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7067905 |
Packaged microelectronic devices including first and second casings
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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7068512 |
Heat dissipation device incorporating with protective cover
A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom...
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7068513 |
Fixing apparatus for mounting a heat sink to a printed circuit board
A fixing apparatus includes a retention module ( 10 ) and a back plate ( 30 ). The retention module is attached on a printed circuit board ( 20 ), which defines a plurality of through apertures (...
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7068510 |
Dissipating heat reliably in computer systems
A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the...
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7068511 |
High-density architecture for a microelectronic complex on a planar body
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment...
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7064952 |
Display device with detachable heat-sink structure thereof
A display device comprises a display panel, a back plate, a fixing plate, a flexible printed circuit board and a driving chip. The display panel has a peripheral circuit area. The back plate is...
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7061764 |
Heat sink clip with rotating CAM
A clip ( 10 ) includes a main body ( 20 ), a buckling piece ( 40 ), and a camming member ( 30 ). The main body includes a pressing part ( 22 ), a first leg ( 24 ) extending downwardly from one end...
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7057114 |
Circuit board with added impedance
A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component...
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7057896 |
Power module and production method thereof
A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic...
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7057897 |
Means for securing a cooling device
Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit....
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7057875 |
Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins...
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7055581 |
Impeller driven active heat sink
A heat transfer apparatus includes a heat source having a heat source maximum operating temperature; and a heat sink comprising a closed chamber having a chamber first end wall, a chamber second...
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7054158 |
Cooling body
The present invention relates to a heat sink ( 1 ) with a main body ( 2 ) for accommodating at least one electronic structural element ( 5 ), and with a spring element ( 3 ) for pressing the...
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7054159 |
Printed wiring board having heat radiating means and method of manufacturing the same
In the present invention, a printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting...
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7050303 |
Semiconductor module with vertically mounted semiconductor chip packages
A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a...
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7050304 |
Heat sink structure with embedded electronic components for semiconductor package
A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at...
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7050302 |
Captive socket actuator
Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of...
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7049510 |
Sensor
A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical, electromechanical and/or...
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7044195 |
Heat dissipation structure
A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a...
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7045890 |
Heat spreader and stiffener having a stiffener extension
A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.
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7044202 |
Cooler for electronic devices
A cooler for electronic devices provides cool air to the inlet sides of the heat sink by using a radial blower with blades located around air outlets of the heat sink. This blower is driven by a...
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7044197 |
Heat sink with combined fins
A heat sink ( 1 ) includes a heat-conductive base ( 20 ), and a plurality of combined fins ( 10 ) uprightly attached onto the base. Each fin includes a main body ( 12 ), and a flange ( 14 )...
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7040389 |
Integrated heat dissipation apparatus
An integrated heat dissipation apparatus includes a thermal conductor base and a heat sink interlocked with each other. The thermal conductor base has a channel formed in an upper portion thereof...
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7040388 |
Heat sink, method of manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
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7042727 |
Heat sink mounting and interface mechanism and method of assembling same
In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted...
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7042728 |
Clamping structure and heat dissipating module using same
A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom...
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7042730 |
Non-isolated heatsink(s) for power modules
A power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body.
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7038912 |
High-power switchgear with cooling rib arrangement
The high-power switch ( 1 ) according to the invention, with at least one switch pole ( 2 ) for guiding and switching an electric current which flows in one current flow direction when the switch...
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7036566 |
Heat dissipating module
A heat dissipating module is disclosed, which comprises a plurality of fins having same or different shapes, a plurality of heat dissipating tubes, and a seat. The fins are stacked one next to...
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7038919 |
IC socket having fastening mechanism for sensor
An IC socket ( 10 ) includes an insulative housing ( 12 ) mounted on a burn-in board, a plurality of conductive contacts ( 14 ) received in the housing. The housing defines a recessed area ( 120 )...
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7032305 |
Method for mounting integrated circuits on a printed circuit card
A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and...
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7035106 |
Heat dissipation system for semiconductor device
A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation...
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7032650 |
Cooling fin set
A cooling fin set, which is disposed on a heat source of a computer, includes a plurality of cooling fins. Each cooling fin includes some fastening portions formed thereon. The fastening portions...
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7030482 |
Method and apparatus for protecting a die ESD events
A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy...
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7031165 |
Electronic control unit
An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the...
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7031160 |
Magnetically enhanced convection heat sink
A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the...
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7031161 |
Cooling system for adjustable electric drive
The invention relates to a cooling arrangement for an adjustable electric drive. The arrangement is arranged to conduct heat generated in electric devices by means of a liquid flowing through the...
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7027304 |
Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive...
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7025122 |
Heat sink element coupling structure (2)
A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral...
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7027299 |
Electronics assembly with arrangement for air cooling
An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the...
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7027303 |
Electronic power module
The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically...
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7023699 |
Liquid cooled metal thermal stack for high-power dies
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an...
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7023701 |
Device for cooling memory modules
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact...
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7021366 |
Heat dissipation apparatus and method
A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source...
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7023700 |
Heat sink riveted to memory module with upper slots and open bottom edge for air flow
A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while...
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7023694 |
Computer
A computer having a main casing to accommodate a plurality of hardware components such as a CPU, comprises a heat dissipating assembly which is disposed on the CPU, and includes a heat transmitter...
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7023702 |
Apparatus including circuit board and heat sink and method of making the apparatus
In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one...
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7021365 |
Component to heat sink spring clip method and apparatus
Disclosed is a spring clip apparatus for holding one or more heat generating components, such as field effect transistors (FETs) and diodes, firmly against a heat receiving side of a finned heat...
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7019979 |
Heat dissipating device having improved fastening structure
A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure...
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7018701 |
Thermally conductive sheet and method for manufacturing the same
A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 μg/cm 2 ...
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