Matches 201 - 250 out of 314 < 1 2 3 4 5 6 7 >
Match Document Document Title
5587882 Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate  
A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a...
5581443 Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure  
A portable electronic apparatus comprising a housing having a bottom, a metal frame provided in the housing, a circuit board supported by the frame, and an IC chip secured to the circuit board. The...
5548481 Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population  
An electronic module containing a heat sink member, a flexible printed circuit board with electrical components mounted on both sides, and a protective cover. The heat sink member has an external...
5532512 Direct stacked and flip chip power semiconductor device structures  
Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as...
5518758 Arrangement for the conduction away of heat and a process for the production thereof  
A heat diffuser for conducting heat away from a heat generating assembly. The heat diffuser is composed of a heat-conducting polymeric material. The heat diffuser is formed by dispensing strips of...
5508885 IC card having improved heat dissipation  
An IC card includes a ground pattern of high heat conductivity disposed between a substrate and a mounted element, such as a semiconductor element, and in contact with the mounted element. Heat...
5506753 Method and apparatus for a stress relieved electronic module  
A fabrication method and resultant electronic module that facilitates relief of thermally induced stress within the module. The fabrication method includes providing a plurality of integrated...
5468909 Insulating part with improved heat transfer element  
An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also...
5467251 Printed circuit boards and heat sink structures  
Printed circuit board and heat sink assembly in which heat conductive elements are provided to distribute heat across the board before transferring heat into the heat sink. Also in other...
5465192 Cooling apparatus for integrated circuit chips for preventing forcible contact between a cooling member and the chips  
A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect the pressure exerted by the cooling apparatus on the chip. A block is provided with a plurality of...
5459352 Integrated circuit package having a liquid metal-aluminum/copper joint  
An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a...
5457603 Arrangement for cooling electronic equipment by radiation transfer  
An arrangement for cooling electronic equipment in a space by using radiation transfer, wherein the equipment includes heat-emitting electronic components mounted on a circuit board or the like....
5444602 An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame  
An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a...
5440172 Integral heat sink interface  
An apparatus comprises a thermal energy generating device and a thermal energy dissipating device having a reduced thermal resistance of the interface between the two. The reduction is achieved by...
5432675 Multi-chip module having thermal contacts  
A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered...
5430611 Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate  
A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A...
5422788 Technique for enhancing adhesion capability of heat spreaders in molded packages  
Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The...
5420753 Structure for cooling an integrated circuit  
In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which...
5410449 Heatsink conductor solder pad  
A method is provided for improving the integrity of a solder joint between a large surface-mounted integrated circuit component and a circuit board substrate. In particular, the strength of the...
5396403 Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate  
A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a...
5394299 Topology matched conduction cooling module  
The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the...
5388027 Electronic circuit assembly with improved heatsinking  
An electronic circuit assembly with improved heatsinking is provided. The assembly includes a component carrying board (56) which has an opening (62) through it. The opening is sized to receive a...
5384687 Cooling structure for electronic circuit package  
A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle...
5355280 Connection arrangement with PC board  
A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with...
5315480 Conformal heat sink for electronic module  
A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are...
5297618 Apparatus for removing a heatsink from an electronic module or package  
A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the...
5296739 Circuit arrangement with a cooling member  
The circuit arrangement comprises a mounting plate carrying at least one preferably chip-form component and contact surfaces electrically conductively connected to the component by connecting...
5291371 Thermal joint  
A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of...
5276586 Bonding structure of thermal conductive members for a multi-chip module  
A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of...
5247426 Semiconductor heat removal apparatus with non-uniform conductance  
An apparatus for removing heat from a semiconductor is disclosed. The apparatus is a non-uniform thermal conductance structure which includes high thermal conductance regions and low thermal...
5247203 Semiconductor device mounted on a heat sink with an intervening amorphous semiconductor material  
A semiconductor device having a semiconductor element and a heat sink radiating heat generated by the semiconductor element includes an amorphous semiconductor film disposed on the heat sink and...
5224356 Method of using thermal energy absorbing and conducting potting materials  
A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material....
5175668 Circuit board for a component requiring heat sinkage  
A circuit board (2) for receiving a component (38) requiring heat sinkage. The circuit board has a base portion (4) and a heat sink form portion (6) integral with the base portion. The heat sink...
5168926 Heat sink design integrating interface material  
A method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a...
5166864 Protected circuit card assembly and process  
Printed wiring board with components thereon is enclosed with a dielectric conformal coating over the printed wiring and the components. Enclosure includes a metal layer over the conformal coating...
5146981 Substrate to heatsink interface apparatus and method  
A cooling apparatus for a substrate with heat generating circuit devices mounted on a first side thereof. A second side of the substrate is coated with a first layer made of a releasing agent. A...
5124884 Electronic part mounting board and method of manufacturing the same  
An electronic component mounting board includes a substrate having an electronic component mounting opening formed in an upper surface thereof and a recess provided on a rear surface thereof larger...
5113315 Heat-conductive metal ceramic composite material panel system for improved heat dissipation  
For use as a substrate for a heat generating microelectronic integrated circuit, a ceramic panel is provided having small thickness in comparison to its length and breadth, having on at least the...
5109317 Mounting mechanism for mounting heat sink on multi-chip module  
A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched...
5109320 System for connecting integrated circuit dies to a printed wiring board  
Both a system and a method are provided for electrically and mechanically connecting at least one integrated circuit die to a solderless printed wiring board of the type which uses connecting...
5099396 Electronic circuit configured for indicator case  
A electronic circuit for an automobile, in particular in an instrument cluster, is disclosed. The electronic circuit comprises a computer having at least one microprocessor and application-specific...
5090918 Isothermal termination block having a multi-layer thermal conductor  
An isothermal block has a multi-layer thermal conductor interleaves with different layers of a printed circuit board to provide improved thermal coupling of input terminals and a local temperature...
5089936 Semiconductor module  
In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling...
5079672 Electrical switching and control apparatus  
An electrical switching and control device comprising a plurality of heat-emitting electronic components arranged on a hybrid plate, and a plurality of plug-in contacts having surface areas...
5065281 Molded integrated circuit package incorporating heat sink  
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink...
5065280 Flex interconnect module  
An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible...
5045971 Electronic device housing with temperature management functions  
The electronic device housing employs unique temperature management functions. Thermally sensitive electronic components are thermally isolated from the environment and from temperature generating...
5043845 High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact  
The present image sensor mounting system is particularly adapted to the mounting of a linear sensor array, of the type having a transparent window on a front surface and a thermal and electrically...
5034257 Multilayer systems and their method of production  
A method of producing a multilayer system comprising the steps of: 1. adhering a continuous cohesive pattern of electrically conductive oxidizable material (e.g. copper) to an electrically...
5024264 Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit  
A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat...
Matches 201 - 250 out of 314 < 1 2 3 4 5 6 7 >