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7605480 Flip chip interconnection pad layout  
A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from...
7599172 Electronic speed controller with modular layout  
An electronic speed controller including a cabinet, a display and dialogue module, and a control bus connector. The cabinet includes an electronic control/command assembly. The display and dialogue...
7589974 Modular server and method  
A modular computer system is provided. In one embodiment, the system includes a computer server having a first printed circuit assembly disposed within a first housing and an expansion connector....
7572154 Joint connector  
A joint connector ( 10 ) has sub-housings (S) (S 1 to S 6 ) that can be built up in plural levels. Projecting pieces ( 31 ) project on outer sides of the respective sub-housings (S) in directions...
7566960 Interposing structure  
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
7566248 Expandable function data storage device  
An expandable function data storage device includes a first main body and a second main body. The first main body has a memory circuit unit. Its first end is exposed outside and has a first signal...
7532485 Multilayer module and method of manufacturing the same  
A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer....
7518222 Apparatus and system for an IC substrate, socket, and assembly  
An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may...
7515430 Conductive hook and loop shockmount system  
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
7505276 Semiconductor module provided with contacts extending through the package  
A semiconductor module includes a package, a plastic molding compound and contacts extending through the package from an underside of the package to an upper side of the package. The package...
7495334 Stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with...
7490189 Multi-chip switch based on proximity communication  
A switch contains a first semiconductor die, which is configured to receive signals on a plurality of input ports and to output the signals on a plurality of output ports. The first semiconductor...
7482073 Cascade fuel cell system  
A fuel cell installation includes a cascaded fuel cell block, for essentially waste gas-free operation. An installation of this type presents the problem that the cascaded fuel cell block is...
7459773 Stackable ball grid array  
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball...
7460025 Power supply device for low power switching sensors of a modular system  
The invention relates to a power supply device for energizing a modular measuring system. The measuring system comprises a modular display and adjustment unit and a modular low power sensor unit....
7457129 Multilayer printed wiring board  
There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first...
7450395 Circuit module and circuit device including circuit module  
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between....
7435619 Method of fabricating a 3-D package stacking system  
The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a...
7432593 Semiconductor package assembly and method for electrically isolating modules  
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
7420814 Package stack and manufacturing method thereof  
A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first...
7391342 Low-cost keypad encoding circuit  
A keypad encoding circuit contains a voltage dividing network and an integrated circuit. The voltage dividing network includes a string of resistors that generates an encoding signal voltage. The...
7372170 Flip chip interconnection pad layout  
A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from...
7336491 Heat sink  
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
7327580 Electronic board device comprising a rack and an electronic board chassis for insertion into the rack  
This device is of the type comprising a rack, a chassis that can be inserted into the rack, and at least one electronic board that can be inserted into the chassis. According to one aspect of the...
7321164 Stack structure with semiconductor chip embedded in carrier  
A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and...
7298625 Expansion structure of memory module slot  
An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the...
7285847 Chip stack package, connecting board, and method of connecting chips  
A chip stack package, a connecting board, and a method of connecting multiple, stacked semiconductor chips multi-chip package comprises a plurality of stacked packages including an upper package...
7265992 Negotiating electrical signal pathway compatibility between reconfigurable circuit modules  
An electrical signal pathway compatibility is negotiated between a first reconfigurable circuit module and a second, connected, reconfigurable circuit module. The first reconfigurable circuit...
7253510 Ball grid array package construction with raised solder ball pads  
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised...
7242589 Stackable modular computer housing, and computer device including the same  
A stackable modular computer housing includes a rectangular frame, and top and bottom covers. The frame includes upright left and right side plates, a hollow connecting plate, two first slide...
7209358 Aggregation switch  
A computer system comprises a plurality of shelves. Each shelf has a carrier for removably receiving a plurality of information processing modules and a switching module. Each shelf also has an...
7184272 Modular RF terminal having integrated bus structure  
A miniature, multimode, modular RF terminal includes a plurality of processing modules, where at least one of the processing modules includes an external connector for conveying an input or output...
7173340 Daisy chaining of serial I/O interface on stacking devices  
A bottom die and a top die stacked on the bottom die are configured to provide a daisy chain function. Both die include an input/output function control bonding pad ( 20 G), a first bonding pad (...
7145233 Decoupling capacitor closely coupled with integrated circuit  
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and...
7114993 Multipurpose memory card adapter  
A multipurpose memory card adapter including a base and a cover. The base has first conductive pieces corresponding to connecting fingers of memory cards of Secure Digital (SD) card, Multimedia...
7116553 Circuit board enclosure  
The invention provides an expandable modular enclosure system for enclosing circuit boards connected by a stackable bus. The enclosure system includes one or more carriers and spacers, a base unit,...
7114047 Data storage medium with certification data  
A data storage medium has a first memory area that is read-only and stores first certification data that is unique to the data storage medium, a second memory area that stores data and second...
7095607 Electronic apparatus with a removable component  
A removable component is inserted into the receptacle provided in a housing, through an inlet port provided in the outer surface of the housing. A first lock member is provided in the housing and...
7038915 Apparatus, system, and method for arraying electrical devices in a cabinet  
A mounting frame located in a computer cabinet equipment drawer can be transitioned to a loading position to receive an electrical device. The mounting frame in the loading position provides ample...
7006352 Interface panel structure  
An interface panel structure used in an electric machine; comprises a fixed seat with a fixed seat with a holding element and sliding rails and a movable sliding seat installed therein. Fixing...
6999305 Modular electrical distribution system  
A modular electrical distribution system includes a number of linked segments. A first electrical component is mounted in one of the segments and a second electrical component is mounted in another...
D514102 Modular storage system  
6968958 Stackable and detachably coupled electronic device modules  
An apparatus comprises a first electronic device module that comprises a structural stackable rack component that is attached to and supports an electronic device. A second electronic device module...
6969906 Multi-chip package and method for manufacturing the same  
Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which...
6961233 Module for electrical apparatus, particularly, a field bus module  
A field bus module assembly includes a generally rectangular base module adapted for mounting on a fixed support, an input/output module, and a connecting module for connecting the input/output...
6958916 Rackmount computer system and method  
A rackmount computer system comprises a 2U rackmount chassis. The system also comprises a card cage adapted to receive at least four vertically stacked and horizontally oriented cards. The card...
6958531 Multi-substrate package and method for assembling same  
A multi-substrate, microsystem package and a method for assembling same including a high-density flexible connector array are disclosed for use in compact and multi-substrate packages containing...
6951982 Packaged microelectronic component assemblies  
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
6944031 PCB structure for scope unit of electronic endoscope  
A printed circuit board structure for a scope unit of an electronic endoscope system, which is provided with a first printed circuit board formed with a first circuit section, and a second printed...
6914786 Converter device  
The present invention is directed to a converter device. In a first aspect of the present invention, a converter device includes a board having a first side and a second side. The first side...
Matches 1 - 50 out of 304 1 2 3 4 5 6 7 >