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7609513 |
Portable electronic device
A portable electronic device includes a cover ( 10 ), a container ( 20 ) and a heater ( 40 ). The container is provided on the cover. The heater includes some exothermic materials. The heater is...
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7609477 |
Dish array apparatus with improved heat energy transfer
In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable...
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7593229 |
Heat exchange enhancement
A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively....
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7589969 |
Folding protective cover for heat-conductive medium
A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a...
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7576985 |
Rapid cooling of exhaust from arc resistant electrical equipment
A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an...
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7554807 |
Heat sink having protective device for thermal interface material spread thereon
A protective device ( 10 ) comprises a cap ( 100 ) and a strap ( 120 ) connecting with the cap ( 100 ). The cap ( 100 ) defines a cavity ( 102 ) which is adapted for accommodating thermal interface...
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7535715 |
Conformable interface materials for improving thermal contacts
A conformable paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle is disclosed. The paste is useful as an interface material for improving the thermal contact...
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7518874 |
Heat sink assembly
A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of...
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7489512 |
Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is...
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7486517 |
Hand-held portable electronic device having a heat spreader
A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat...
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7477520 |
Memory module
In a memory module, a plurality of semiconductor memory packages are arranged and mounted on a module board, and a control semiconductor package is disposed in a central region of the arrangement...
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7467457 |
Method of coupling a device to a mating part
A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the...
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7463486 |
Transpiration cooling for passive cooled ultra mobile personal computer
In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit...
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7447032 |
Heat spreader module and method of manufacturing same
A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip...
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7441593 |
Protective cover for heat-conductive material of heat sink
A protective cover for protecting heat-conductive material of a heat sink includes a first plate with an opening to enclose the heat-conductive material and a second plate foldable to the first...
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7440280 |
Heat exchange enhancement
A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces...
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7436669 |
3D multi-layer heat conduction diffusion plate
A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can...
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7431072 |
Heat sink with increased cooling capacity and semiconductor device comprising the heat sink
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor...
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7417078 |
Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic...
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7385821 |
Cooling method for ICS
The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a...
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7385812 |
Method and apparatus for a thermally conductive packaging technique for cooling electronic systems
A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal...
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7382620 |
Method and apparatus for optimizing heat transfer with electronic components
A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be...
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7362580 |
Electronic assembly having an indium wetting layer on a thermally conductive body
Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit...
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7362577 |
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one...
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7330354 |
Mobile terminal device and method for radiating heat therefrom
In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on...
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7329948 |
Microelectronic devices and methods
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials...
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7319592 |
Recyclable protective cover for a heat-conductive medium
A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the...
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7292440 |
Heat dissipating sheet and plasma display device including the same
A plasma display device entirely distributes the temperature of a heat generator, and improves the detachability of a heat dissipating sheet and coherence with the heat generator. The plasma...
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7280359 |
Heat-radiating structure of electronic apparatus
In a heat-radiating structure HRS 1 in which heat generated in a heat-generating component built in a housing of an electronic apparatus is conducted to the outside, the central portion of a...
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7262966 |
Heat sink modules for light and thin electronic equipment
A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting...
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7254033 |
Method and apparatus for heat dissipation
Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
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7254031 |
Display apparatus having heat dissipating structure for driver integrated circuit
A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma...
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7219721 |
Heat sink having high efficiency cooling capacity and semiconductor device comprising it
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor...
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7219421 |
Method of a coating heat spreader
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally...
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7215545 |
Liquid cooled diamond bearing heat sink
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an...
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7180745 |
Flip chip heat sink package and method
An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors...
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7172711 |
Interface materials and methods of production and use thereof
An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the...
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7164585 |
Thermal interface apparatus, systems, and methods
An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the...
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7123482 |
Levers for support of heatsink component
An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.
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7116552 |
Heat-dissipation apparatus of portable computer
A heat-dissipation apparatus of the portable computer is fabricated in a host and a display unit pivotal connected therein for dissipating the heat from the electronic component. The apparatus has...
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7068514 |
Protection structure for thermal conducting medium of heat dissipation device
A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The...
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7068512 |
Heat dissipation device incorporating with protective cover
A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom...
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7063136 |
Heat dissipation device having cap for protecting thermal interface material thereon
A heat dissipation device includes a heat sink ( 10 ), thermal interface material ( 30 ) spread on a bottom surface ( 16 ) of the heat sink, two legs ( 22 ) of a clip ( 20 ) disposed at opposite...
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7051790 |
Protect cover for a radiator
A protect cover for a radiator is utilized to protect thermal grease coated at the bottom of the radiator. The protect cover has a cover body with a bottom and lateral sides. Further, the cover...
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7025129 |
Adhesive to attach a cooling device to a thermal interface
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area...
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7023699 |
Liquid cooled metal thermal stack for high-power dies
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an...
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7006354 |
Heat radiating structure for electronic device
A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is...
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7004244 |
Thermal interface wafer and method of making and using the same
A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally...
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6992893 |
Heat sink attachment
An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.
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