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7414848 |
Heat dissipation device
A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a...
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7414841 |
Electronic cooling system having a ventilating duct
A heat dissipation device in a computer enclosure includes a heat spreader ( 20 ) mounted on a CPU ( 12 ), a first heat sink ( 30 ), a cooling fan ( 40 ) coupled to the first heat sink, a second...
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7411792 |
Thermal switch, methods of use and manufacturing methods for same
The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated,...
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7408781 |
Cooling device for memory chips
A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of...
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7408780 |
Compliant thermal interface structure utilizing spring elements with fins
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements...
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7408779 |
Heat-dissipating element with connecting structures
A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure...
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7408777 |
Plasma display device
A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a...
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7405934 |
Fan and cooling apparatus
Holding arms of a frame member of a fan axially extend and project outward from both sides of a housing in a direction perpendicular to a rotational axis of the fan. Catch projections are provided...
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7405448 |
Semiconductor device having a resistance for equalizing the current distribution
A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the...
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7403389 |
Heat dissipation device
A heat dissipation device includes a heat sink ( 10 ) and a fan ( 30 ). The heat sink includes a plurality of fins ( 15 ), and a guiding portion ( 184 ) is formed in the fins. The fan is secured to...
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7400239 |
Universal control apparatus and methods
Apparatus and methods for control of one or more functions within a premises. In one embodiment, the control apparatus comprises a “universal” electronic switch which can be configured...
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7400050 |
Quantum well thermoelectric power source
A quantum well thermoelectric module providing very high conversion of heat energy in to electrical energy. In prefered embodiments the module provides electric power for monitoring, measuring or...
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7397666 |
Wedge lock
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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7394658 |
Heat sink with twist lock mounting mechanism
A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external...
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7391617 |
Cooling arrangement for a computer system
A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the...
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7388751 |
Method and apparatus for attaching a processor and corresponding heat sink to a circuit board
An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the...
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7385826 |
Method to secure a heat sink
A method is disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially...
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7385824 |
Processor module with rigidly coupled processor and voltage-regulator heat sinks
A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact...
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7385823 |
Retention module for a heat dissipation assembly
A retention module for a heat dissipation assembly is disclosed. In a first embodiment, the retention module may include a frame having an external member and an internal member enclosed within the...
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7385822 |
Clip assembly
A clip assembly ( 30 ) for mounting a heat sink ( 20 ) on a printed circuit board ( 10 ) includes a closed annular positioning portion ( 32 ) interferingly engaging with the heat sink, a securing...
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7381346 |
Thermal interface material
A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve...
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7375968 |
Desk lamp
An improved desk lamp is disclosed. The improved desk lamp of the present invention comprises a heat dissipating housing, a heat dissipating module, a light unit and a control unit. The heat...
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7375966 |
Automatic transmission electronic control device
An ECU has an enclosure which is contained in the casing of an automatic transmission, which is formed of a material having low heat conductivity, and which provides liquid-tight containment of a...
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7371965 |
Modular cage with heat sink for use with pluggable module
A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a...
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7369411 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03°...
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7365984 |
Display module
A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the...
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7365422 |
Package of leadframe with heatsinks
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
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7362581 |
Heat sink fixing device
A heat sink fixing device has an enclosing frame socket having a central part for disposing a heat generating unit of an electronic device thereon, with a heat sink mounted on the enclosing frame...
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7362580 |
Electronic assembly having an indium wetting layer on a thermally conductive body
Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit...
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7362573 |
Heat dissipation device
A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for...
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7360586 |
Wrap around heat sink apparatus and method
A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that...
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7358605 |
Heat dissipation structure for electronic device
A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering...
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7355856 |
Method and apparatus for increasing natural convection efficiency in long heat sinks
An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a...
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7349217 |
IC socket assembly
The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The...
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7349214 |
Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module
A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive...
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7345882 |
Semiconductor module with heat sink and method thereof
A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct...
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7345879 |
Heat dissipation device
A heat dissipation device includes a primary heat sink ( 10 ) contacting a central processing unit and a secondary heat sink ( 20 ) attached on heat-generating electronic components adjacent the...
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7342796 |
Captive shoulder nut assembly
A captive shoulder nut assembly, to hold a heat sink onto a PC board, has a nut member with a threaded portion and a tubular portion extending therefrom. The nut member mates with an upstanding...
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7339790 |
Halogen lamps with mains-to-low voltage drivers
A halogen lamp includes a mains base and a converter operably connected to the mains base. The converter has a lamp socket, a toroid transformer, and a heat sink disposed within a center opening of...
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7339266 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
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7336492 |
Heat dissipating apparatus
A heat dissipating apparatus ( 10 ) for dissipating heat from a heat-generating electronic component includes a heat sink ( 14 ), a resilient clipping member ( 162 ), and an operating member ( 164...
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7336491 |
Heat sink
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
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7336477 |
Electrical switching apparatus and heat sink therefor
A heat sink is for an integrally fused low-voltage power air circuit breaker including a line terminal and electrical bus work coupled to a current limiter. The line terminal, electrical bus work,...
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7333339 |
Heat dissipation system for a miniaturized form factor communications card
A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high...
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7333336 |
Heat radiating apparatus
A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat...
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7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric...
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7327577 |
Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
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7327575 |
Locking device for heat sink
A locking device ( 10 ) for securing a heat sink ( 20 ) to a heat generating component ( 30 ) includes a pair of operating members ( 14 ) and a pair of locking members ( 16 ). Each operating member...
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7327574 |
Heatsink module for electronic device
A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing...
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7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
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