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7615862 Heat dissipating package structure and method for fabricating the same  
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
7613004 Heat sink with heat dissipating fins and method of manufacturing heat sink  
A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to...
7613003 Electrical connector  
A high voltage electrical connector includes a connector body. A first connector is supported within the connector body. A second connector is supported within the connector body and electrically...
7609523 Memory module assembly including heat sink attached to integrated circuits by adhesive and clips  
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either...
7609522 Heat sink assembly  
A heat sink assembly ( 10 ) compatible with an ATX motherboard ( 20 ) and a BTX motherboard ( 30 ), includes a heat sink and a plurality of fasteners ( 15 ) extending through the heat sink. The...
7609521 Heat dissipation device with a heat pipe  
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a...
7606042 High capacity thin module system and method  
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
7606037 Fastener and heat-dissipating device having the fastener  
A fastener for a heat-dissipating device is adapted to secure a heat sink on a securing seat. The fastener includes a fastening arm having a plate body and a coupling member adapted to couple with...
7606032 Structural screw secure device for a radiator assembly  
A structural screw device for a radiator assembly includes a frame and four screw members. The frame with four corners provides at least a leg post with an axial through hole respectively. The...
7592695 Compound heat sink  
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
7589970 Assembled structure of power semiconductor device and heat sink  
An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first...
7583504 Cooling assembly  
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the...
7583503 Thermal module allowing adjustment in the height of heat sink relative to fixing rack  
A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with a plurality of stoppers and a plurality of projected portions...
7582964 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7580264 Power supply and fixing structure of heatsink and circuit board applicable to the same  
A power supply of an image forming device with a heatsink fixed on a circuit board using an iron rivet is described. The rivet is fastened using a riveter. A crimped portion at a tip of the rivet,...
7579687 Circuit module turbulence enhancement systems and methods  
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
7573709 Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers  
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
7567438 Heat sink with precompressed bias member  
A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A...
7567435 Heat sink assembly  
A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side...
7564690 Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers  
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
7561433 Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system  
In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged,...
7558068 Apparatus and system, to secure a heat sink  
An apparatus and system are disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that...
7558067 Retaining tool for a heat sink  
A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two...
7554822 Power converter for led large area light source lamp  
Power converter for receiving an input current at an input voltage and for providing an output current at an output voltage. The power converter comprises a transformer ( 133 ) having a primary (...
7554807 Heat sink having protective device for thermal interface material spread thereon  
A protective device ( 10 ) comprises a cap ( 100 ) and a strap ( 120 ) connecting with the cap ( 100 ). The cap ( 100 ) defines a cavity ( 102 ) which is adapted for accommodating thermal interface...
7554227 Heat-dissipating device for motor base  
A motor includes a base having a fixing seat, an axial tube mounted to the fixing seat, a rotor mounted to the axial tube, and a circuit board mounted to the base and including a stator and at...
7553029 Structure of projector engine section  
A structure of a projector engine section includes: an engine section that projects through a projector lens an optical image formed by modulating a light flux depending on image information; a...
7551446 Thermal management device attachment  
A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include...
7551444 Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry  
A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell...
7548420 Electrical drive unit  
The present invention relates to an electrical drive unit comprising a circuit board, a plurality of components, attached to a first side of the circuit board, a heat sink, arranged on the first...
7542293 Thermal module  
A thermal module includes a heat spreader ( 50 ) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink ( 60 ), a heat pipe ( 70 ) thermally...
7539017 Heat dissipating device for central processor  
A heat dissipating device includes an electric member, a heat sink having a base to be secured on the electric member. The base includes an upper surface and includes four corner areas, and...
7538422 Integrated circuit micro-cooler having multi-layers of tubes of a CNT array  
Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In...
7532472 Heat dissipation device  
A heat dissipation device ( 100 ) comprises a heat sink ( 10 ) and a fan ( 40 ) mounted on the heat sink ( 10 ). The heat sink ( 10 ) comprises a central core ( 12 ), a plurality of branches ( 122...
7525803 Power converter having multiple layer heat sinks  
A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat...
7522425 High capacity thin module system and method  
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
7522422 Heat sink  
A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module ( 5 ) through the medium of cooling water includes a base member ( 1 ), a heat sink body ( 2 )...
7518874 Heat sink assembly  
A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of...
7515422 Electric power converter  
The present invention provides an electric power converter in which a tip portion of a cooling fin on an air flow inlet side is limited to flow a large quantity of air around a connection portion,...
7515421 Electronic device comprising secure heat dissipation  
A multi-component housing including a housing shell and a housing lid is disclosed. A support plate that is fitted with at least one power electronics component is disposed on a base plate of the...
7515419 Locking device for heat sink  
A locking device used for locking a heat sink to an electronic device, includes two clips each having a clamping portion. The clamping portion of each has a first pressing portion, a second...
7510762 Oriented graphite film, methods of manufacture thereof and articles comprising the same  
Disclosed herein is a composite film comprising a layer of an organic polymer, wherein the organic polymer is an elastomer; the organic polymer having an elastic modulus of less than or equal to...
7508674 Fixture for attaching a heat sink to a heat generating device  
A heat sink fixture for fixing a heat sink to a heat generating device is disclosed. The heat sink fixture at least has a suppressing section, two force-exertion sections and two fixing sections....
7505273 Cooling body and rectifier module for an electrical machine  
A heat sink, in particular for a rectifier unit of an electrical machine has at least one diode opening, and disposed around the at least one diode opening at least partially ring-shaped cooling...
7498673 Heatplates for heatsink attachment for semiconductor chips  
An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid...
7495920 Heat dissipation device  
A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a...
7495916 Low cost cold plate with film adhesive  
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The...
7495323 Semiconductor package structure having multiple heat dissipation paths and method of manufacture  
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the...
7486515 Fluid circulator for fluid cooled electronic device  
An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator...
7482688 Attaching heat sinks to integrated circuit packages  
This invention relates to arrangements for attaching a heat sink to an integrated circuit package. The heat sink comprises magnetic material, magnetized in one polarity, and the circuit package...