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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7567439 |
Heat dissipation device having a rotatable fastener
A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and...
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7561430 |
Heat management system for a power switching device
A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board,...
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7532475 |
Semiconductor chip assembly with flexible metal cantilevers
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and...
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7514784 |
Electronic circuit device and production method of the same
An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered...
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7505275 |
LED with integral via
A light emitting diode comprising a body and a thermal via integral therewith and which extends from the body.
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7487581 |
Method of manufacturing an inverter device
By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of...
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7477518 |
Sub-assembly
According to an embodiment, a power semiconductor module comprises a heat-dissipation contact area configured to thermally connect the power semiconductor module to a cooling element. The power...
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7473585 |
Technique for manufacturing an overmolded electronic assembly
A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a...
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7463488 |
Accessor movably disposed within an automated data storage and retrieval system
An accessor moveably disposed within an autowated data storage and retrieval system is provided, wherein the automated data storage and retrieval system includes one or more power supply modules...
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7459784 |
High capacity thin module system
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator
A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a...
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7430121 |
Heat sink fastener
A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part...
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7429720 |
Electric heating pipe and electric heating apparatus using it
The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is...
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7420811 |
Heat sink structure for light-emitting diode based streetlamp
A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat...
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7417862 |
Heat sink fixing device
A heat sink fixing device for fixing a heat sink on a printed circuit board is disclosed. The fixing device comprises a connecting portion fixed on one side of the heat sink, an extension portion...
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7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to...
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7385824 |
Processor module with rigidly coupled processor and voltage-regulator heat sinks
A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact...
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7365986 |
Semiconductor cooling device and stack of semiconductor cooling devices
To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor...
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7362577 |
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one...
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7355858 |
Heat sink for surface-mounted semiconductor devices and mounting method
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally...
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7342784 |
Cooling method and device for an electronic component
A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor...
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7336495 |
Power component cooling device with a heat sink and one or more cooling fins
Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1 b and cooling fins 1 a provided on the heat sink base 1 b , one 1 c of the cooling fins, which is made...
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7336494 |
Electronic device having compact heat radiation structure
A liquid crystal display (LCD) is fixed to an upper housing half by an LCD fixing frame made of a material having a high thermal conductivity. The LCD fixing frame is attached to the upper housing...
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7307841 |
Electronic package and method of cooling electronics
An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the...
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7295440 |
Integral cold plate/chasses housing applicable to force-cooled power electronics
An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power...
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7254031 |
Display apparatus having heat dissipating structure for driver integrated circuit
A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma...
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7236367 |
Power electronics component
The invention relates to a power electronics component that comprises a planar ceramics substrate ( 2 ) on whose one face condutor tracks ( 6 ), applied in thick-film technique, are disposed for...
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7215023 |
Power module
A power module includes at least one carrier body for mounting at least one power component thereon, and at least one energy storage component. For this purpose, a hybrid circuit is arranged as a...
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7199400 |
Semiconductor package
A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the...
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7151671 |
Power supply
A power supply comprising switching elements ( 20 ), wherein the power supply is provided with first heat sinks ( 30 ) having electrical conductivity to which the switching elements are fitted and...
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7106588 |
Power electronic system with passive cooling
The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board...
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7078803 |
Integrated circuit heat dissipation system
An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation...
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7057897 |
Means for securing a cooling device
Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit....
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7042730 |
Non-isolated heatsink(s) for power modules
A power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body.
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7042723 |
Cooling arrangement for an integrated circuit
A cooling arrangement for one or more integrated circuits which are mounted in a socket on a printed circuit board and which each are cooled by a cooling element based on a compressor. The surface...
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7031162 |
Method and structure for cooling a dual chip module with one high power chip
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to...
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7027303 |
Electronic power module
The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically...
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7006354 |
Heat radiating structure for electronic device
A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is...
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7002803 |
Electronic product with heat radiating plate
An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame...
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6982877 |
Heat sink having compliant interface to span multiple components
A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple...
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6975513 |
Construction for high density power module package
A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips....
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6972959 |
Heat dissipating device for electronic components of electronic control devices
A heat dissipation device is disclosed for dissipating the heat produced by electronic components ( 16 ) of an electronic control device. The electronic control device includes a circuit board ( 14...
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6950305 |
Overmolded device with contoured surface
An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional...
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6947286 |
Stack up assembly
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed...
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6911599 |
Header assembly for optoelectronic devices
A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined...
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6891726 |
Heat sink and antenna
Briefly, in accordance with one embodiment of the invention, a heat sink may have an antenna disposed thereon. The antenna may be rotated away from the heat sink in an upper position to adjust the...
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6890618 |
Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate
An apparatus and method are provided for retaining thermal transfer pins in a spreader plate adapted to transfer thermal energy from an electronic component. The spreader plate includes pin holes...
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6867976 |
Pin retention for thermal transfer interfaces, and associated methods
Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact...
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6864567 |
Base of LED
A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an...
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