Matches 151 - 200 out of 314 < 1 2 3 4 5 6 7 >
Match Document Document Title
6091603 Customizable lid for improved thermal performance of modules using flip chips  
Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the...
6084775 Heatsink and package structures with fusible release layer  
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC...
6081428 Cooling apparatus for electric devices  
A cooling apparatus for cooling a plurality of electric devices mounted on a printed circuit board with high cooling efficiency and low cost. The cooling apparatus includes a cooling plate for...
6081426 Semiconductor package having a heat slug  
A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor...
6073684 Clad casting for laptop computers and the like  
Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has...
6075701 Electronic structure having an embedded pyrolytic graphite heat sink material  
An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite...
6067232 System for connecting subsystems of dissimilar thermal properties  
A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated...
6058015 Electronic packages and a method to improve thermal performance of electronic packages  
An electronic package incorporating a heat-generating element which is thermally coupled to a heat-sinking member, through the utilization of a predetermined thermally conductive material, and...
6058013 Molded housing with integral heatsink  
A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall...
6049458 Protective cap for thermal grease of heat sink  
A heat sink for dissipating heat generated by a CPU, includes a metallic base, a number of heat dissipating fins projecting from the base, thermal grease spread on the base, and a protective cap...
6046907 Heat conductor  
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel...
6037658 Electronic package with heat transfer means  
An electronic package including as part thereof a thermally conductive arrangement for restricting thermal fluid material motion about a heat-generating device, thereby assuring effective heat...
6029740 Protective cap for heat conducting medium  
A protective cap comprises a cap portion and a mounting bracket attached to the cap portion along its peripheral walls. The mounting bracket includes upper and lower bars connected to opposite...
6016006 Thermal grease insertion and retention  
An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The...
6011692 Chip supporting element  
A chip support element includes a ductile foil of electrically and thermally conducting material having a stabilizing frame around the site where at least one chip is to be fixed to the foil.
6008537 Semiconductor device with heat dissipation metal layer and metal projections  
A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second...
5991155 Heat sink assembly including flexible heat spreader sheet  
In a heat sink, a portable electronic apparatus using this heat sink, and a method for forming this heat sink, an abutting member is arranged on an inside surface of a casing and the casing and the...
5975201 Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures  
Polymer matrix composites have a through-thickness-thermal conductivity whose value is realized in applications such as composite spaceborne electronics enclosures where heat dissipation is...
5973923 Packaging power converters  
A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some...
5969944 Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling  
A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the...
5953210 Reworkable circuit board assembly including a reworkable flip chip  
A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly...
5943213 Three-dimensional electronic module  
The invention discloses a three-dimensional module with the use of volume unpackaged and film electronic components. Between the independent electronic components comprising IC chips and the...
5936838 MPC module with exposed C4 die and removal thermal plate design  
An electronic assembly which has a ring that creates a dam for a thermal grease. The assembly may include an integrated circuit which is mounted to a substrate. The assembly may also include a...
5926944 Method of constructing a shielded electrical component  
An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a...
5926373 Encapsulated, board-mountable power supply and method of manufacture  
A power supply and a method of manufacture therefor. The power supply includes: (1) a circuit board containing conductors for interconnecting electrical components of the power supply, (2) a...
5917704 Laser-solderable electronic component  
There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20....
5912803 Heat dissipating box  
The present invention relates to a heat dissipating box for a printed board assembly (PBA) using natural convection for cooling. The PBA 64 is fastened between a first part 62 and a second part 61...
5912805 Thermal interface with adhesive  
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally...
5907474 Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package  
A low-profile heat transfer apparatus is presented for a surface-mounted semiconductor device employing a ball grid array (BGA) device package having a chip mounted upon a substantially flat upper...
5898571 Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages  
An encapsulated semiconductor package assembly including a substrate, a die operatively disposed on the substrate, a lid for support by the substrate over the die, a heat sink operatively on the...
5892657 Electronic-circuit assembly and its manufacturing method  
An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is...
5825625 Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink  
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is...
5821612 Heat radiative electronic component  
An electronic component provided with a heat radiative ceramic plate that is protected from cracks. Such a heat radiative electronic component is composed of an electronic device, such as a...
5808870 Plastic pin grid array package  
A plastic pin support of a plastic PGA package is used to hold conductor pins in alignment, for electrical contact, with a printed circuit board and a socket. The printed circuit board is mounted...
5796049 Electronics mounting plate with heat exchanger and method for manufacturing same  
A combined electronics mounting plate and heat exchanger and method of manufacturing same. The present invention provides an electronics mounting plate formed from a metal matrix composite and a...
5793612 Heat sink structure for fast network hubs  
The genus of apparatus according to the teachings of the invention is characterized by use of a heat conducting elastomer which is compressed between an integrated circuit and a surface of a...
5781412 Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size  
Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween....
5777847 Multichip module having a cover wtih support pillar  
A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the...
5766691 Process for manufacturing a high heat density transfer device  
Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving...
5757620 Apparatus for cooling of chips using blind holes with customized depth  
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides...
5754401 Pressure compliantly protected heatsink for an electronic device  
A heatsink is pressure compliantly mounted against a substrate-mounted packaged electronic device such that the heatsink is not readily dislodged from the device package. A layer of...
5744863 Chip carrier modules with heat sinks attached by flexible-epoxy  
An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or...
5726858 Shielded electrical component heat sink apparatus  
An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a...
5724729 Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials  
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention...
5706171 Flat plate cooling using a thermal paste retainer  
Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or...
5666270 Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode  
A bump electrode includes a core portion provided on an intermediate electrode layer formed on an electrode pad formed on a surface of an element. The core portion contains a material having a...
5650915 Thermally enhanced molded cavity package having a parallel lid  
The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the...
5623394 Apparatus for cooling of chips using a plurality of customized thermally conductive materials  
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention...
5607538 Method of manufacturing a circuit assembly  
A method of manufacturing a circuit assembly is provided. The circuit assembly (10) manufactured according to the present invention includes a circuit board (12) and a heat sink (22). The circuit...
5604978 Method for cooling of chips using a plurality of materials  
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention...
Matches 151 - 200 out of 314 < 1 2 3 4 5 6 7 >