Matches 601 - 650 out of 750 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
5404273 Semiconductor-device package and semiconductor device  
A semiconductor-device package includes: a printed circuit board which has a chip-accommodating hole in its center portion and which has external connection terminals formed on its one side and a...
5400218 Device for the 3D encapsulation of semiconductor chips  
Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction....
5399906 High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator  
A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced...
5394298 Semiconductor devices  
A semiconductor device comprises a semiconductor chip carrier and a semiconductor chip packaged therein with a resin. The semiconductor chip carrier comprises a printed wiring substrate with...
5382175 Thermal core wedge clamp  
A clamp for seating a circuit card assembly (CCA) in a chassis, and for thereafter establishing thermal contact between the CCA and the chassis, includes a shaft and two wedges that extend...
5379188 Arrangement for mounting an integrated circuit chip carrier on a printed circuit board  
There is provided a mounting arrangement for an integrated circuit chip carrier 7. The carrier 7 is retained in a holder 5 using the lateral forces created by the interference between leads 12 of...
5379185 Leadless surface mountable assembly  
A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is...
5377745 Cooling device for central processing unit  
A cooling device includes a fin unit with an upper side to which a fan unit is mounted and an underside to which a central processing unit is mounted. The fin unit includes a base plate and a...
5373099 Fixing device for fixing electronic component against a wall of a heatsink  
A fixing device for fixing an electronic component (10) against a first wall (11) of a heatsink (12) includes at least one end branch engaged in a recess (81) provided in a second wall (82) of the...
5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die  
A substrate, a heat slug with an access cavity, a lid, and a heat sink having a stem are used to package a high applied power VLSI die. The substrate comprises a stepped housing cavity at its...
5359493 Three dimensional multi-chip module with integral heat sink  
The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over...
5337214 Bypass contactor for solid state motor starters  
A bypass contactor usable in a solid state motor starter for shunting current around a fully-conducting solid state switching device comprising an electromagnetic contactor housed in a molded...
5329420 Slotted tuning fork thermal interface  
A chassis is provided having a heat conductive side wall together with a flat heat conductive tab member extending therefrom, together with a planar heat sink for supporting a heat generating...
5323532 Method for providing novel hybrid circuit assembly carrier bracket  
An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a...
5323295 Assembly for integrating heat generating electronic device with nonheat generating devices  
An electronic power device for a juke box or the like comprises a highly thermally conductive heat sink defining a first cavity on one side thereof and a second cavity on the other side thereof,...
5313701 Assembly and testing of electronic power components insulation  
In accordance with a method for assembly and testing the insulation of power components for electronic switching and control devices, particularly for motor vehicles, the power components are...
5313362 Packaging structure of small-sized computer  
In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of...
5311395 Surface mount heat sink  
A heat sink for electronic devices which are surface mounted on a printed circuit board includes two side members, a connecting bridge, a foot on each side member which is soldered to a mounting...
5309979 Self clamping heat sink assembly  
A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an...
5295044 Semiconductor device  
A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective...
5280410 Electrical switching and control device, in particular for motor vehicles  
An electrical switching and control device, particularly for motor vehicles has a housing a printed circuit board, a plurality of electronic power components arranged in the housing and having...
5276585 Heat sink mounting apparatus  
A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of...
5276584 Electronic unit  
Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from...
5237494 Frequency inverting apparatus  
An apparatus for driving a plurality of motors at different variable speeds. The apparatus includes a rectifier for supplying direct current power to a dc bus circuit. A plurality of inverters are...
5227646 Optical semiconductor device with laminated ceramic substrate  
In an optical semiconductor device having a light emitting element mounted on a heat sink, a first casing for supporting and covering the light emitting element and the heat sink, and a second...
5220485 Heat removing edge guide system and related method  
A heat removing edge guide system removes heat from a circuit board. The system includes a heat sink plate, a stationary guide fixed to the mounting surface of the heat sink plate, and a moving...
5216279 Power semiconductor device suitable for automation of production  
The feature of the construction of this invention lies in a direct bond copper (DBC) pate. That is, a first Cu plate on which a semiconductor pellet is formed is fixed on the ceramic plate to...
5208733 Enclosure and printed circuit card with heat sink  
An electronic device including a card having first and second faces opposite each other, electrical devices including at least one of a printed circuit and a plurality of components fixed to the...
5208731 Heat dissipating assembly  
This invention provides an improved system for removably coupling a conductive heat sink to a chip housing. The heat sink is of the type having a plurality of pins arrayed in a grid pattern and...
5206792 Attachment for contacting a heat sink with an integrated circuit chip and use thereof  
An attachment for removably thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which in turn is located on an integrated circuit card or board containing a...
5179501 Laminated electronic module assembly  
An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner...
5170323 Electrical component clamping and thermal transfer device  
A metallic clamp for an electrical component which rigidly supports the component and its connecting leads in a control panel so that they vibrate in unison in response to oscillations of the panel...
5168425 Mounting arrangements for high voltage/high power semiconductors  
A mounting arrangement for a pair of relatively high voltage, press-pack semiconductors positioned in spaced apart relationship on a support surface of a heat sink comprises an enclosure formed of...
5159532 Electronic control unit with multiple hybrid circuit assemblies integrated on a single common ceramic carrier  
The object of the patent application is an electronic control unit with triggering and power components, in particular an ignition control unit, whose electronic circuit comprises various...
5153449 Heatsink bus for electronic switch  
An electronic circuit device includes a metallic member composed of a thermally and electrically conductive material and comprising a unitary mass defining a heatsink and being free of mechanical...
5138523 Digitizer tablet having cooling apparatus with base and integrated heat sink  
A digitizer tablet has a base integrated with a heat sink. The base includes a flat portion which surrounds the heat sink. The sink is recessed relative to the flat portion and includes a flat...
5130498 Ceramic substrate used for fabricating electric or electronic circuit  
A ceramic substrate is used for an electric or electronic circuit comprises a ceramic plate formed of a substance mainly composed of aluminum nitride, and conductive islands formed of aluminum or...
5118903 Tightly-closing housing for an electronic circuit, particularly for a control device of an internal combustion engine  
The housing for an electronic circuit provided with a connection plug, particularly for control electronics of an internal combustion engine of a vehicle, includes a frame, to which a printed...
5111359 Heat transfer device and method  
A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat...
5099550 Clamp for attachment of a heat sink  
A resilient clamp for attaching the heat sink to a semiconductor package comprising a first end having a rounded knob and a second end for connecting with a semiconductor package, the clamp having...
5097387 Circuit chip package employing low melting point solder for heat transfer  
A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each...
5079618 Semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies  
A single series electrical circuit for cooling an electronic device while simultaneously providing series electrical current through the device to provide operational power. In this manner,...
5065281 Molded integrated circuit package incorporating heat sink  
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink...
5065280 Flex interconnect module  
An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible...
5053923 Electronic control unit with common ground connection to a heat sink  
The invention relates to an electronic control unit, in particular an ignition control unit, containing an electronic circuit in the form of a hybrid circuit arranged on a heat sink, and having a...
5050038 Heat sink device or surface mount type component mounted on a printed circuit board  
A device for dissipating heat for a surface mount component assembled onto a printed circuit board is made up by a metallic plate deposited on the rear of the substrate under the surface mount...
5045970 Joined substrates having planar electrical interconnection of hybrid circuits  
The disclosure relates to a hybrid circuit wherein two substrates, preferably, though not necessarily, of diverse materials, are aligned on and secured to a glass plate by layers of polymer which...
5040096 High force clip  
A clip for attaching a semiconductor to a heat sink comprises an arcuate section having a lip which contacts a projection on a heat sink so that the remainder of the arcuate section is disposed...
5019942 Insulating apparatus for electronic device assemblies  
Disclosed are insulating covers for electronic device packages secured to heat sinks by clips. The covers provide minimum predetermined creepage distance between the electronic device packages and...
5019941 Electronic assembly having enhanced heat dissipating capabilities  
Heat removal is accomplished by utilizing a first metal conductive pad to conduct the heat from an electrical component. The first pad is juxtaposed and thereby thermally coupled by convection to...
Matches 601 - 650 out of 750 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >