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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7532481 |
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate...
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7447032 |
Heat spreader module and method of manufacturing same
A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip...
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7394665 |
LSI package provided with interface module and method of mounting the same
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal...
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7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
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7295438 |
Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a...
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7254031 |
Display apparatus having heat dissipating structure for driver integrated circuit
A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma...
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7215545 |
Liquid cooled diamond bearing heat sink
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an...
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7172711 |
Interface materials and methods of production and use thereof
An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the...
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7094459 |
Method for cooling electronic components and thermally conductive sheet for use therewith
A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing...
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6819562 |
Cooling apparatus for stacked components
A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit...
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6788540 |
Optical transceiver cage
The present invention relates to a cage for holding an optical transceiver module in electrical contact with a host circuit board. The cage includes front, middle and rear sections, and facilitates...
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6783692 |
Heat softening thermally conductive compositions and methods for their preparation
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in...
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6778398 |
Thermal-conductive substrate package
A substrate material for mounting an integrated circuit contains a non-electrically-conductive mesh of thermally-conductive material. Because the mesh is electrically-non-conductive, it can...
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6768642 |
VME circuit host card with triple mezzanine configuration
A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field...
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6751098 |
Heat sink for a radiographic sensor device
A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes...
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6696197 |
Battery pack and portable electronic appliance
Disclosed is a battery pack, comprising a secondary battery unit including at least one secondary battery, the at least one secondary battery comprising an electrode group and an insulating case...
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6625027 |
Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual...
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6597574 |
Radiator plate and process for manufacturing the same
A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and...
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6542371 |
High thermal conductivity heat transfer pad
A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.
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6529379 |
Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.
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6428886 |
Method for attenuating thermal sensation when handling objects at non-body temperature
A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a...
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6399209 |
Integrated release films for phase-change interfaces
A thermally conductive conformable interface pad for inter-position between a heat generating solid state electronic device and a heat sinking surface. The interface comprises a laminate of at...
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6396701 |
Semiconductor unit and cooling device
A semiconductor unit is provided, which includes a substrate, a plurality of semiconductor components loaded on the substrate, and a cooling device provided above the semiconductor components. A...
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6385047 |
U-shaped heat sink assembly
A net-shape moldable U-shaped heat sink assembly formed by injection molding of a thermally conductive polymer composite material is shown. The heat sink assembly includes a base member with a...
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6313996 |
Heat radiation system for electric circuitry
A solid heat circuit comprises an adhesive elastic body (4) that has a stronger tendency to conduct heat than the air, contacts with both an electrically conductive solid heat source body (20, 21a,...
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6246583 |
Method and apparatus for removing heat from a semiconductor device
An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally...
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6222741 |
Mounting arrangement for microwave power amplifier
A thin, compliant, electrically and thermally conductive aluminum shim for providing minimum distance circuit path from a power amplifier (or transistor) to the underside of the circuit board...
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6215661 |
Heat spreader
An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat...
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6208519 |
Thermally enhanced semiconductor package
A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts...
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6175497 |
Thermal vias-provided cavity-down IC package structure
A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive...
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6108205 |
Means and method for mounting electronics
The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly...
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6091603 |
Customizable lid for improved thermal performance of modules using flip chips
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the...
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6084775 |
Heatsink and package structures with fusible release layer
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC...
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6075701 |
Electronic structure having an embedded pyrolytic graphite heat sink material
An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite...
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6046907 |
Heat conductor
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel...
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6025992 |
Integrated heat exchanger for memory module
A circuit card unit comprising a memory card and attached heat exchanger comprising a thin, flexible, laminated strip of foil clad plastic, or wire mesh, affixed in thermally conductive contact to...
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5991155 |
Heat sink assembly including flexible heat spreader sheet
In a heat sink, a portable electronic apparatus using this heat sink, and a method for forming this heat sink, an abutting member is arranged on an inside surface of a casing and the casing and the...
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5973923 |
Packaging power converters
A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some...
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5953210 |
Reworkable circuit board assembly including a reworkable flip chip
A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly...
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5931222 |
Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond...
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5896271 |
Integrated circuit with a chip on dot and a heat sink
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal...
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5880933 |
Heat sinking module cover
A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical...
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5781412 |
Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween....
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5687062 |
High-thermal conductivity circuit board
A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base...
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5617292 |
Two piece clip for heat dissipating assemblies
A two piece spring clip for holding a heat dissipating assembly together. The spring clip includes an elongated leaf spring member having a free end and a leg segment remote from the free end, and...
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5528457 |
Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as...
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5432380 |
Apparatus for tape-mounting a semiconductor device
An LOC type semiconductor package and a fabricating method thereof comprises first and second through holes formed at inner leads and bus bars of the LOC-type lead frame, and third through holes...
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5395679 |
Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate...
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5381304 |
Reworkable encapsulated electronic assembly and method of making same
An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the...
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