounted on the top surface, an internal metallurgy system interconnecting the devices, an auxiliary set of...
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4652973 |
Chip carrier mounting apparatus
An apparatus for mounting ceramic chip carrier devices onto printed circuit boards. The apparatus includes an adapter assembly with contact terminals, which is positioned and secured by a plastic...
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4626960 |
Semiconductor device having soldered bond between base and cap thereof
A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering...
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4603374 |
Packaging module for a semiconductor wafer
A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is...
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4600969 |
Protective apparatus for encapsulating electrical circuits
An encapsulating apparatus for protecting an electrical circuit, the electrical circuit comprising a plurality of discrete electrical components supported on a circuit board and connected...
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4541035 |
Low loss, multilevel silicon circuit board
A silicon circuit board incorporates multiple levels of patterned conductors. First level upper and lower patterned conductors are situated on an insulation-coated, monocrystalline silicon...
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