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7027299 |
Electronics assembly with arrangement for air cooling
An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the...
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7027303 |
Electronic power module
The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically...
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7023699 |
Liquid cooled metal thermal stack for high-power dies
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an...
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7023701 |
Device for cooling memory modules
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact...
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7021366 |
Heat dissipation apparatus and method
A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source...
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7023700 |
Heat sink riveted to memory module with upper slots and open bottom edge for air flow
A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while...
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7023694 |
Computer
A computer having a main casing to accommodate a plurality of hardware components such as a CPU, comprises a heat dissipating assembly which is disposed on the CPU, and includes a heat transmitter...
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7023702 |
Apparatus including circuit board and heat sink and method of making the apparatus
In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one...
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7021365 |
Component to heat sink spring clip method and apparatus
Disclosed is a spring clip apparatus for holding one or more heat generating components, such as field effect transistors (FETs) and diodes, firmly against a heat receiving side of a finned heat...
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7019979 |
Heat dissipating device having improved fastening structure
A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure...
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7018701 |
Thermally conductive sheet and method for manufacturing the same
A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 μg/cm 2 ...
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7019975 |
Power module and power module with heat sink
The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in...
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7019972 |
Apparatus for conditioning power and managing thermal energy in an electronic device
In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit...
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7019978 |
Heat dissipating device incorporating clip
A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat...
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7019977 |
Method of attaching non-adhesive thermal interface materials
Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The...
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7019976 |
Methods and apparatus for thermally coupling a heat sink to a circuit board component
A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying...
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7018054 |
Electro-optical device encased in mounting case, projection display apparatus, and mounting case
An electro-optical apparatus encased in the mounting case includes an electro-optical device in which the light emitted from a light source is incident on an image display region, and a mounting...
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7017258 |
Mounting system for high-mass heatsinks
A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard,...
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7013537 |
Detent means for a heat sink
The detent means for a heat sink has on each of the two ends of a pressing member a fixing engaging member and a movable engaging member, the movable engaging member is provided thereon with a...
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7016196 |
Radiating structural body of electronic part and radiating sheet used for the radiating structural body
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion...
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7013559 |
Method of fabricating a semiconductor device package
The present invention features a novel design for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions...
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7011144 |
System and method for cooling electronic assemblies
A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined...
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7012807 |
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed...
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7011147 |
Heat pipe type circular radiator with sector cooling fins
A heat pipe type circular radiator includes a plurality of sector cooling fins and a heat pipe. Each of the sector cooling fins has a main fin member with a through hole and has a big sector folded...
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7009843 |
Heat sink clip with pressing post
A heat sink clip ( 20 ) includes a main body, a post ( 26 ), and a spring ( 27 ). The main body includes a longitudinal portion ( 31 ), first and second locking arms ( 32, 24 ) extending downwardly...
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7009844 |
Wire form heat sink retention module
A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that...
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7006353 |
Apparatus and method for attaching a heat sink to an integrated circuit module
A heat sink is fastened to an annular portion of a substrate of an integrated circuit module on a printed circuit card by means of a cured layer of cure shrinkable adhesive. A circuit chip is...
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7003970 |
Power module and air conditioner
An efficient heat diffusing structure comprising a power module having a mounting substrate that has a high thermal conduction efficiency. The mounting substrate is comprised of a mounting surface...
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7003230 |
Coupling mechanism for an optical transceiver housing
An optical transceiver providing a carrier; a cover couplable to a portion of the carrier to define a transceiver enclosure; and, an electro-optical assembly supported in the enclosure is provided....
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7002803 |
Electronic product with heat radiating plate
An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame...
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7002795 |
Low noise heatsink
A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally...
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7000683 |
Heatsink device
A heatsink device includes a heat conducting interface, a press plate mounted on the heat conducting interface, and a plurality of heat conducting metal threads pressed between the heat conducting...
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7002805 |
Thermal enhance MCM package and manufacturing method thereof
A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The...
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7002804 |
Heat dissipating apparatus
A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is...
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7002799 |
External liquid loop heat exchanger for an electronic system
A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.
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7000687 |
Heat dissipating device
A heat dissipating device ( 1 ) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink ( 30 ) and at least one heat pipe ( 20 ). The heat sink...
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6997243 |
Wick structure of heat pipe
A composite wick structure of a heat pipe includes wick structure fabricated from a woven mesh and sintered powder. The woven mesh is attached to an internal sidewall of a tubular member, while the...
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6997244 |
Wick structure of heat pipe
A composite wick structure of a heat pipe which is applied with a tube circumferential surface contacted to a heat source includes a plurality of grooves and a sintered-powder layer. The grooves...
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6999318 |
Heatsinking electronic devices
Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board...
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6999317 |
Thermally enhanced electronic module with self-aligning heat sink
A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture...
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6995978 |
Housing with active external cooling and at least one electronic component with heat-dissipating capacity
An actively externally cooled housing with at least one electronic component having heat-dissipating capacity, has a ventilation inlet located outside the housing, the ventilation inlet generating...
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6992895 |
Heat controlled optoelectrical unit
The present invention relates to heat control and cooling of an optoelectrical unit, which converts between electrical and optical signal formats. The optoelectrical unit contains at least one...
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6992891 |
Metal ball attachment of heat dissipation devices
An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device...
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6992892 |
Method and apparatus for efficient temperature control using a contact volume
A substrate holder for supporting a substrate, including an exterior supporting surface, a cooling component, a heating component positioned adjacent to the supporting surface and between the...
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6992887 |
Liquid cooled semiconductor device
A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a...
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6992889 |
Retention module, heat sink and electronic device
It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided...
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6992888 |
Parallel cooling of heat source mounted on a heat sink by means of liquid coolant
A module includes a cold plate. Solid-state heat sources are thermally mounted on the cold plate in a chamber defined by the cold plate and a lid. Cooling of the heat sources is enhanced by a...
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6992893 |
Heat sink attachment
An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.
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6988871 |
Heat sink attachment clip
A heat sink attachment clip for attaching a heat sink assembly to a frame, the heat sink attachment clip includes a pair of attachment brackets. Each attachment bracket has one or more attachment...
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6989616 |
Motor
A circuit-container unit 22 has a structure in which a board 26 , electric components 27 constituting a drive control circuit 24 , a frame 28 made of synthetic resin, an insulating plate ...
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