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7602610 |
Electronic device
According to one embodiment, an electronic device is provided with a heat transfer unit and a pressing member. The heat transfer unit includes a heat receiving portion thermally connected to a heat...
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7558072 |
Adapter module
An adapter module is described. The adapter module includes a circuit board, a first socket and an adapter device. One face of the first socket is electrically connected to the circuit board on the...
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7558064 |
Cooling apparatus
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the...
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7554808 |
Heat sink with thermoelectric module
An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with...
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7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In...
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7523617 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the...
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7525804 |
Semiconductor device and method of manufacturing the same
A semiconductor package is provided with a low thermal conductivity plate that covers an entire upper surface of a heat dissipating component, by which heat dissipation from the heat dissipating...
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7522886 |
Radio frequency transceivers
A radio frequency transceiver having a printed circuit board (PCB) on which are located a plurality of components, the PCB being sandwiched between a base and a cover. The cover having a plurality...
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7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate...
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7486518 |
Cooling device and electronic apparatus
According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a...
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7477515 |
Electronic apparatus and thermal dissipating module thereof
A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a...
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7473585 |
Technique for manufacturing an overmolded electronic assembly
A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a...
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7471534 |
Inverter type motor drive unit
An inverter type drive unit for feeding AC electric power of variable parameters to an electric motor has an electronic control section, and a power converting and output section which includes one...
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7468886 |
Method and structure to improve thermal dissipation from semiconductor devices
A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second...
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7460371 |
Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink
In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component...
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7453145 |
Electronics unit
An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components...
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7446410 |
Circuit module with thermal casing systems
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the...
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7442882 |
3D checkerboard perforation pattern for increased shielding effectiveness
An improved electromagnetic radiation (EMR) shield that has minimal airflow resistance is presented. The EMR shield includes: a base plate; and plurality of columns that project away from the base...
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7417861 |
Vehicular power converter
To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The...
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7408777 |
Plasma display device
A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a...
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7405935 |
Service tray for a thermal management system
A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a...
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7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking
Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling...
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7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to...
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7385824 |
Processor module with rigidly coupled processor and voltage-regulator heat sinks
A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact...
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7375963 |
System and method for cooling a module
Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first...
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7362577 |
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one...
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7362574 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold...
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7359201 |
Heat-generating electronic part cover and cover mounting method
A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body ( 20 ) of rectangular prism shape having...
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7336486 |
Synthetic jet-based heat dissipation device
A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a...
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7307845 |
Multiple integrated circuit package module
A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each...
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7295435 |
Heat sink having ferrofluid-based pump for nanoliquid cooling
A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source,...
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7277282 |
Integrated circuit cooling system including heat pipes and external heat sink
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes....
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7265979 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation
A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in...
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7265976 |
Microchannel thermal management system
A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a...
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7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are...
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7254033 |
Method and apparatus for heat dissipation
Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
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7254032 |
Techniques for providing EMI shielding within a circuit board component
A circuit board component includes a substrate having non-conductive material and conductive material supported by the non-conductive material. The conductive material defines a circuit board...
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7245495 |
Feedback controlled magneto-hydrodynamic heat sink
A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the...
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7245083 |
Incandescent lamp with integral controlling means
An incandescent lamp has incorporated a circuit board within a recess in the bulb, wherein the circuit board contains connections and circuitry to control power to the lamp filament while...
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7236367 |
Power electronics component
The invention relates to a power electronics component that comprises a planar ceramics substrate ( 2 ) on whose one face condutor tracks ( 6 ), applied in thick-film technique, are disposed for...
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7218523 |
Liquid cooling system
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat...
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7218519 |
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels
Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.
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7209354 |
Ball grid array package with heat sink device
The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink...
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7200007 |
Power stack
A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows....
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7200011 |
Thermal interface adapter plate conversion kit and method
A method of selectively assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. A plurality of different mounting hardware for a...
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7176382 |
Electrical circuit board and method for making the same
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes. The method includes forming channels in a first and second pre-circuit assembly and...
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7170749 |
Electrical apparatus and connector holder for electrical apparatus
An electric apparatus has a motherboard, a control board and daughter board in a case. A front wall of the case is configured to have an opening. The motherboard is placed far behind an opening...
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7170748 |
Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis
The heat sink assembly includes a heat sink member with a body portion and an upper mounting portion. The heat sink member is connected to an integrated circuit on a printed circuit board assembly....
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7161808 |
Retaining heat sinks on printed circuit boards
A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed...
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