Matches 151 - 200 out of 288 < 1 2 3 4 5 6 >
Match Document Document Title
6008537 Semiconductor device with heat dissipation metal layer and metal projections  
A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second...
6002585 Device and method for cooling and protecting electronics  
The present invention relates to a method and a device for protecting electronics which are cooled with exterior air. The device comprises an electronic circuit (8) arranged on an electronic...
5991154 Attachment of electronic device packages to heat sinks  
A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit...
5973922 Apparatus and method of securing a heat dissipating cover to a thermally conductive housing associated with a retail terminal  
A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the...
5963423 Surface mountable electronic devices  
A surface mountable electronic device has a case with an opening, an electronic element contained inside the case such as a thermistor or a varistor that generates heats when in operation, a...
5930116 Integrated clamping mechanism  
A heat sink for heat-generating electronic packages wherein the multiple heat-generating circuit packages are mounted on at least one surface of a heat sink and wherein the covers for the heat sink...
5912804 Diode holder with spring clamped heat sink  
A diode holder with spring clamped heat sink includes a unitary holder having spaced apart pockets for the diodes, a heat sink plate, a compression coil spring and connector such as a rivet for...
5898575 Support assembly for mounting an integrated circuit package on a surface  
A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by...
5894108 Plastic package with exposed die  
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically...
5894408 Electronic cartridge which allows differential thermal expansion between components of the cartridge  
An electronic cartridge that may include a cover which is attached to a thermal element. A substrate may be located between the thermal element and the cover. The cartridge may include a first pin...
5892655 Hard disk drive heat sink  
A plate formed with louvers and a depression to heat engage a hard disk drive motor is attached to such a drive. Heat from the motor is transferred to the plate. The louvers dissipate heat...
5887435 Environmentally protected module  
The environmentally protected module (16, 116, 216), which is qualifiable under military and space specifications, uses commercial and/or industrial grade electronic components (18, 20; 118, 120;...
5851337 Method of connecting TEHS on PBGA and modified connecting structure  
A method for connecting TEHS to PBGA and a modified connecting structure for TEHS and PBGA are disclosed. The structure improves both heat dissipation efficiency of PBGA by TEHS with high heat...
5847926 Lightweight packaging  
The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic...
5842514 Electronic unit  
Electronic unit in which a heat conductive mounting comprises two spaced apart holding elements providing a receiving station for a printed circuit board. Edge regions of the board are in heat...
5841340 Solderless RF power film resistors and terminations  
Solderless RF power film resistor and termination assemblies which include a flat film resistor or termination pressed by a nonmetallic clamping plate into thermal contact with a base plate...
5827999 Homogeneous chip carrier package  
A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is...
5764484 Ground ring for a metal electronic package  
There is provided a component for an electronic package and a method for the manufacture of that component. The component has a metallic substrate with a surface coated by a dielectric. A centrally...
5757075 Semiconductor heat sink apparatus  
A semiconductor apparatus includes a semiconductor chip having an upper surface, a lower surface and at least one side surface; a first radiator plate for radiating heat including a plate portion...
5736787 Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices  
A package for relatively high power transistors including heat conducting mounting flange having a relatively large "footprint" relative to the area covered by at least one active chip supported...
5724230 Flexible laminate module including spacers embedded in an adhesive  
An electronic module is provided including a chip bonded to a flexible laminate, and an apparatus for establishing coplanarity of a surface of the module, the apparatus comprising (1) a stiffener...
5650593 Thermally enhanced chip carrier package  
A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a...
5625228 High performance semiconductor package with area array leads  
A package for high performance semiconductor devices is disclosed. The package has area array leads which can be pins, solder balls, or conductive pads. The package provides increased electrical...
5625166 Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect  
An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board...
5621616 High density CMOS integrated circuit with heat transfer structure for improved cooling  
A semiconductor integrated circuit includes a semiconductor circuit chip housed in a package. The package provides for electrical interface of the integrated circuit chip with external circuitry,...
5615085 Temperature control for add-on electronic devices  
An add-on control circuit device for insertion into electronic apparatus such as a laser printer having a first microprocessor with an address line connected to an add-on card connector, a ROM that...
5590030 Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections  
A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween. A heat conduction through inside...
5583377 Pad array semiconductor device having a heat sink with die receiving cavity  
A semiconductor device (10) provides heat dissipation while maintaining a low profile. The device includes a circuitized substrate (12) having an opening (20). Inserted into, or at least covering,...
5570950 Lighting fixture and method of fabrication  
A fluorescent tube lighting fixture and method of fabrication characterized by the selection of a common channel housing including a central mounting bore wherein either a first circuit board...
5552636 Discrete transitor assembly  
A discrete element electronic package (100) includes a heat spreader (180) with a cavity (185) for receiving a substrate (110), a substrate (110) mounted within the cavity (185) of the heat...
5539253 Resin-sealed semiconductor device  
A resin-sealed semiconductor device includes a heat sink on which a semiconductor chip is provided. An output terminal is connected to the semiconductor chip. A casing surrounds the chip and part...
5532430 Receiving housing for dissipator electronic components  
The components (13, 14) are mounted on a two-faced printed circuit (22) fened to a metal heat-conductive substrate (12) which is integral with the housing and to which a connector (8) is...
5526525 Radio transceiver in which the length is dimensioned based on power output requirement  
A radio transceiver having an integrated transmitter and receiver for transmitting and receiving microwaves or higher frequency electromagnetic waves is one of a series of device products...
5489802 Pressure contact type semiconductor device and heat compensator  
A semiconductor substrate (2) is pressed against heat compensators (6, 31) for electrical contact therewith without brazing. Silicone rubber (32) fixes the outer peripheral edge of the...
5455457 Package for semiconductor elements having thermal dissipation means  
A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface...
5450283 Thermally enhanced semiconductor device having exposed backside and method for making the same  
A thermally enhanced semiconductor device (10) having an exposed backside (22) is described. In one embodiment, a PC board substrate (12) is provided having a pattern of conductive traces (14) on...
5437041 Device and method for exerting force on circuit mounted on board through opening of the board to facilitate the thermal conduction between circuit and housing  
An add-on control circuit device for insertion into electronic apparatus such as a laser printer having a first microprocessor with an address line connected to an add-on card connector, a ROM that...
5406120 Hermetically sealed semiconductor ceramic package  
A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections....
5399906 High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator  
A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced...
5386144 Snap on heat sink attachment  
A heat sink (44-48) is detachably mechanically connected to an electronic component package (10) by means of a pair of mutually spaced and parallel spring rods (16, 18) that are fixed to the...
5371653 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus  
A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside...
5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die  
A substrate, a heat slug with an access cavity, a lid, and a heat sink having a stem are used to package a high applied power VLSI die. The substrate comprises a stepped housing cavity at its...
5313097 High density memory module  
A memory module is built up from a power distribution assembly in the form of plates forming a capacitor of low inductance and a flexible circuit substrate. The circuit substrate is populated with...
5311060 Heat sink for semiconductor device assembly  
A first, lower heat sink disposed immediately below and closely adjacent a semiconductor chip (die) in a semiconductor chip assembly is disclosed. The lower heat sink is a flat metallic or ceramic...
5309321 Thermally conductive screen mesh for encapsulated integrated circuit packages  
An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned...
5296739 Circuit arrangement with a cooling member  
The circuit arrangement comprises a mounting plate carrying at least one preferably chip-form component and contact surfaces electrically conductively connected to the component by connecting...
5297007 E/M shielded RF circuit board  
An improved circuit board having a variety of electronic components mounted thereon and having disposed to the autumn side of the circuit board a backing plate having a variety of thicknesses...
5294750 Ceramic packages and ceramic wiring board  
A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a...
5291063 High-power RF device with heat spreader bushing  
A high-power RF feedback resistor assembly includes a flat film resistor or other flat device mounted in thermal communication onto a bushing which is, in turn, mounted directly onto a cooling...
5287001 Cooling structures and package modules for semiconductors  
Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a...
Matches 151 - 200 out of 288 < 1 2 3 4 5 6 >