|
Match
|
Document |
Document Title |
|
|
6734552 |
Enhanced thermal dissipation integrated circuit package
In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the...
|
|
|
6731504 |
Heat sink fastener
A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate...
|
|
|
6731501 |
Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing
In a heat dissipating device, a base plate, mounted in a drawer body of a disk drive module inside a computer housing, contacts and is in thermal communication with a disk drive. A fin strip unit...
|
|
|
6724629 |
Leaf spring load plate with retained linear cam slide
An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf...
|
|
|
6720581 |
Mounting plate for a laser chip in a semiconductor laser device
A method of manufacturing a semiconductor laser device includes the steps of: providing a laser chip, in which a semiconductor layer is formed on a substrate, a supporting plate which supports the...
|
|
|
6717806 |
Component alignment and retention mechanism
An alignment and retention mechanism comprises a hinged upper subassembly rotatably mated with a fixed lower subassembly defining a receptacle into which a component (e.g., a processor and heat...
|
|
|
6713151 |
Compliant fibrous thermal interface
Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers...
|
|
|
6713851 |
Lead over chip semiconductor device including a heat sink for heat dissipation
The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 ...
|
|
|
6706972 |
Electronic assembly comprising a sole plate forming a heat sink
The invention concerns an assembly supported on a base plate forming a radiator or capable of being directly mounted on the base plate, comprising a printed circuit card ( 1 ) having its thickness...
|
|
|
6700782 |
Apparatus and method to retain an electronic component in a precise position during assembly manufacturing
A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed...
|
|
|
6696755 |
Semiconductor device
A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting...
|
|
|
6696197 |
Battery pack and portable electronic appliance
Disclosed is a battery pack, comprising a secondary battery unit including at least one secondary battery, the at least one secondary battery comprising an electrode group and an insulating case...
|
|
|
6697263 |
Socket having frame for supporting thermal module
A socket ( 10 ) for connecting a CPU ( 30 ) to a PCB ( 50 ) includes a base ( 12 ) and a frame ( 20 ) surrounding the base. The base has a plurality of terminals ( 14 ) received therein. A...
|
|
|
6687126 |
Cooling plate arrangement for electronic components
An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an...
|
|
|
6683796 |
Apparatus for containing electromagnetic interference
An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top...
|
|
|
6677185 |
Method of affixing a heat sink to a substrate and package thereof
A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position...
|
|
|
6672380 |
Heat sink base pad
A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate...
|
|
|
6666261 |
Liquid circulation cooler
A liquid cooler ( 1 ) includes a body ( 10 ) and a cover ( 20 ) attached on the body. The body includes a base ( 12 ) with a first cavity ( 126 ) accommodating liquid, a central hollow cylinder (...
|
|
|
6665195 |
Converter appliance capacitor assembly
The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical...
|
|
|
6663964 |
Heat dissipating structure
A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat...
|
|
|
6661662 |
Vehicular modular design multiple application rectifier assembly
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned...
|
|
|
6657865 |
Heat dissipating structure
A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At...
|
|
|
6648664 |
Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector
A retention device ( 6 ) for securely retaining a heat sink module ( 5 ) and a package ( 4 ) upon a socket ( 3 ) includes a main frame ( 60 ), a spring clip ( 63 ) and an actuating lever ( 64 )....
|
|
|
6643137 |
Heat-dissipating device with grounding capability
A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a...
|
|
|
6639804 |
Adjustable device for heat sink retention module
An adjustable device includes a supporting plate ( 20 ) and a securing plate ( 10 ). The supporting plate includes a locking block ( 204 ) and three latches ( 208 ). The locking block defines three...
|
|
|
6639802 |
Heat sink with interlocked fins
A heat sink includes a base plate ( 30 ), and a plurality of fins ( 10 ) mounted on the base plate. Each fin includes a main body ( 12 ), and two upper locking members ( 14 ). Two retaining holes (...
|
|
|
6639803 |
Compliant heat sink device/mounting system interconnect and a method of implementing same
A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting...
|
|
|
6627981 |
Resin-packaged semiconductor device
A plurality of leads are arrayed around an island ( 1 ) to which a semiconductor chip ( 3 ) is bonded. A plurality of first wires ( 4 ) interconnects each electrode terminal of the semiconductor...
|
|
|
6624714 |
Radiator capable of considerably suppressing a high-frequency current flowing in an electric component
In a radiator ( 1 ) for use in radiating heat generated by an electronic component ( 5 ), a high-frequency current suppressor ( 2 ) is attached to that principal surface of the radiator which faces...
|
|
|
6614100 |
Lead frame for the installation of an integrated circuit in an injection-molded package
The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the...
|
|
|
6611425 |
Electronic apparatus
An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a...
|
|
|
6607028 |
Positioning structure for heat dissipating fins
A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion...
|
|
|
6606246 |
Method and apparatus for retaining cooling apparatus and bus bar
A method and apparatus for retaining a cooling apparatus in engagement with an integrated circuit including a frame with a bus bar carrying an electrical signal from one part of a circuitboard to...
|
|
|
6600650 |
Fastening device of CPU heat sink
A fastening device of the CPU heat sink comprising a heat sink with a base contacting the top of a CPU, a plurality numbers of heat dissipating plates on top of the base, a hollow space formed on...
|
|
|
6600651 |
Package with high heat dissipation
A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip,...
|
|
|
6597574 |
Radiator plate and process for manufacturing the same
A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and...
|
|
|
6590773 |
Heat dissipation device for enhanced power light emitting diodes
A heat dissipation device is mounted to a light emitting diode device for removing heat from the light emitting diode which includes a substrate having a top side on which a light-emitting unit is...
|
|
|
6587344 |
Mounting system for high-voltage semiconductor device
A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of...
|
|
|
6580611 |
Dual-sided heat removal system
The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.
|
|
|
6577504 |
Integrated heat sink for different size components with EMI suppression features
An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is...
|
|
|
6574107 |
Stacked intelligent power module package
A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is...
|
|
|
6570763 |
Heat sink securing means
A securing means is adapted to attach a heat sink ( 70 ) to a CPU on a circuit board ( 80 ). The securing means comprises a retention module ( 10 ) and a cover clip ( 30 ). The retention module has...
|
|
|
6563712 |
Heak sink chip package
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring...
|
|
|
6563213 |
Integrated circuit heat sink support and retention mechanism
The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have...
|
|
|
6552267 |
Microelectronic assembly with stiffening member
A flip chip-ball grid array package and a stiffening ring having first and second faces, and grooves formed in at least a one of the first and second faces of the stiffening ring. Providing grooves...
|
|
|
6552908 |
Vehicular modular design multiple application rectifier assembly having outer lead integument
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically...
|
|
|
6552903 |
Electronic module
In an electronic module having an electronic component which is arranged within an electromagnetic shielding, a thermally conductive element which is connected in a thermally conductive fashion to...
|
|
|
6552904 |
Power tool with heat sink assembly
A power tool such as a drill has an activation switch which energizes a motor which, in turn, drives an output. The switch includes a field effect transistor coupled to a heat sink to dissipate...
|
|
|
6549403 |
Method and apparatus for managing thermal energy emissions of a removable point-of-deployment module in a cable-ready television set
If the circuitry for processing television and other data signals conventionally contained in a set-top terminal is incorporated directly into a television set, heat from a removable...
|
|
|
6545871 |
Apparatus for providing heat dissipation for a circuit element
An arrangement for dissipating heat from a circuit element attached to a printed circuit board, comprising: a heatsink having a pair of arms, each one of the arms having tips including bumps, and a...
|