Match Document Document Title
9041181 Land grid array package capable of decreasing a height difference between a land and a solder resist  
A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a...
9036354 Heat sink thermal press for phase change heat sink material  
Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter...
9036353 Flexible thermal interface for electronics  
A planar heat pipe for removing heat from an electronic device. The heat pipe includes a planar portion defining a cool end of the heat pipe and a plate portion mounted to the electronic device...
9030826 Chip-on-film packages and device assemblies including the same  
Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface,...
9013869 Consolidated thermal module  
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
9013878 Electronic system for reflow soldering  
An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic...
9013879 Electronic component cooling hood and heat pipe  
An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is...
9007773 Housing unit with heat sink  
Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a...
8995130 Power supply unit using housing in which printed circuit board is housed  
In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board...
8995132 Structure for mounting heat sink, and heat sink mounted using the structure  
A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size...
8995129 Heat radiator and manufacturing method thereof  
A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the...
8982562 Line replaceable unit with universal heat sink receptacle  
A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader...
8982559 Heat sink, cooling module and coolable electronic board  
A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is...
8978739 Heat dissipating device  
A heat dissipating device for dissipating heat from a heat radiation element includes a base, a fixing frame, a fan, and a securing arm. The fixing frame is fixedly attached to the base, and the...
8976528 Fasteners and dual-thickness thermal stages in electronic devices  
The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component...
8967586 Heat dissipating device supporting apparatus  
A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a...
8964384 Component cooling  
Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component....
8964393 Display device  
The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected...
8958209 Electronic power module, and method for manufacturing said module  
Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a...
8958208 Semiconductor device  
A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation...
8953325 Electronic device with heat dissipating and electromagnetic shielding mask  
An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several...
8946904 Substrate vias for heat removal from semiconductor die  
A substrate comprising a plurality of layers, a first side and a second side; and a via extending through the substrate from the first side to the second side. The via comprises:a first substrate...
8947881 Housing for an on-board electronic card  
A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with...
8941996 Circuit board and heat dissipation device thereof  
A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a...
8937392 Semiconductor device  
A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first...
8934250 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling...
8934249 Electronic device with heat dissipation assembly  
An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation...
8934247 Fastener  
A fastener includes a main body, a washer, and a spring. The main body includes a pole, two spaced latches extending from a top end of the pole, and two spaced legs extending down from a bottom...
8934258 Motor controller  
A motor controller comprising multiple types of interfaces assigned automatically, including a mother circuit board and a daughter circuit board. The daughter circuit board is plugged into the...
8929080 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing...
8929078 Electronic control device  
The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields....
8929077 Thermal connector  
A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top...
8929079 Electronic control device  
An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that...
8923004 Microelectronic packages with small footprints and associated methods of manufacturing  
Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate,...
8913391 Board-level heat transfer apparatus for communication platforms  
An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit...
8908373 Cooling structure for an electronic component and electronic instrument  
A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is...
8905775 Electrical connector assembly and retaining device thereof  
An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end...
8902592 Heat sink and method for fixing heat sink  
A heat sink for cooling a device mounted on a mount board, the heat sink having a plurality of grooves at different heights in a surface opposite a surface in contact with the device.
8902623 Power inverter  
In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a...
8902588 Set-top box having microperforations  
The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking...
8902599 External structure of outdoor electronic apparatus  
An external structure of an outdoor electronic apparatus for packaging a circuit board having a power line is provided. The external structure includes a housing having an opening and a waterproof...
8897012 Electronic device and heat dissipation module thereof  
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat...
8897016 Heat removal in compact computing systems  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
8893770 Heat sink assembly for electronic components  
One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin...
8897015 Base plate  
The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminum, wherein at least two reinforcements are provided in the...
8897008 Information handling system low profile pluggable cooling fan and connector  
A connection arm couples to a cooling fan main body to enclose wires extending from the main body to an end of the connection arm that holds a plug of the wires in a position aligned with a...
8891240 Apparatus and method for cooling a semiconductor device  
An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective...
8891234 Electronic apparatus with heat dissipation module  
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached...
8891241 Electronic assembly  
An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the...
8885343 Heat dissipation from a control unit  
A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having...