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Match Document Document Title
7450389 Sub-assembly  
A power semiconductor module has a heat-dissipation contact surface ( 16 ) for a thermally conductive connection to a cooling element ( 17 ). The module can be simply, cost-effectively and reliably...
7450388 Power converter connection configuration  
EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power...
7450387 System for cooling electronic components  
The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive...
7450378 Power module having self-contained cooling system  
A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises...
7448921 User identification card connecting device for broadcast reception apparatus and broadcast reception apparatus having the same  
A user identification card connecting device for a broadcast reception apparatus and a broadcast reception apparatus having the same are provided. The user identification card connecting device...
7447037 Single chip USB packages by various assembly methods  
A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and...
7443686 Electronic system  
An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through...
7443685 Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly  
An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the...
7443678 Flexible circuit board with heat sink  
A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon....
7440286 Extended USB dual-personality card reader  
A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal...
7440285 Electronic device housing  
Apparatus and methods for housing an electronic device are provided. In some implementations an apparatus is provided. The apparatus includes a base, an electronic device positioned on the base,...
7440282 Heat sink electronic package having compliant pedestal  
An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a...
7436672 Semiconductor device and method of manufacture thereof  
A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A...
7436663 Disk array system  
In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural...
7436661 Two-compartment AC adaptor  
An external AC power adaptor having an additional compartment for cooling. The adaptor has a housing that defines a first compartment having power circuitry for converting an AC input to a DC...
7433229 Flash memory device with shunt  
A shunt activation signal is transmitted by an external control terminal through an external transmission interface to switch a flash memory controller in a shunt mode. The shunt activation signal...
7433199 Substrate structure for semiconductor package and package method thereof  
A substrate structure for a semiconductor a package and a package method thereof are disclosed. A plurality of independent module substrates are arranged on a metal or heat-resistant frame that has...
7433193 Techniques for controlling a position of a transceiver module relative to a connector  
An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a...
7414840 Electrical connector assembly  
An electrical connector assembly ( 100 ) comprises an insulative housing ( 1 ), a plurality terminals ( 100 ) received therein, a chip module ( 2 ) attached on the housing ( 1 ), an cover ( 4 )...
7408781 Cooling device for memory chips  
A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of...
7408779 Heat-dissipating element with connecting structures  
A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure...
7407393 Super slim compact flash (CF) light universal serial bus (USB) device  
An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming...
7400506 Method and apparatus for cooling a memory device  
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
7397664 Heatspreader for single-device and multi-device modules  
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
7397662 Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board  
A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing...
7391613 Memory module assembly including a clamp for mounting heat sinks thereon  
A memory module assembly includes a printed circuit board ( 10 ) having a main heat-generating electronic component ( 52 ) thereon, first and second heat sinks ( 20 ), ( 30 ) attached on opposite...
7391610 Thermal cooling of industrial electronic module by conductive structure  
An electronic module and chassis/module installation are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic...
7388753 Methods and apparatuses for thermal dissipation  
A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided...
7388752 Series-connected heat dissipater coupled by heat pipe  
A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion...
7388749 Support carrier for a disk-drive with integrated heat-sink  
This invention is a support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier includes a heat-sink surface with pin...
7386332 Mobile terminal device  
A mobile terminal device comprises a first case including display unit, and a second case arranged so as to slide with respect to the first case and including input unit. The mobile terminal device...
7385821 Cooling method for ICS  
The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a...
7385812 Method and apparatus for a thermally conductive packaging technique for cooling electronic systems  
A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal...
7382618 Heat dissipating apparatus for computer add-on cards  
A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of...
7382614 Power supply having an extendable power input port  
A power supply having an extendable power input port connecting to a connection line to be installed on a side wall of a computer host. The side wall and the power supply form a heat dissipation...
7379303 Computing device module  
A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a...
7375970 High density memory module using stacked printed circuit boards  
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the...
7375964 Memory module assembly including a clamp for mounting heat sinks thereon  
A memory module assembly includes a pair of heat-dissipation plates ( 10 ), a printed circuit board ( 20 ) sandwiched between the heat-dissipation plates ( 10 ), and four clamps ( 30 ) for securing...
7372701 Cantilever mounted electronic module with rigid center backbone  
A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic...
7372699 Plasma display apparatus  
A plasma display apparatus includes a Plasma Display Panel (PDP). A thermal conductive sheet is attached to one side of the PDP, and a chassis base is connected to the side of the PDP on which the...
7369412 Heat dissipation device  
A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case,...
7365985 Memory module assembly including heat sink attached to integrated circuits by adhesive  
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either...
7359204 Multiple cover memory card  
A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon....
7359199 Portable electronic apparatus  
In a portable electronic device having two circuit boards having a heat generating electronic device, a frame arranged at a position pinched between the circuit boards, a first heat radiating plate...
7355858 Heat sink for surface-mounted semiconductor devices and mounting method  
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally...
7355857 Heat sink gasket  
A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that...
7355853 Module structure and module comprising it  
A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic...
7355848 System and method for removing heat from a subscriber optical interface  
A system and method removes heat from an enclosure or housing of a subscriber optical interface. When a subscriber optical interface housing is attached to a structure such that a partially...
7352576 Multi-processor system and tubelike computer module thereof  
A multi-processor system has a tubelike computer module including plural mother boards configured onto plural side walls of a rack body to form a unitary, continuous and non-segment airflow...
7349227 Electronic control device  
An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is...
Matches 1 - 50 out of 560 1 2 3 4 5 6 7 8 9 10 11 12 >