Matches 101 - 150 out of 286 < 1 2 3 4 5 6 >
Match Document Document Title
6510057 Computing device with a card receptacle  
A computing device having a casing, a printed circuit board (PCB) and a card receptacle moveably supported by the casing for covering an orifice in the casing is disclosed. The card receptacle is...
6501647 Computer with thermal cooling and a thermal cooling system and method  
A thermal cooling system in which a clamp assembly clamps a heat dissipating device to a heat generating device in the chassis of an electrical device. The clamp assembly ensures that the heat...
6483720 EMC protection in digital computers  
A method and implementing electronic tri-plate connection system are provided including a nested set of RF Faraday cages within the system with integrated circuit packages containing the core...
6466449 Multi part disk cage apparatus  
A disk cage assembly into which multiple disk drives may be removably inserted is formed from two separate frames which are identical in shape and design and include complimentary mating features...
6462271 Capping structure for electronics package undergoing compressive socket actuation  
A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a...
6358595 Portable electrical apparatus with metal case having thermal insulation  
The object of the invention is to produce a surface layer that can prevent from uncomfortable sensation upon manual handling of component such as metal chassis used in electronic devices. The...
6356454 Electrical unit having an aligning element  
An electrical unit is described which has a housing or housing part and a fist printed circuit board and a second printed circuit board which can be placed in contact with one another so as to be...
6356435 CPU fan assembly  
An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system...
6355332 Portable electrical apparatus with metal case having thermal insulation  
A portable electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and...
6351194 Electronic component utilizing face-down mounting  
An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed...
6335863 Package for semiconductors, and semiconductor module that employs the package  
A low-cost package for semiconductors that is superior in heat dissipation and capable of preventing the cracking of semiconductor elements at the time of mounting, and a semiconductor module...
6324055 Mobile information processing apparatus and covers for the mobile information processing apparatus and the desktop information processing apparatus  
A mobile information processing apparatus of the present invention having a main body and a display unit that opens and closes, attempts to improve heat releasing efficiency by allowing a transfer...
6317334 Configuration connector for modular data storage system  
The present invention provides a modular data storage system that allows a user to arrange various data storage module configurations within a single system enclosure. More specifically, the...
6313992 Method and apparatus for increasing the power density of integrated circuit boards and their components  
Apparatus and methods for cooling integrated circuit boards and electronic components by providing internal passageways in the components and circuit boards which connect to a fluid manifold. The...
6313525 Hollow package and method for fabricating the same and solid-state image apparatus provided therewith  
A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic...
6303209 Electrical apparatus having metal case with thermal insulation  
An electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing...
6297959 Radiation structure for heating element  
A heating element (IC, transistor or the like) is placed on a printed circuit board and silicon grease is coated on the surface of the printed circuit board side of the heating element. The...
6285550 Sub-cooled processor and companion voltage regulator  
A compact sub cooling method and apparatus arranged for simultaneously sub cooling both a processor and it companion voltage regulator for enhanced performance. A preferred embodiment of the...
6282096 Integration of heat conducting apparatus and chip carrier in IC package  
The present invention suggests a new scheme of integrating a heat conducting promotion apparatus (or heat sink) and a chip carrier (such as a substrate) of an IC package including a chip. It is...
6233146 Rotatable portable computer remote heat exchanger with heat pipe  
A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the...
6212071 Electrical circuit board heat dissipation system  
A cooling system for a circuit board employs a heat-conducing channel within the board. The channel is thermally coupled to an electrical device mounted on the board, and leads to an edge of the...
6191943 Docking station with thermoelectric heat dissipation system for docked portable computer  
A portable computer docking base has incorporated therein a thermoelectric cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer operatively docked to...
6181559 Device for attaching a heat sink  
A device for attaching a heat sink having a first and a second surface to an element generating heat in an electronic system, which element has an upper plane side contacting the first surface of...
6160311 Enhanced heat dissipating chip scale package method and devices  
An enhanced heat dissipating Chip Scale Package (CSP) method and devices include preparing a heat dissipating base with a recess surrounded by a guarding wall. A chip with an integrated circuit...
6151217 Apparatus and method for enabling hot plugging of an integrated circuit  
An apparatus for handling an electrical component, such as a CPU module, having a heatsink mounted to an upper surface and a plurality of contact pins is disclosed. The apparatus has a base plate...
6151214 Bearing structure of a central processing unit  
Disclosed is a bearing structure of a central processing unit comprises a radiating plate, a back plate, a plurality of screws and elastic elements. The radiating plate has a heat conductive...
6137688 Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply  
A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the...
6134109 Control box with door and cooler  
The invention relates to a control box with a box body which can be closed off by a door and a cooler with an inner circuit consisting of a ventilator and an evaporator, and an outer circuit...
6091604 Power module for a frequency converter  
Power module for a current converter, particularly a frequency converter, having at least one printed circuit board equipped at least with power components and having a heat-conducting connection...
6091603 Customizable lid for improved thermal performance of modules using flip chips  
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the...
6081425 Miniaturizing power supply system for portable computers by improving heat dissipation therein  
The present invention discloses a power supply for providing power from an external power source to a portable electronic device. The portable power supply system includes electronic circuits...
6058015 Electronic packages and a method to improve thermal performance of electronic packages  
An electronic package incorporating a heat-generating element which is thermally coupled to a heat-sinking member, through the utilization of a predetermined thermally conductive material, and...
6055158 Electronic component heat sink assembly  
An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a...
6049038 Flip-chip resin sealing structure and resin sealing method  
A sealing resin mixed with filler is used to seal a space between a flip-chip mounted semiconductor device and a printed circuit board. An integrated circuit chip joined to the printed circuit...
6043981 Heat sink assembly for electrical components  
A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is...
6035513 Assemblies of electronic devices and flexible containers therefor  
For economic reasons, space saving and simplicity in design, an assembly is provided of an electronic device and a flexible container with the electronic device inside the container and having...
6034430 Integrated thermal coupling for a heat generating device  
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side...
6028354 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package  
A thermally enhanced package for an integrated circuit, the integrated circuit having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the...
6008537 Semiconductor device with heat dissipation metal layer and metal projections  
A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second...
6002585 Device and method for cooling and protecting electronics  
The present invention relates to a method and a device for protecting electronics which are cooled with exterior air. The device comprises an electronic circuit (8) arranged on an electronic...
5991154 Attachment of electronic device packages to heat sinks  
A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit...
5973922 Apparatus and method of securing a heat dissipating cover to a thermally conductive housing associated with a retail terminal  
A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the...
5963423 Surface mountable electronic devices  
A surface mountable electronic device has a case with an opening, an electronic element contained inside the case such as a thermistor or a varistor that generates heats when in operation, a...
5930116 Integrated clamping mechanism  
A heat sink for heat-generating electronic packages wherein the multiple heat-generating circuit packages are mounted on at least one surface of a heat sink and wherein the covers for the heat sink...
5912804 Diode holder with spring clamped heat sink  
A diode holder with spring clamped heat sink includes a unitary holder having spaced apart pockets for the diodes, a heat sink plate, a compression coil spring and connector such as a rivet for...
5898575 Support assembly for mounting an integrated circuit package on a surface  
A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by...
5894408 Electronic cartridge which allows differential thermal expansion between components of the cartridge  
An electronic cartridge that may include a cover which is attached to a thermal element. A substrate may be located between the thermal element and the cover. The cartridge may include a first pin...
5894108 Plastic package with exposed die  
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically...
5892655 Hard disk drive heat sink  
A plate formed with louvers and a depression to heat engage a hard disk drive motor is attached to such a drive. Heat from the motor is transferred to the plate. The louvers dissipate heat...
5887435 Environmentally protected module  
The environmentally protected module (16, 116, 216), which is qualifiable under military and space specifications, uses commercial and/or industrial grade electronic components (18, 20; 118, 120;...
Matches 101 - 150 out of 286 < 1 2 3 4 5 6 >