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7623349 |
Thermal management apparatus and method for a circuit substrate
The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a...
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7613002 |
Heat dissipation device
A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output...
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7609513 |
Portable electronic device
A portable electronic device includes a cover ( 10 ), a container ( 20 ) and a heater ( 40 ). The container is provided on the cover. The heater includes some exothermic materials. The heater is...
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7593229 |
Heat exchange enhancement
A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively....
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7589969 |
Folding protective cover for heat-conductive medium
A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a...
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7576988 |
Electronic device
An electronic device is described, which comprises an envelope comprising a closed chamber and a printed-circuit board. The printed-circuit board is positioned in the chamber and defines a...
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7535715 |
Conformable interface materials for improving thermal contacts
A conformable paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle is disclosed. The paste is useful as an interface material for improving the thermal contact...
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7532475 |
Semiconductor chip assembly with flexible metal cantilevers
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and...
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7515420 |
Apparatus for transferring heat between two corner surfaces
An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a...
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7505270 |
Display module
A display module, used for, e.g., a plasma display panel, is disclosed. In one embodiment, the display module includes a display panel, a drive circuit board driving the display panel, and a...
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7499274 |
Method, apparatus and system for enclosure enhancement
In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the...
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7492594 |
Electronic circuit modules cooling
A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced...
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7489509 |
Thermally insulated cabinet and method for inhibiting heat transfer
One embodiment of an cabinet according to the present invention comprises an inner cabinet having a plurality of inner walls that form an enclosure. A phase change material covers at least some of...
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7480145 |
Thin, passive cooling system
A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power...
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7463486 |
Transpiration cooling for passive cooled ultra mobile personal computer
In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit...
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7443685 |
Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly
An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the...
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7440280 |
Heat exchange enhancement
A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces...
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7436669 |
3D multi-layer heat conduction diffusion plate
A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can...
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7433187 |
Heat spreader module
A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second...
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7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking
Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling...
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7385812 |
Method and apparatus for a thermally conductive packaging technique for cooling electronic systems
A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal...
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7382620 |
Method and apparatus for optimizing heat transfer with electronic components
A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be...
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7369411 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03°...
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7365988 |
Cycling LED heat spreader
A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at...
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7365983 |
Grease protecting apparatus for heat sink
A grease protecting apparatus ( 10 ) includes a heat sink ( 12 ) defining a plurality of receiving cavities ( 124 ) therein, a layer of grease ( 16 ) spread on a surface ( 122 ) of the heat sink,...
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7362588 |
Flying capacitor type battery voltage detector
In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front...
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7362577 |
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one...
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7355853 |
Module structure and module comprising it
A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic...
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7355849 |
Non-metal mesh cover for metal chassis
The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure...
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7352584 |
Diamond-like carbon coated devices
Thermally dynamic housings and methods of utilizing and manufacturing such housings are disclosed and described. In one embodiment, a thermally dynamic housing is provided which encloses and cools...
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7324343 |
Thermally conductive holder
The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive...
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7319592 |
Recyclable protective cover for a heat-conductive medium
A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the...
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7312996 |
Heat sink for memory strips
A heat sink for memory strips comprises two heat transfer plates respectively attached on two sides of a memory strip. The upper edges of the heat transfer plates are further provided with...
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7312985 |
Cooler of notebook personal computer and fabrication method thereof
Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated...
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7295438 |
Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a...
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7280359 |
Heat-radiating structure of electronic apparatus
In a heat-radiating structure HRS 1 in which heat generated in a heat-generating component built in a housing of an electronic apparatus is conducted to the outside, the central portion of a...
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7279787 |
Microelectronic complex having clustered conductive members
A microelectronic complex including a body of semi-conductor material containing an integrated circuit, and a plurality of contact pads on the body for receiving signal conducting members for...
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7251140 |
Display apparatus having heat dissipating structure for driver integrated circuit
A display apparatus dissipates heat efficiently from a tape carrier package driver integrated circuit providing an address voltage to a display panel. The display apparatus includes a display...
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7230829 |
Overmolded electronic assembly with insert molded heat sinks
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material....
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7215545 |
Liquid cooled diamond bearing heat sink
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an...
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7190585 |
Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance
A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between...
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7177155 |
Semiconductor package with heat sink
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes...
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7161809 |
Integral heat spreader
A thermal solution for equipment containing a heat-generating component, which is positioned between the heat-generating component and an external surface of the equipment, where the thermal...
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7068514 |
Protection structure for thermal conducting medium of heat dissipation device
A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The...
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7068511 |
High-density architecture for a microelectronic complex on a planar body
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment...
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7061119 |
Tape attachment chip-on-board assemblies
An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a...
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7057896 |
Power module and production method thereof
A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic...
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7027304 |
Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive...
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