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7108055 |
Optimized heat sink using high thermal conducting base and low thermal conducting fins
An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite...
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7110258 |
Heat dissipating microdevice
A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first...
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7109589 |
Integrated circuit with substantially perpendicular wire bonds
An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for...
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7110257 |
Electronic apparatus including printed wiring board provided with heat generating component
An electronic apparatus includes a housing and a printed wiring board contained in the housing. The printed wiring board includes a first surface, a second surface and a conductive layer. The first...
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7110261 |
Heat dissipation assembly
A heat dissipation assembly of the present invention includes a printed circuit board ( 50 ), an electronic component ( 60 ) mounted on the printed circuit board, a heat dissipation device ( 70 )...
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7106592 |
Coolant cooled type semiconductor device
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are...
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7106591 |
Locking device for heat sink
A locking device, for locking a heat sink ( 30 ) to a socket ( 10 ) on which an electronic component ( 20 ) is mounted, includes a pair of clips ( 60 ) each having a handle ( 62 ) and a ring ( 66...
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7104311 |
Heat sink assembly
A heat sink assembly formed of a number of radiation fins arranged in a stack, each radiation fin having two mounting flanges arranged in parallel at two opposite sides, each mounting flange having...
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7106594 |
Simplified mounting configuration that applies pressure force to one central location
A heat transfer assembly comprising of an electronic component attached to an attachment point located on a circuit board and a clamping mechanism which applies a downward force against a block. In...
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7106593 |
Heat sink assembly for a potted housing
The present invention includes a heat sink assembly within a potted housing and a method for transferring heat within a potted housing. The heat sink assembly includes a bracket, a heat-containing...
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7102890 |
Heat sink retention device
The retention device comprises a clip and a back plate engaging the clip, the clip comprises pressing members for press the heat sink onto the processor and at least a pair of hooks, the back plate...
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7102889 |
Method and apparatus for attaching heat sink to a component with a flexible leaf spring mount
The apparatus and method may have the following: a spring element that pivots about a pivot axis; a flexible mount coupled to the spring element such that the pivot axis of the spring element is...
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7099157 |
Retaining and heat dissipating structure for electronic equipment
A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ),...
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7099153 |
Heat dissipating structure for an electronic device
A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of...
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7099155 |
Distribution unit and electric connection box including the same
A distribution unit has a power circuit section including a plurality of bus bars with electronic parts mounted on at least some of the bus bars. Ends of specific bus bars are projected from a main...
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7099156 |
Locking device for heat dissipating device
A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing...
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7095615 |
Environmentally tuned circuit card assembly and method for manufacturing the same
A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto....
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7095614 |
Electronic module assembly
Methods of engaging an electronic module interconnected to a circuit board to a heat sink using clamping assemblies that maintain integrities of an interconnection grid array and the electronic...
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7086458 |
Heat sink structure with flexible heat dissipation pad
A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module...
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7088983 |
Semiconductor device for radio communication device, and radio communication device using said semiconductor device
A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip...
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7087845 |
Metal core multilayer printed wiring board
The present invention is characterized in that in a metal-core multilayer printed wiring board ( 1 ) which is obtained by forming one or more of at least inner layers of a laminate having a...
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7088582 |
Heat-dissipating device
The present invention is to provide a heat-dissipating device comprising a sheet formed thereon with a plurality of first parts and a plurality of second parts, wherein any one of said second part...
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7086456 |
Combination of fan and heat sink
A combination of fan and heat sink includes a fan ( 10 ), a heat sink ( 20 ) and four fixtures ( 30 ). The fan defines four holes ( 12 ) in four corners thereof respectively. The heat sink has a...
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7088586 |
Techniques for cooling a circuit board component within an environment with little or no forced convection airflow
A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the...
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7085134 |
Dual fan heat sink
A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge...
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7085135 |
Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from...
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7083759 |
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a...
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7082032 |
Heat dissipation device with tilted fins
A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.
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7080989 |
Memory metal springs for heatsink attachments
An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board....
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7081691 |
Switching device for controlling large amount of current
A switching device for controlling a large amount of current includes a circuit board carrying electronic components thereon, a power-switching element electrically connected to the circuit board,...
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7082033 |
Removing heat from integrated circuit devices mounted on a support structure
A cover, acting as a heat sink for integrated circuit devices, encloses one or more devices mounted on a support structure. The thermally conductive cover is formed of a thermally conductive...
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7078622 |
IC socket assembly
Deformation of a socket housing during connection of an IC package is prevented, and reliable electrical connections are secured in an IC socket assembly. The IC socket assembly is constituted by a...
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7077526 |
Mechanically adjustable thermal path for projection display device cooling
A method and mechanism for cooling a display device, having an extremely bright light focused on its surface and is mounted inside a closed chassis, by conducting heat from the device directly to...
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7079396 |
Memory module cooling
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more...
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7078803 |
Integrated circuit heat dissipation system
An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation...
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7077188 |
Heat dissipating device with heat conductive tubes
A heat dissipating device with heat conductive tubes comprises a heat dissipating unit including a plurality of fins; a bottom edge of each fin having a plurality of concave portions; a seat; a...
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7075789 |
Mechanical housing
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case...
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7075790 |
Heat dissipating device incorporating clip
A heat dissipating device includes a heat sink ( 50 ) and two clips ( 10 ) for mounting the heat sink to a retention module ( 60 ) which surrounds an electronic component ( 65 ). The heat sink...
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7075179 |
System for implementing a configurable integrated circuit
The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC...
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7072184 |
Heat sink attachment
A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket...
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7072183 |
Locking device for heat dissipating device
A locking device ( 30 ) for mounting a heat sink ( 40 ) to a CPU ( 70 ), includes a supporting member ( 32 ), a pair of locking members ( 33 ) pivotably attached to the supporting member and each...
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7072182 |
Switching assembly
A switch assembly and method includes a heat sink with two switch modules coupled thereto. Both of the switch modules are used in switching operations to make use of the entire heat sink, providing...
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7072185 |
Electronic module for system board with pass-thru holes
Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with...
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7071555 |
Ball grid array package stack
Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and...
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7068514 |
Protection structure for thermal conducting medium of heat dissipation device
A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The...
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7067905 |
Packaged microelectronic devices including first and second casings
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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7068512 |
Heat dissipation device incorporating with protective cover
A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom...
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7068513 |
Fixing apparatus for mounting a heat sink to a printed circuit board
A fixing apparatus includes a retention module ( 10 ) and a back plate ( 30 ). The retention module is attached on a printed circuit board ( 20 ), which defines a plurality of through apertures (...
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7068510 |
Dissipating heat reliably in computer systems
A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the...
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7068511 |
High-density architecture for a microelectronic complex on a planar body
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment...
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