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6239974 |
Electrical assembly that includes a heat sink which is attached to a substrate by a clip
An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped...
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6236573 |
Apparatus and method for single-handed manipulation of latching pluggable electronic component
A computer processor cartridge is connected to a socket on a motherboard. The cartridge has a detachable bracket that secures it to a retention mechanism mounted to the board. The bracket is formed...
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6230789 |
Heat dissipating device and method making the same
The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs...
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6233149 |
High power inverter air cooling
An electrically powered vehicle includes an inverter mounted in the vehicle, the inverter having a plurality of high power IGBT modules for converting DC power to AC power for application to a...
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6219266 |
Self-commutated power converter of a voltage-impressing converter with N high-power modules
A self-commutated power converter of a voltage-impressing converter having n high-power modules is described. These high-power modules are joined phasewise to a phase heat sink, respectively, in a...
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6218730 |
Apparatus for controlling thermal interface gap distance
Tolerances in chip, substrate and hardware dimensions are accommodated by means of a floating sealing structure to insure that compliant thermally conductive paste disposed between the chip and its...
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6208518 |
Fastening device for a heat sink
A fastening device for a heat sink comprises a retaining element and an operating element. The retaining element is formed by stamping an elongated metal sheet and includes a spring portion which...
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6196299 |
Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners
A mechanical assembly for regulating the temperature of a chip is comprised of a heat exchanger which has a face for mating with a planar surface on the chip. A frame is coupled to the heat...
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6198630 |
Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
A method and apparatus for assembling a high speed, high density VLSI module in a computer system that enables attachment, support, electromagnetic interference containment, and thermal management...
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6195256 |
Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for...
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6191944 |
Heat sink for electric and/or electronic devices
A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a...
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6184579 |
Double-sided electronic device
A double-sided electronic device includes a heat conductive substrate having working zones of structures and components disposed thereon in double planar arrangement, as a monolithic or hybrid...
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6184578 |
Graphite composite heat pipe
A heat pipe comprising a wick, working fluid, a chamber housing the wick and working fluid, and a plurality of wraps of a graphite composite fiber, preferably THORNEL graphite fiber, number P-120...
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6181560 |
Semiconductor package substrate and semiconductor package
A component for forming a chip package includes a flat insulative plate. A heat sink is embedded in a central portion of the plate, and a plurality of electrically conductive leads are embedded in...
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6175150 |
Plastic-encapsulated semiconductor device and fabrication method thereof
A plastic-encapsulated semiconductor device is provided, which is capable of efficient heat dissipation without upsizing while preventing the moisture from reaching an IC chip. This device is...
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6169659 |
Metered force single point heatsink attach mechanism
The present invention is drawn to a system and a method for attaching and tightening a mechanism onto an IC package such that a load-balanced thermal contact is formed securely between the...
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6169657 |
Radiating device for electronic appliances
A radiating device for an electronic appliance is provided with a plurality of embossed portions at surfaces thereof and vents in the embossed portions, portions thereof which are not embossed or...
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6166937 |
Inverter device with cooling arrangement therefor
IGBT modules, bus bars and capacitors in an inverter main circuit are secured on the front face of a heat sink and at the back side of the heat sink a water cooling channel is formed to cool the...
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6151215 |
Single mount and cooling for two two-sided printed circuit boards
A mounting plate for two printed circuit boards. The mounting plate formed of a layer of thermally conductive material with securing mechanisms fixing one of the two printed circuit boards in a...
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6151217 |
Apparatus and method for enabling hot plugging of an integrated circuit
An apparatus for handling an electrical component, such as a CPU module, having a heatsink mounted to an upper surface and a plurality of contact pins is disclosed. The apparatus has a base plate...
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6144092 |
Electronic power device heatsink clamping system
In a preferred embodiment, an electronic power device heatsink clamping system, including: a heatsink; at least one electronic power device disposed adjacent a side of the heatsink; at least one...
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6139975 |
Sheet metal member, method of manufacturing same, and heat radiation plate
In a method of manufacturing a sheet member comprising: obtaining a sintered compact by sintering a sheet-like compact having a reduced-thickness portion and an enlarged-thickness portion; and then...
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6130821 |
Multi-chip assembly having a heat sink and method thereof
A multi-chip assembly (100) uses a clip (110) to retain multiple integrated circuits (124-130) to an assembly substrate (140). The use of a thermal medium between the integrated circuits and the...
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6129993 |
Heat spreader and method of making the same
Provided are a heat spreader that can reduce an increase in the thermal expansion coefficient up to high temperatures of not lower than 500° C. and has an excellent thermal expansion property and...
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6125921 |
Radiator
A radiator at least comprises a seat and a heat dissipating body. The seat have a receiving space; and the heat dissipating body is formed by a plurality of top portions, middle portions and...
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6125037 |
Self-locking heat sink assembly and method
A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A...
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6125038 |
Heat sink for auxiliary circuit board
The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends...
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6122171 |
Heat sink chip package and method of making
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring...
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6118660 |
Circuit module with improved heat transfer
An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into...
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6114048 |
Functionally graded metal substrates and process for making same
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In...
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6111751 |
Connector and connecting structure using connector
A connector is provided which can simplify the path for heat radiation between electronic devices, ease restrictions in the structures of the electronic devices and in the arrangement of parts on...
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6108205 |
Means and method for mounting electronics
The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly...
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6104613 |
VME eurocard double printed wiring card host circuit card circuit (module) assembly
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or...
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6104614 |
Fastening device for tight attachment between two plates
A fastening device (10) includes a locking pin (12) and an associated pressing clip (14). The locking pin (12) includes a flat head (16) with ring-like shallow (18) therein for easy operational...
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6101093 |
Wrap around clip for an electronic cartridge
An electronic assembly which includes a heat sink that is attached to a substrate by a clip. The assembly includes an integrated circuit package that is mounted to the substrate. The clip has an...
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6094350 |
Feedforward amplifier manufacturing module
A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem,...
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6091604 |
Power module for a frequency converter
Power module for a current converter, particularly a frequency converter, having at least one printed circuit board equipped at least with power components and having a heat-conducting connection...
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6091603 |
Customizable lid for improved thermal performance of modules using flip chips
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the...
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6088226 |
Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink
The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body...
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6088228 |
Protective enclosure for a multi-chip module
A heat dissipating element, positioned inside a protective cover, removes heat from the vicinity of a multi-chip module comprising active semiconductor devices attached to a printed circuit board....
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6084775 |
Heatsink and package structures with fusible release layer
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC...
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6078499 |
Spring loaded heat pipe connector for hinged apparatus package
An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on...
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6075701 |
Electronic structure having an embedded pyrolytic graphite heat sink material
An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite...
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6069794 |
Bushing for combining fan and heat sink
A bushing for combining a fan and heat sink avoids a rack usually required in a conventional combination of fan and heat sink for CPU cooling, and thereby minimizes assembly height and forms a...
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6067231 |
Heat-dissipating structure for an electrical device
A heat-dissipating structure for an electrical device comprises a PC board with a dissipating opening, and an electrical device. The PC board has an upper surface thereof and a lower surface...
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6064575 |
Circuit module assembly
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or...
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6061243 |
Modular and multifunctional structure
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6061240 |
Push pin assembly for heat sink for cooling electronic modules
An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which...
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6055159 |
Heat dissipating module for a heat generating electronic component
A heat dissipating module is adapted for use with an electronic component on one side of a circuit board, and includes a heat sink having a contacting portion to be brought into contact with the...
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6055158 |
Electronic component heat sink assembly
An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a...
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