Matches 1 - 50 out of 202 1 2 3 4 5 >
Match Document Document Title
7443687 Heat sink mounting device and mounting method, and server blade using the same  
A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even...
7408782 Multiple printed circuit board heat transfer guide plates  
A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink...
7400506 Method and apparatus for cooling a memory device  
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
7394654 Method and apparatus for providing thermal management in an electronic device  
An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in...
7375970 High density memory module using stacked printed circuit boards  
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the...
7375287 Assembly for accommodating the power electronics and control electronics of an electric motor  
An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board...
7372701 Cantilever mounted electronic module with rigid center backbone  
A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic...
7365990 Circuit board arrangement including heat dissipater  
A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major...
7365974 Method for electronics equipment cooling having improved EMI control and reduced weight  
An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a...
7359191 Storage device system and cooling structure for logic circuit board for storage device system  
In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on...
7345885 Heat spreader with multiple stacked printed circuit boards  
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat...
7342797 Interposable heat sink for adjacent memory modules  
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed...
7342789 Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling  
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having...
7339793 Interposable heat sink for adjacent memory modules  
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed...
7336490 Multi-chip module with power system  
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural...
7317248 Memory module having memory chips protected from excessive heat  
The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected...
7289331 Interposable heat sink for adjacent memory modules  
A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed...
7286365 Electronic substrate for a three-dimensional electronic module  
The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being...
7280365 Multi-processor module with redundant power  
One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first...
7280364 Apparatus and method for multiprocessor circuit board  
One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A...
7280356 Air cooling architecture for orthogonal board architectures  
An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the...
7277286 Computers  
Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or...
7274573 Assembly for installation of power electronics modules and installation method  
A method and assembly for mounting power electronics modules in an equipment cabinet, cubicle or other like equipment space. According to the invention, the power electronics modules are mounted in...
7274571 Heatsink  
A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality...
7274569 Power conversion device  
A power conversion device is downsized by integrally constructing a power conversion module and a control circuit board. The power conversion device includes a power conversion module 11, a...
7269019 Mounting substrate and driving device using same  
A driving device for a motor has a mounting substrate mounted to a base substrate. Highly heat-generating components such as a switching element for PWM control are mounted to the mounting...
7265985 Heat sink and component support assembly  
A heat sink and component support assembly that includes a core structure ( 110 ). The core structure ( 110 ) includes: a central member ( 112 ) having first ( 114, 116 ) and second opposing sides;...
7254036 High density memory module using stacked printed circuit boards  
A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the...
7254035 Circuit substrate unit and electronic equipment  
Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381 a and a power source substrate 381 b . A hood ...
7254027 Processor module for system board  
Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to...
7248479 Thermal management for hot-swappable module  
A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component...
7236362 Minimization of cooling air preheat for maximum packaging density  
An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet,...
7218517 Cooling apparatus for vertically stacked printed circuit boards  
An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB...
7215552 Airflow redistribution device  
In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit...
7212409 Cam actuated cold plate  
A cooling system for a computer includes a cam-actuated cold plate. Compliant, thermally conductive pins on the cold plate contact electronic heat generating electronic components when the cold...
7209351 Telecom equipment chassis using modular air cooling system  
This application discloses an apparatus comprising a chassis comprising a box having a perforated top, a perforated bottom and four sidewalls, wherein at least two on the sidewalls have air vents...
7184269 Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly  
A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics...
7180737 Heat exchanger system for circuit card assemblies  
An apparatus for housing and cooling circuit card assemblies employed in communication and other systems is disclosed including a chassis having opposed end walls which are formed with a series of...
7149086 Systems to cool multiple electrical components  
According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a...
7123249 Display device including imperfect connection parts extending between printed circuit boards for bridging  
In a display device including a display panel and a multi-layered printed circuit board which is arranged along one side of the display panel and is electrically connected to a plurality of leads...
7120027 Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures  
Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat...
7110258 Heat dissipating microdevice  
A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first...
7106595 Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board  
A daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side...
7099157 Retaining and heat dissipating structure for electronic equipment  
A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ),...
7099153 Heat dissipating structure for an electronic device  
A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of...
7079396 Memory module cooling  
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more...
7075789 Mechanical housing  
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case...
7061765 Electronic device  
An electronic device (GER) with a housing (GEH), in which at least one circuit substrate (STT) is provided with an assembly side (BES), whereby at least one electronic component (BAU) is arranged...
7061760 Memory cooler  
An apparatus for cooling memory modules installed in adjacent sockets on a circuit board is provided. The apparatus includes a fan for directing cooling air through air gaps between adjacent memory...
7002805 Thermal enhance MCM package and manufacturing method thereof  
A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The...
Matches 1 - 50 out of 202 1 2 3 4 5 >