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6873043 |
Electronic assembly having electrically-isolated heat-conductive structure
An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an...
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6870737 |
Cooling system for power conversion device
According to the present invention, a power conversion device comprises a plurality of sets of power conversion circuits that convert AC to DC or DC to AC by the switching action of a plurality of...
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6867985 |
Computer system with noiseless cooling
A computer system uses a large heat sink to provide noiseless cooling, thereby avoiding the need for a conventional cooling fan that can be very noisy. The heat sink forms a part of a chassis that...
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6864567 |
Base of LED
A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an...
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6865084 |
Thermally enhanced semiconductor package with EMI shielding
A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate,...
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6865083 |
Clip for heat sink
A clip ( 30 ) for securing a heat sink ( 40 ) to an electronic device ( 52 ) includes a pin ( 32 ) and a pressing member ( 34 ), each of which are integrally formed by stamping sheet metal. The pin...
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6862183 |
Composite fins for heat sinks
A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to...
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6849941 |
Heat sink and heat spreader assembly
A heat sink and heat spreader assembly including a solid member of a conductive material and a layer of a low melting alloy having phase change properties bonded to at least one surface of the...
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6841250 |
Thermal management system
The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for...
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6840307 |
High performance heat exchange assembly
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated...
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6835453 |
Clean release, phase change thermal interface
A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway...
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6829143 |
Heatsink retention apparatus
Some disclosed embodiments include a retention apparatus having a unidirectional locking member, the unidirectional locking member defining a bore therethrough, a post disposed through the bore of...
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6829145 |
Separable hybrid cold plate and heat sink device and method
An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force...
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6826052 |
Retaining assembly for heat sink
A heat sink retaining assembly includes a retaining module ( 1 ) and a pair of clips ( 3 ). Two retaining portions ( 12 ) are respectively formed on each of two opposite sidewalls ( 17′ ) of the...
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6826050 |
Heat sink and electronic device with heat sink
A heat sink includes a heat receiving part for receiving heat from the outside, a first radiating part, connected to said heat receiving part, which forms a first air channel, and radiates the heat...
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6822866 |
Microdrive
An AC drive which can be applied to any power using device and in particular is a medium voltage AC drive. In a preferred embodiment, a multilevel AC drive topology is implemented, with the drive...
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6821625 |
Thermal spreader using thermal conduits
A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between...
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6819566 |
Grounding and thermal dissipation for integrated circuit packages
In a microelectronic chip package for which grounding and thermal dissipation is desired, a cover is provided having an opening which is aligned with a contact on the substrate connected to ground...
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6819572 |
Electromagnetic noise suppression device
Briefly, in accordance with one embodiment of the invention, an electromagnetic interference (EMI) reduction device may include a circuit and at least one heatsink. The circuit may include analog...
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6815813 |
Self-contained heat sink and a method for fabricating same
A system and method are provided for thermal dissipation from a heat producing electronic device. The system includes a substrate for fabricating integrated circuits, the substrate having a first...
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6813155 |
Heat sink clip with interchangeable operating body
A heat sink clip includes a main body ( 20 ), and an operating body ( 40 ) rotatably attached to the main body. The main body includes a central portion ( 21 ), and two clipping portions ( 23 )...
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6809261 |
Physically compact device package
A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting...
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6807059 |
Stud welded pin fin heat sink
A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally...
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6807058 |
Heat sink and combinations
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining...
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6804118 |
Thermal dissipation assembly for electronic components
An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least...
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6798663 |
Heat sink hold-down with fan-module attach location
A system for heat sink hold-down is provided. The system comprises a heat source; and a heat sink hold-down assembly. The assembly comprises a bolster plate to rigidly support the heat source and a...
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6794026 |
Radiating sheet and PDP panel
To realize uniform heat distribution by adhering a radiating sheet tightly to a radiating element such as a PDP glass panel, and a heat sink such as an aluminum chassis, transfer heat smoothly to...
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6791839 |
Thermal interface materials and methods for their preparation and use
A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a...
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6788538 |
Retention of heat sinks on electronic packages
A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins...
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6785140 |
Multiple heat pipe heat sink
A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion...
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6783692 |
Heat softening thermally conductive compositions and methods for their preparation
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in...
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6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
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6776221 |
Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which...
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6771508 |
Method and apparatus for cooling an electronic component
In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic...
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6771502 |
Heat sink made from longer and shorter graphite sheets
A heat sink apparatus is constructed from alternating longer and shorter sheets of graphite material sandwiched together such that the longer sheets extend beyond the shorter sheets to define fins....
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6771506 |
Heat sink fastener
A heat sink fastener ( 10 ) includes a pressing beam ( 20 ), a clamping beam ( 30 ), and an operating lever ( 40 ). The pressing beam includes a first pivot portion ( 26 ) at one end thereof, and a...
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6765794 |
Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink
It is an exemplified object of the present invention to provide a heat sink, method of manufacturing the same, and electronic apparatus having the heat sink in which a fine and inexpensive...
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6763881 |
Thermally matched gradient heat sink
An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a...
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6765797 |
Heat transfer apparatus
The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer...
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6765799 |
Heat dissipating fins interlocking mechanism
The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded...
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6764773 |
Heat-dissipating substrate, method for making the same, and semiconductor device including the same
A heat-dissipating substrate is made of a composite material comprising a first composition primarily composed of aluminum and a second composition primarily composed of silicon carbide and/or...
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6765291 |
IC package with dual heat spreaders
A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant...
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6761211 |
High-performance heat sink for electronics cooling
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on...
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6757965 |
Method of installing a land grid array multi-chip modules
A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly...
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6754078 |
Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate
A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an...
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6754079 |
KD heat sink fins
A knock down heat sink, and more particularly, to one that comprised of multiple fins overlapped among one another into a stack and a specific spacing is defined between any two abutted fins to...
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6748350 |
Method to compensate for stress between heat spreader and thermal interface material
A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This...
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6746768 |
Thermal interface material
A thermal interface and a thermal interface as part of a thermal management system that comprises a heat source, and a cooling module. The heat source has an external surface; the thermal interface...
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6735082 |
Heatsink with improved heat dissipation capability
A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more...
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6735084 |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly...
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