Matches 101 - 150 out of 314 < 1 2 3 4 5 6 7 >
Match Document Document Title
6525942 Heat dissipation ball grid array package  
A heat dissipation ball grid array package includes the following elements. A plurality of first thermal ball pads is formed on the underside of a substrate in the area covered by chip. A plurality...
6523362 Support for components used in microsystems technology  
A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to...
6522543 IC heat radiation structure and display device  
A first heat-conductive rubber is disposed on a surface of a printed wiring film, which is an opposite side to a driver IC, a second heat-conductive rubber is disposed on a surface of the driver...
6496373 Compressible thermally-conductive interface  
A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one...
6493228 Heat radiation packaging structure for an electric part and packaging method thereof  
A heat radiation packaging structure without getting a board itself larger, but with an excellent heat radiation ability and a low cost is provided. A bus bar 12 is fixed onto a wiring board 11...
6484708 Resin sealed electronic device  
Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board. A power element of which the...
6480385 Electronic assembly and cooling thereof  
An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that...
6466438 Generic external portable cooling device for computers  
A device for assisting the cooling of computers, especially laptop computers, provides material having an upper surface distributed over at least two levels, preferably a corrugated surface,...
6462410 Integrated circuit component temperature gradient reducer  
An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled...
6449158 Method and apparatus for securing an electronic power device to a heat spreader  
An electronic control module 100 is provided wherein a power device 102 is secured to a rigidizer, or heat spreader, 110 such that a thermally conductive path is created for a conduction of...
6434006 Semiconductor device having heat radiating member  
A semiconductor device has a case, a printed circuit board, a fin, and a ceramic substrate mounting a semiconductor element thereon. The case contains the printed circuit board, the ceramic...
6428886 Method for attenuating thermal sensation when handling objects at non-body temperature  
A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a...
6396700 Thermal spreader and interface assembly for heat generating component of an electronic device  
A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the...
6392890 Method and device for heat dissipation in an electronics system  
The invention relates to a method and a device for creating a thermally conductive path between a component of a printed circuit board and a heat sink using a electrical insulator material and a...
6385049 Multi-board BGA package  
A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a...
6377219 Composite molded antenna assembly  
A net-shape molded composite heat exchanger is provided which includes a plurality of thermally conductive fins overmolded onto one end of a metallic heat pipe for use both as an antenna in a...
6358595 Portable electrical apparatus with metal case having thermal insulation  
The object of the invention is to produce a surface layer that can prevent from uncomfortable sensation upon manual handling of component such as metal chassis used in electronic devices. The...
6351386 Component shim for mounting a component on a heat spreader  
A component shim 310 is used with printed circuit boards 306 and heat spreaders 314 , for example, where each of the printed circuit board 300 and heat spreader 314 has a surface 304, 312...
6349465 Controlled bondline thickness attachment mechanism  
A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed...
6347661 Cooling/heating apparatus for semiconductor processing liquid  
In order to provide a cooling/heating apparatus for a semiconductor processing liquid being highly resistant to corrosive chemicals and free from elution of harmful impurities, a heat exchanging...
6347037 Semiconductor device and method of forming the same  
A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape...
6347038 Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp  
The assembly has a metal sole plate forming a heat sink carrying a printed circuit card. The sole plate includes bearing surfaces which project slightly beyond the rest of the sole plate. The...
6324055 Mobile information processing apparatus and covers for the mobile information processing apparatus and the desktop information processing apparatus  
A mobile information processing apparatus of the present invention having a main body and a display unit that opens and closes, attempts to improve heat releasing efficiency by allowing a transfer...
6324060 Heat transfer interface  
A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added...
6315038 Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device  
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area...
6313995 Cooling system of a printed board  
A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily...
6303209 Electrical apparatus having metal case with thermal insulation  
An electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing...
6292367 Thermally efficient semiconductor chip  
A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits...
6288900 Warpage compensating heat spreader  
A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into...
6285552 Rectifier of an alternating current generator for vehicle  
A heat sink of an alternating current generator for a vehicle has a heat sink body formed from aluminum die-cast. An insert member is provided on the heat sink body and a diode is provided on the...
6281575 Multi-chip module  
A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly...
6260611 Heat dissipation module  
A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the...
6225571 Heatsink with high thermal conductivity dielectric  
The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a...
6226183 Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement  
In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and,...
6222733 Device and method for cooling a planar inductor  
The invention relates to a device for cooling a planar inductance coil, in particular a planar transformer, on a plate-shaped support having a plurality of conducting layers, wherein at least one...
6219245 Electrically isolated power switching device mounting assembly for EMI reduction  
A power electronics chassis (10) and liquid-cooled heat sink mounting assembly for electric vehicles and other applications that use liquid coolant to cool power electronic devices (20) contained...
6215661 Heat spreader  
An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat...
6212073 Heat sink  
An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of...
6208519 Thermally enhanced semiconductor package  
A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts...
6205024 Heat sink for rectifier  
A heat sink for a rectifier comprises two heat sink plates, six nail connectors and six diodes. Six diodes are formed by with packaging six dice during the heat sink manufacturing process so that...
6195256 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink  
An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for...
6175497 Thermal vias-provided cavity-down IC package structure  
A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive...
6154366 Structures and processes for fabricating moisture resistant chip-on-flex packages  
A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a...
6125036 Moisture barrier seals for cooled IC chip module assemblies  
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.
6114048 Functionally graded metal substrates and process for making same  
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In...
6115255 Hybrid high-power integrated circuit  
The circuit comprises a dielectric board (1) metallized on both sides and comprising a topological metallization pattern (2) on the face side thereof and with at least one mounting pad (3) located...
6108205 Means and method for mounting electronics  
The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly...
6108208 Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules  
An electromechanical assembly, having a pressed joint with a low thermal resistance which is residue free when disassembled, includes: 1) an integrated circuit module having a contact surface of a...
6101092 Heat-dissipating structure of an electronic part  
A heat-dissipating structure in which a cylindrical projecting portion is formed in a shield case so as to project inwardly of the shield case and contact an electronic part encased in the shield...
6097602 Integrated circuit package heat sink attachment  
An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in...
Matches 101 - 150 out of 314 < 1 2 3 4 5 6 7 >