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7641505 |
Electrical connector assembly with heat dissipating device
An electrical connector with a heat dissipating device adapted to physically in contact with an electrical package disposed on a socket connector comprises a load plate having a substantially...
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7638714 |
Structure and manufacturing method of substrate board
A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an...
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7639503 |
Printed circuit board and electronic apparatus
According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes...
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7632717 |
Plastic overmolded packages with mechancially decoupled lid attach attachment
The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
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7619893 |
Heat spreader for electronic modules
A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second...
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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7609523 |
Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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7573715 |
High density storage system
The present invention provides methods and systems for storage of data. In one aspect, the invention provides a data storage system that includes a plurality of storage devices, such as, disks, for...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7542293 |
Thermal module
A thermal module includes a heat spreader ( 50 ) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink ( 60 ), a heat pipe ( 70 ) thermally...
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7525803 |
Power converter having multiple layer heat sinks
A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat...
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7522422 |
Heat sink
A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module ( 5 ) through the medium of cooling water includes a base member ( 1 ), a heat sink body ( 2 )...
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7518873 |
Heat spreader, semiconductor package module and memory module having the heat spreader
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat...
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7518871 |
Liquid-based cooling system for cooling a multi-component electronics system
A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when...
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7518870 |
Card slot apparatus having a movable heat radiating unit and electronic machine having the same
A card slot apparatus of a card and an electronic machine includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart...
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7486518 |
Cooling device and electronic apparatus
According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a...
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7468886 |
Method and structure to improve thermal dissipation from semiconductor devices
A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second...
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7427148 |
Light modules
Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole...
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7423341 |
Plastic overmolded packages with mechanically decoupled lid attach attachment
The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
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7411648 |
Liquid crystal display panel with heat radiation plate
An auxiliary plate ( 10 ) is fixed to a rear plane of a housing for fixedly holding a lamp unit ( 6 ) having a plurality of lamps. In the auxiliary plate ( 10 ), a convex portion and a concave...
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7408779 |
Heat-dissipating element with connecting structures
A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure...
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7408776 |
Conductive heat transport cooling system and method for a multi-component electronics system
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based...
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7400504 |
Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple...
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7393236 |
Integrated thermal and electrical connection system for power devices
An electrical system as described herein is suitable for use in an electric or hybrid vehicle. The electrical system includes electrical devices, such as power transistors, coupled to an...
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7365422 |
Package of leadframe with heatsinks
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
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7339791 |
CVD diamond enhanced microprocessor cooling system
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip,...
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7336493 |
Cold plate cooling apparatus for a rack mounted electronic module
Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally...
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7327574 |
Heatsink module for electronic device
A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing...
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7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
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7277244 |
Lens barrel for image taking lens
A heat sink is attached to a subject-side end portion of a barrel body of a lens barrel. The heat sink is provided with a large number of radiation fins formed in whorl. A heat pipe is disposed...
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7277284 |
Microchannel heat sink
A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip,...
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7265979 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation
A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in...
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7239515 |
Thermal assembly for cooling an electronics module
A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip...
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7193854 |
Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly
A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to...
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7164587 |
Integral heatsink grounding arrangement
An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted...
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7126825 |
Combined chip/heat-dissipating metal plate and method for manufacturing the same
A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The...
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7102217 |
Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same
A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical...
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7100281 |
Heat sink and method of making the same
A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second...
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7092255 |
Thermal management system and method for electronic equipment mounted on coldplates
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic...
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7044199 |
Porous media cold plate
A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the...
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7030486 |
High density integrated circuit package architecture
This invention relates to a high density architecture for an integrated circuit package ( 10 ) in which a plurality of circuit communication wafers ( 12 ) are disposed in a stack with a plurality...
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6992892 |
Method and apparatus for efficient temperature control using a contact volume
A substrate holder for supporting a substrate, including an exterior supporting surface, a cooling component, a heating component positioned adjacent to the supporting surface and between the...
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6992888 |
Parallel cooling of heat source mounted on a heat sink by means of liquid coolant
A module includes a cold plate. Solid-state heat sources are thermally mounted on the cold plate in a chamber defined by the cold plate and a lid. Cooling of the heat sources is enhanced by a...
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6989991 |
Thermal management system and method for electronic equipment mounted on coldplates
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic...
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6933603 |
Multi-substrate layer semiconductor packages and method for making same
A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the...
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6903931 |
Cold plate assembly
An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum...
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6873528 |
Supplemental heat conduction path for card to chassis heat dissipation
A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically...
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6862895 |
Semiconductor cooling device and method of controlling same
A semiconductor cooling device includes at least one cold plate for cooling a semiconductor element, a condenser adapted to be cooled by a fan, and a refrigerant pump. The refrigerant pump is...
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6829145 |
Separable hybrid cold plate and heat sink device and method
An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force...
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