Matches 1 - 50 out of 726 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7414848 Heat dissipation device  
A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a...
7414841 Electronic cooling system having a ventilating duct  
A heat dissipation device in a computer enclosure includes a heat spreader ( 20 ) mounted on a CPU ( 12 ), a first heat sink ( 30 ), a cooling fan ( 40 ) coupled to the first heat sink, a second...
7411792 Thermal switch, methods of use and manufacturing methods for same  
The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated,...
7408781 Cooling device for memory chips  
A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of...
7408780 Compliant thermal interface structure utilizing spring elements with fins  
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements...
7408779 Heat-dissipating element with connecting structures  
A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure...
7408777 Plasma display device  
A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a...
7405934 Fan and cooling apparatus  
Holding arms of a frame member of a fan axially extend and project outward from both sides of a housing in a direction perpendicular to a rotational axis of the fan. Catch projections are provided...
7405448 Semiconductor device having a resistance for equalizing the current distribution  
A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the...
7403389 Heat dissipation device  
A heat dissipation device includes a heat sink ( 10 ) and a fan ( 30 ). The heat sink includes a plurality of fins ( 15 ), and a guiding portion ( 184 ) is formed in the fins. The fan is secured to...
7400239 Universal control apparatus and methods  
Apparatus and methods for control of one or more functions within a premises. In one embodiment, the control apparatus comprises a “universal” electronic switch which can be configured...
7400050 Quantum well thermoelectric power source  
A quantum well thermoelectric module providing very high conversion of heat energy in to electrical energy. In prefered embodiments the module provides electric power for monitoring, measuring or...
7397666 Wedge lock  
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
7394658 Heat sink with twist lock mounting mechanism  
A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external...
7391617 Cooling arrangement for a computer system  
A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the...
7388751 Method and apparatus for attaching a processor and corresponding heat sink to a circuit board  
An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the...
7385826 Method to secure a heat sink  
A method is disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially...
7385824 Processor module with rigidly coupled processor and voltage-regulator heat sinks  
A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact...
7385823 Retention module for a heat dissipation assembly  
A retention module for a heat dissipation assembly is disclosed. In a first embodiment, the retention module may include a frame having an external member and an internal member enclosed within the...
7385822 Clip assembly  
A clip assembly ( 30 ) for mounting a heat sink ( 20 ) on a printed circuit board ( 10 ) includes a closed annular positioning portion ( 32 ) interferingly engaging with the heat sink, a securing...
7381346 Thermal interface material  
A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve...
7375968 Desk lamp  
An improved desk lamp is disclosed. The improved desk lamp of the present invention comprises a heat dissipating housing, a heat dissipating module, a light unit and a control unit. The heat...
7375966 Automatic transmission electronic control device  
An ECU has an enclosure which is contained in the casing of an automatic transmission, which is formed of a material having low heat conductivity, and which provides liquid-tight containment of a...
7371965 Modular cage with heat sink for use with pluggable module  
A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a...
7369411 Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink  
A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03°...
7365984 Display module  
A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the...
7365422 Package of leadframe with heatsinks  
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
7362581 Heat sink fixing device  
A heat sink fixing device has an enclosing frame socket having a central part for disposing a heat generating unit of an electronic device thereon, with a heat sink mounted on the enclosing frame...
7362580 Electronic assembly having an indium wetting layer on a thermally conductive body  
Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit...
7362573 Heat dissipation device  
A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for...
7360586 Wrap around heat sink apparatus and method  
A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that...
7358605 Heat dissipation structure for electronic device  
A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering...
7355856 Method and apparatus for increasing natural convection efficiency in long heat sinks  
An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a...
7349217 IC socket assembly  
The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The...
7349214 Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module  
A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive...
7345882 Semiconductor module with heat sink and method thereof  
A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct...
7345879 Heat dissipation device  
A heat dissipation device includes a primary heat sink ( 10 ) contacting a central processing unit and a secondary heat sink ( 20 ) attached on heat-generating electronic components adjacent the...
7342796 Captive shoulder nut assembly  
A captive shoulder nut assembly, to hold a heat sink onto a PC board, has a nut member with a threaded portion and a tubular portion extending therefrom. The nut member mates with an upstanding...
7339790 Halogen lamps with mains-to-low voltage drivers  
A halogen lamp includes a mains base and a converter operably connected to the mains base. The converter has a lamp socket, a toroid transformer, and a heat sink disposed within a center opening of...
7339266 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof  
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
7336492 Heat dissipating apparatus  
A heat dissipating apparatus ( 10 ) for dissipating heat from a heat-generating electronic component includes a heat sink ( 14 ), a resilient clipping member ( 162 ), and an operating member ( 164...
7336491 Heat sink  
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
7336477 Electrical switching apparatus and heat sink therefor  
A heat sink is for an integrally fused low-voltage power air circuit breaker including a line terminal and electrical bus work coupled to a current limiter. The line terminal, electrical bus work,...
7333339 Heat dissipation system for a miniaturized form factor communications card  
A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high...
7333336 Heat radiating apparatus  
A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat...
7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same  
A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric...
7327577 Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers  
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
7327575 Locking device for heat sink  
A locking device ( 10 ) for securing a heat sink ( 20 ) to a heat generating component ( 30 ) includes a pair of operating members ( 14 ) and a pair of locking members ( 16 ). Each operating member...
7327574 Heatsink module for electronic device  
A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing...
7323255 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate  
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
Matches 1 - 50 out of 726 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >