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6552904 |
Power tool with heat sink assembly
A power tool such as a drill has an activation switch which energizes a motor which, in turn, drives an output. The switch includes a field effect transistor coupled to a heat sink to dissipate...
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6549403 |
Method and apparatus for managing thermal energy emissions of a removable point-of-deployment module in a cable-ready television set
If the circuitry for processing television and other data signals conventionally contained in a set-top terminal is incorporated directly into a television set, heat from a removable...
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6545871 |
Apparatus for providing heat dissipation for a circuit element
An arrangement for dissipating heat from a circuit element attached to a printed circuit board, comprising: a heatsink having a pair of arms, each one of the arms having tips including bumps, and a...
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6545879 |
Method and apparatus for mounting a lidless semiconductor device
A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted...
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6545874 |
Ultra compact computer arrangement
A cubical computer housing assembly comprises first and second ends and four sides, which define an interior compartment for housing the various computer components. The first and second ends are...
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6541854 |
Super low profile package with high efficiency of heat dissipation
A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the...
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6542369 |
Fixing frame for CPU cooling devices
This invention provides a combined base frame for supporting and fixing a CPU heat sink. The base frame has a left-side frame body and a right-side frame body. The buckling pieces are integrally...
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6542368 |
Heat sink and power source unit employing the same
A heat sink and a power source unit employing the same can minimize leakage of plosive outside of the power source unit upon failure of semiconductor parts and can restrict leakage of flashing,...
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6542371 |
High thermal conductivity heat transfer pad
A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.
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6538889 |
Heat dissipation device retention assembly
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment...
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6531770 |
Electronic part unit attached to a circuit board and including a cover member covering the electronic part
An electronic part unit comprises an electronic part body which has a semiconductor chip and a plurality of external connection electrodes electrically connected to the semiconductor chip and in...
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6525938 |
Circuit board fixing structure of heatsink fan
A circuit board fixing structure of a heatsink fan includes a housing having a pivot portion having a periphery provided with multiple poles. The housing is provided with a pair of positioning...
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6515861 |
Method and apparatus for shielding electromagnetic emissions from an integrated circuit
A conductive plane of an integrated circuit package and a heatsink combine to form a structure for controlling electromagnetic emissions from the integrated circuit die that is mounted in the...
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6515857 |
Visual heat sink for computers and method of use
Attractive heat sinks are used to cool the central processing unit and other solid state electronic components in electronic devices such as computers. In preferred embodiments, heat sinks snap...
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6507499 |
Microprocessor EMI shield
A microprocessor EMI shield is configured for isolating EMI emissions from the microprocessor, and grounding any electric potential caused by EMI emissions detected by the microprocessor heat sink....
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6503626 |
Graphite-based heat sink
The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for...
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6504719 |
Computer system that can be operated without a cooling fan
A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the...
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6501657 |
Torsional heat sink retention device
A heat sink retention apparatus includes a frame having a first end and a second end. A rotatable shaft is mounted on the frame. A heat sink retention arm is provided on the shaft and is rotatable...
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6501658 |
Heatsink mounting with shock absorbers
Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between...
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6496374 |
Apparatus suitable for mounting an integrated circuit
The present invention is directed to an apparatus suitable for mounting an integrated circuit (IC) including a frame suitable for receiving an integrated circuit (IC). The frame includes at least...
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6496372 |
Heat sink fastener for an electronic device
The present invention relates to an electronic assembly that includes an integrated circuit package, a heat sink, and a fastener which connects the heat sink to the integrated circuit package to...
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6495913 |
Semiconductor clamped-stack assembly
A semiconductor clamped-stack assembly ( 32 ) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components ( 8 ) and a plurality of heat sinks...
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6492739 |
Semiconductor device having bumper portions integral with a heat sink
A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four...
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6492724 |
Structure for reinforcing a semiconductor device to prevent cracking
A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a...
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6487073 |
Thermally conductive electronic device case
A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is...
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6483705 |
Electronic module including a cooling substrate and related methods
An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an...
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6483704 |
Microprocessor heat sink retention module
A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance...
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6479895 |
High performance air cooled heat sinks used in high density packaging applications
A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the...
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6478082 |
Heat dissipating apparatus with nest wind duct
A heat dissipating apparatus with nest wind duct is arranged corresponding to a horizontal flow of air. The heat dissipating apparatus is composed of nest wind duct with a plurality of through...
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6477051 |
Socket activation interlock
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, when the component has a heat dissipation device attached to a substrate. A first...
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6469898 |
Heat dissipating device
A heat dissipating device for cooling an electrical component is disclosed that includes a heat sink base. A plurality of helicoid pins is fixed to the heat sink base and extends therefrom. In one...
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6469896 |
Housing for an electrical device
A housing for an electrical device has a plurality of housing parts, including a first housing part adapted to carry an electronic component and having a mounting surface with a crease, and a...
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6466444 |
Heat sink
A heat sink including a first and a second group of heat dissipating members integrally formed and extending upwardly from a base portion. The first group of heat dissipation members includes a...
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6459584 |
Fixing frame for positioning heat dispensing device of computers
A fixing frame of heat dispensing device for computers includes two notches defined through two opposite walls of the fixing frame and a retaining device extend from one of the two opposite walls....
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6455930 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic...
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6456493 |
Heat sink clip
A heat sink clip ( 10 ) includes a body ( 14 ) and a fastener ( 17 ). The body includes a central pressing portion ( 142 ), and first and second spring portions ( 144, 154 ) extending from opposite...
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6452801 |
Heat sink clip with slidable locking bars
A clip ( 10 ) comprises a pressing body ( 12 ) adapted to press onto a heat sink ( 40 ). First and second arms ( 14, 15 ) extend outwardly and upwardly from opposite ends of the pressing body. A...
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6449155 |
Land grid array subassembly for multichip modules
A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly...
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6449160 |
Radiation fin assembly for heat sink or the like
A radiation fin assembly formed of a number of radiation fins connected in parallel, each radiation fin having a plurality of flat peripheral connecting strips, each flat connecting strip having a...
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6447322 |
Test socket for an electronic assembly which reduces damage to the electronic assembly
A test socket for an electronic assembly comprising a holder, a plurality of electric terminals, a heat sink, a compliant and thermally conductive thermal interface component, and a heat sink...
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6445592 |
Electronic assembly
Assemblies for electronic components, in particular for automotive electronics, must satisfy increasingly stringent demands in terms of quality and especially cost efficiency. These demands are met...
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6445584 |
Electronic control unit
To achieve an effective dissipation of the heat generated by the power components including a design that is as compact as possible as well as simple assembly in the case of an electronic control...
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6441520 |
Power module
A power module for a motor in which the module is arranged to house both the high power devices needed to drive the phase windings of the motor and the control electronics needed to control the...
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6431259 |
Spring clip for fixing semiconductor modules to a heat sink
In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually...
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6434007 |
Heat sink attachment clip
A heat sink assembly for securing a heat sink to a chip on a circuit board using a clip to secure the heat sink to the chip. The assembly includes a pair of support beams, a clip attached to the...
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6418022 |
Heat sink clip with operating bar
A clip ( 1 ) comprises a main body ( 10 ) and an operating bar ( 30 ). The main body has a pressing section ( 12 ) adapted to press onto a heat sink ( 40 ). First and second arms ( 14, 15 ) extend...
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6418020 |
Heat dissipation device with ribbed fin plates
A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of...
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6407924 |
Enhanced thermal path mechanical tolerance system
A method and structure for interfacing a thermally conductive pad between a heat generating module and a heatsink, such that the pad is in substantial thermal contact with both the module and the...
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6407922 |
Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix...
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6404635 |
Heat sink device fastening structure
The invention herein relates to a heat sink device fastening structure, comprises of a press-fastening member and a retaining member, wherein the press-fastening member with resilience, the...
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