Matches 451 - 500 out of 750 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6151215 Single mount and cooling for two two-sided printed circuit boards  
A mounting plate for two printed circuit boards. The mounting plate formed of a layer of thermally conductive material with securing mechanisms fixing one of the two printed circuit boards in a...
6144092 Electronic power device heatsink clamping system  
In a preferred embodiment, an electronic power device heatsink clamping system, including: a heatsink; at least one electronic power device disposed adjacent a side of the heatsink; at least one...
6143977 Heat-generating element cooling device  
A cooling device for a heat generating element which includes a heat sink disposed on a top surface of the element mounted on a printed circuit board, a cooling air throttling mechanism supported...
6140571 Heat-generating element cooling device  
A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a...
6139975 Sheet metal member, method of manufacturing same, and heat radiation plate  
In a method of manufacturing a sheet member comprising: obtaining a sintered compact by sintering a sheet-like compact having a reduced-thickness portion and an enlarged-thickness portion; and then...
6130821 Multi-chip assembly having a heat sink and method thereof  
A multi-chip assembly (100) uses a clip (110) to retain multiple integrated circuits (124-130) to an assembly substrate (140). The use of a thermal medium between the integrated circuits and the...
6129993 Heat spreader and method of making the same  
Provided are a heat spreader that can reduce an increase in the thermal expansion coefficient up to high temperatures of not lower than 500° C. and has an excellent thermal expansion property and...
6125921 Radiator  
A radiator at least comprises a seat and a heat dissipating body. The seat have a receiving space; and the heat dissipating body is formed by a plurality of top portions, middle portions and...
6125038 Heat sink for auxiliary circuit board  
The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends...
6125037 Self-locking heat sink assembly and method  
A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A...
6122171 Heat sink chip package and method of making  
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring...
6118660 Circuit module with improved heat transfer  
An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into...
6114048 Functionally graded metal substrates and process for making same  
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In...
6111751 Connector and connecting structure using connector  
A connector is provided which can simplify the path for heat radiation between electronic devices, ease restrictions in the structures of the electronic devices and in the arrangement of parts on...
6108205 Means and method for mounting electronics  
The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly...
6104614 Fastening device for tight attachment between two plates  
A fastening device (10) includes a locking pin (12) and an associated pressing clip (14). The locking pin (12) includes a flat head (16) with ring-like shallow (18) therein for easy operational...
6104613 VME eurocard double printed wiring card host circuit card circuit (module) assembly  
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or...
6101093 Wrap around clip for an electronic cartridge  
An electronic assembly which includes a heat sink that is attached to a substrate by a clip. The assembly includes an integrated circuit package that is mounted to the substrate. The clip has an...
6094350 Feedforward amplifier manufacturing module  
A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem,...
6091604 Power module for a frequency converter  
Power module for a current converter, particularly a frequency converter, having at least one printed circuit board equipped at least with power components and having a heat-conducting connection...
6091603 Customizable lid for improved thermal performance of modules using flip chips  
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the...
6088228 Protective enclosure for a multi-chip module  
A heat dissipating element, positioned inside a protective cover, removes heat from the vicinity of a multi-chip module comprising active semiconductor devices attached to a printed circuit board....
6088226 Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink  
The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body...
6084775 Heatsink and package structures with fusible release layer  
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC...
6078499 Spring loaded heat pipe connector for hinged apparatus package  
An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on...
6075701 Electronic structure having an embedded pyrolytic graphite heat sink material  
An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite...
6075700 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures  
A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB...
6069794 Bushing for combining fan and heat sink  
A bushing for combining a fan and heat sink avoids a rack usually required in a conventional combination of fan and heat sink for CPU cooling, and thereby minimizes assembly height and forms a...
6067231 Heat-dissipating structure for an electrical device  
A heat-dissipating structure for an electrical device comprises a PC board with a dissipating opening, and an electrical device. The PC board has an upper surface thereof and a lower surface...
6064575 Circuit module assembly  
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or...
6061243 Modular and multifunctional structure  
6061240 Push pin assembly for heat sink for cooling electronic modules  
An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which...
6055159 Heat dissipating module for a heat generating electronic component  
A heat dissipating module is adapted for use with an electronic component on one side of a circuit board, and includes a heat sink having a contacting portion to be brought into contact with the...
6055158 Electronic component heat sink assembly  
An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a...
6049973 Method of assembling an integrated computer module  
The invention is a method of assembling an integrated computer by successively placing various components into an open-top weldment or "tub." The assembly method is particularly suited to rapidly...
6049460 Trigger actuated control having supplemental heat sink  
A heat sink is slideably attached to a housing of an electronic control, retained by complemental snap-in elements and has a projection extending through a wall of the housing into abutting thermal...
6049457 Device for fastening a heat dissipator to a central process unit  
A device which can effectively fasten a heat dissipator to a CPU by a simple operation is disclosed. The device includes a pair of fasteners respectively received in a corresponding channel defined...
6046907 Heat conductor  
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel...
6046906 Vent chimney heat sink design for an electrical assembly  
An electronic assembly which includes a heat sink. The assembly includes first and second integrated circuit packages that are mounted to a substrate. The heat sink may be in direct thermal contact...
6045927 Composite material for electronic part and method of producing same  
There is disclosed a composite material for an electronic part which has high thermal conductivity in a laminated direction, and also has low-thermal expansion characteristics. The composite...
6043984 Electrical assembly that includes a heat sink which is attached to a substrate by a clip  
An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped...
6040984 Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels  
High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding...
6037066 Functionally gradient material and method for producing the same  
A functionally gradient material having desired characteristics without having any joining section is efficiently obtained by means of integration effected by a sintering treatment, the...
6035524 Method for fabricating an electronics board with thermal-conduction cooling  
Method for fabricating thermally cooled electronic cards. A card of any kind is covered with a rigid heat sink shaped to fit the card and is attached thereto. The heat sink is formed in such a way...
6034874 Electronic device with heat radiating member  
The electronic device of the present invention includes a printed wiring board having wiring patterns, a heat generating component connected to the wiring patterns, a heat radiating member formed...
6031727 Printed circuit board with integrated heat sink  
According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred...
6026888 Molded heat exchanger structure for portable computer  
In a portable notebook computer a specially designed heat pipe-based heat exchanger assembly is used to efficiently dissipate heat from a processor board in the computer's base housing to ambient...
6025991 Electronic apparatus having heat dissipating arrangement  
An electronic apparatus is provided to efficiently dissipate the heat generated by a heat generating electronic component. The electronic apparatus comprises a framework formed of a metal sheet to...
6011216 Heat-generating element cooling device  
A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a...
6008991 Electronic system including packaged integrated circuits with heat spreading standoff support members  
An electronic system such as a Board-Level-Product (BLP) includes at least one integrated circuit device which is mounted on a circuit board. Each integrated circuit device includes a thin...
Matches 451 - 500 out of 750 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >