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6049973 |
Method of assembling an integrated computer module
The invention is a method of assembling an integrated computer by successively placing various components into an open-top weldment or "tub." The assembly method is particularly suited to rapidly...
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6049457 |
Device for fastening a heat dissipator to a central process unit
A device which can effectively fasten a heat dissipator to a CPU by a simple operation is disclosed. The device includes a pair of fasteners respectively received in a corresponding channel defined...
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6049460 |
Trigger actuated control having supplemental heat sink
A heat sink is slideably attached to a housing of an electronic control, retained by complemental snap-in elements and has a projection extending through a wall of the housing into abutting thermal...
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6046907 |
Heat conductor
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel...
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6046906 |
Vent chimney heat sink design for an electrical assembly
An electronic assembly which includes a heat sink. The assembly includes first and second integrated circuit packages that are mounted to a substrate. The heat sink may be in direct thermal contact...
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6045927 |
Composite material for electronic part and method of producing same
There is disclosed a composite material for an electronic part which has high thermal conductivity in a laminated direction, and also has low-thermal expansion characteristics. The composite...
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6040984 |
Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding...
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6035524 |
Method for fabricating an electronics board with thermal-conduction cooling
Method for fabricating thermally cooled electronic cards. A card of any kind is covered with a rigid heat sink shaped to fit the card and is attached thereto. The heat sink is formed in such a way...
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6034874 |
Electronic device with heat radiating member
The electronic device of the present invention includes a printed wiring board having wiring patterns, a heat generating component connected to the wiring patterns, a heat radiating member formed...
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6031727 |
Printed circuit board with integrated heat sink
According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred...
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6026888 |
Molded heat exchanger structure for portable computer
In a portable notebook computer a specially designed heat pipe-based heat exchanger assembly is used to efficiently dissipate heat from a processor board in the computer's base housing to ambient...
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6025991 |
Electronic apparatus having heat dissipating arrangement
An electronic apparatus is provided to efficiently dissipate the heat generated by a heat generating electronic component. The electronic apparatus comprises a framework formed of a metal sheet to...
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6008991 |
Electronic system including packaged integrated circuits with heat spreading standoff support members
An electronic system such as a Board-Level-Product (BLP) includes at least one integrated circuit device which is mounted on a circuit board. Each integrated circuit device includes a thin...
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6005771 |
Electronics cooling technique for spacecraft modules
A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the...
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6000125 |
Method of heat dissipation from two surfaces of a microprocessor
A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly...
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5992511 |
Cooling apparatus for electronic element
A heating element cooling apparatus which is capable of improving the cooling efficiency without greatly increasing the overall weight thereof. A heat sink 2 for the heating element cooling...
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5995369 |
Cooling plate connecting clip for power semiconductors
According to the invention, a common connecting clip (5) is used in the cse of connecting two or more power semiconductors (4) on a board (3) to a cooling plate (1).
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5995370 |
Heat-sinking arrangement for circuit elements
An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity...
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5991154 |
Attachment of electronic device packages to heat sinks
A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit...
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5991151 |
Heat sink, in particular for electronic components
A heat sink (2) for electronic components (1) comprises: a base portion (3) fitted with device (4) for coupling with a fixed support plane (5) of an apparatus; a plane surface (6), positioned in...
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5987740 |
Laser machining of molded assemblies
A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to...
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5986885 |
Semiconductor package with internal heatsink and assembly method
A semiconductor package includes a semiconductor die, a lead frame and die attach paddle, and a thermally conductive metal foam porous sponge attached to the die attach paddle to conduct heat...
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5986887 |
Stacked circuit board assembly adapted for heat dissipation
An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to...
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5982621 |
Electronic device cooling arrangement
An electronic device cooling arrangement includes a heat sink bonded to a substrate above a chip on the substrate, the heat sink having a mounting section bonded to the substrate, a face panel...
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5978225 |
Apparatus and method for dissipating heat from a core module assembly of a retail terminal
A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the...
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5975201 |
Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
Polymer matrix composites have a through-thickness-thermal conductivity whose value is realized in applications such as composite spaceborne electronics enclosures where heat dissipation is...
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5966289 |
Electronic device securement system
A system for securing an electronic component, such as a CPU, includes a support extending substantially in a plane and a fastener coupled to the support. The support may be a heat sink secured to...
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5956226 |
Electrochemical capacitor used for thermal management
An electronic device (220) includes a component (105), such as a microprocessor, that generates heat and an electrochemical capacitor (200) used for thermal management. The electrochemical...
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5953212 |
Device for fastening heat sink to CPU
A heat sink mounting device for closely attaching a heat sink to a CPU which has been mounted to an electrical connector, consists of two mounting ears formed on the electrical connector. A clip...
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5949649 |
High power semiconductor device having bolt-down ceramic platform
A power semiconductor device package in which a semiconductor chip is mounted on a ceramic platform and sealed thereon by a lid. The platform has opposing end portions which receive fasteners for...
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5940269 |
Heat sink assembly for an electronic device
A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided...
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5940264 |
Electrolytic capacitor with heat sink and method of heat dissipation
The invention provides a method of constructing an electrolytic capacitor with a heat sink, which includes attaching a surface area of the heat sink in intimate contact with a surface area of the...
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5940271 |
Stiffener with integrated heat sink attachment
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate;...
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5933325 |
Detachable fastening device for use with heat sink
A retaining clamp device (10) for use with a heat sink (40) of the CPU (50) unit includes a clip (12) and an associated spring (30) attached to the clip (12) wherein the clip (12) includes an...
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5933326 |
Clipping device for heat sink
A clipping device for attaching a heat sink to an electrical device comprises an elongate biasing strip and a pivotal grasp pivotally connected to an end of the biasing strip. Interconnecting...
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5930114 |
Heat sink mounting assembly for surface mount electronic device packages
A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package,...
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5930115 |
Apparatus, method and system for thermal management of a semiconductor device
A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management...
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5912800 |
Electronic packages and method to enhance the passive thermal management of electronic packages
A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a...
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5898571 |
Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
An encapsulated semiconductor package assembly including a substrate, a die operatively disposed on the substrate, a lid for support by the substrate over the die, a heat sink operatively on the...
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5896270 |
Heat sink spring clip
A spring clip includes a continuous spring band forming an angular integral first spring finger for pressing an electronic device package against a flat surface of an apertured substrate. A first...
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5892676 |
Rectifier bridges assembly having improved heat dispersing characteristics and an arcing-free design
A rectifier bridges assembly for use with an automotive alternator includes a base plate conductively mounted to a ground and providing a negative heat sink, and an overlying finned positive heat...
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5886871 |
Heat sink retention apparatus and method for computer systems
A computer system includes a chassis and a rigid support member mounted therein. A heat sink is connected to the support member by a resilient retainer which is movably mounted on the heat sink....
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5870287 |
Spring clip for mounting a heat sink to an electronic component
A heat sink spring clip having a linearly displaceable deflection member that operatively engages a biasing member for thermally and mechanically connecting a heat sink to an electronic component....
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5870286 |
Heat sink assembly for cooling electronic modules
An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which...
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5865639 |
Burn-in test socket apparatus
Socket apparatus (10) particularly adapted for use of burn-in tests of IC components having a large number of contact points on the bottom surface thereof has a cover frame (16) and adapter plate...
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5862038 |
Cooling device for mounting module
A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling...
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5854741 |
Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the...
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5838064 |
Supporting member for cooling means and electronic package using the same
An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A...
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5838543 |
Radio frequency power amplification module
A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the...
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5834839 |
Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
A semiconductor package for preserving clearance between encapsulant and a printed circuit board is provided including a package substrate having an upper surface and a lower surface, wherein the...
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